TWI328262B - - Google Patents

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Publication number
TWI328262B
TWI328262B TW93128023A TW93128023A TWI328262B TW I328262 B TWI328262 B TW I328262B TW 93128023 A TW93128023 A TW 93128023A TW 93128023 A TW93128023 A TW 93128023A TW I328262 B TWI328262 B TW I328262B
Authority
TW
Taiwan
Prior art keywords
resin
touch panel
hole
sealing
piezoelectric substrate
Prior art date
Application number
TW93128023A
Other languages
English (en)
Chinese (zh)
Other versions
TW200534411A (en
Inventor
Naomi Nakayama
Kazuo Imai
Isamu Saito
Yoshiaki Yamaguchi
Original Assignee
Smk Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smk Kk filed Critical Smk Kk
Publication of TW200534411A publication Critical patent/TW200534411A/zh
Application granted granted Critical
Publication of TWI328262B publication Critical patent/TWI328262B/zh

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  • Engineering & Computer Science (AREA)
  • Position Input By Displaying (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
TW93128023A 2004-04-06 2004-09-16 Method for sealing vibrating component with resin TW200534411A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004112500A JP2005297221A (ja) 2004-04-06 2004-04-06 振動部品の樹脂封止方法

Publications (2)

Publication Number Publication Date
TW200534411A TW200534411A (en) 2005-10-16
TWI328262B true TWI328262B (ja) 2010-08-01

Family

ID=35067608

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93128023A TW200534411A (en) 2004-04-06 2004-09-16 Method for sealing vibrating component with resin

Country Status (4)

Country Link
JP (1) JP2005297221A (ja)
KR (1) KR100576269B1 (ja)
CN (1) CN1681098A (ja)
TW (1) TW200534411A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102484465B (zh) * 2009-09-14 2015-04-08 株式会社村田制作所 晶体振荡装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0695594B2 (ja) * 1989-02-03 1994-11-24 日本レック株式会社 電気配線基板の表面実装に於ける電気部品の樹脂封止方法
JP3074340B2 (ja) * 1992-07-02 2000-08-07 トーワ株式会社 電子部品の樹脂封止成形方法及び金型
JP3631308B2 (ja) * 1995-10-25 2005-03-23 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法
JP2003100786A (ja) 2001-09-27 2003-04-04 Towa Corp 電子部品の樹脂封止成形方法及び金型

Also Published As

Publication number Publication date
TW200534411A (en) 2005-10-16
KR100576269B1 (ko) 2006-05-04
CN1681098A (zh) 2005-10-12
JP2005297221A (ja) 2005-10-27
KR20050098756A (ko) 2005-10-12

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees