JP5093355B2 - 水晶発振装置 - Google Patents
水晶発振装置 Download PDFInfo
- Publication number
- JP5093355B2 JP5093355B2 JP2010529174A JP2010529174A JP5093355B2 JP 5093355 B2 JP5093355 B2 JP 5093355B2 JP 2010529174 A JP2010529174 A JP 2010529174A JP 2010529174 A JP2010529174 A JP 2010529174A JP 5093355 B2 JP5093355 B2 JP 5093355B2
- Authority
- JP
- Japan
- Prior art keywords
- crystal
- sealed space
- support substrate
- pressure
- crystal oscillator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000013078 crystal Substances 0.000 title claims description 72
- 230000010355 oscillation Effects 0.000 claims description 54
- 239000000758 substrate Substances 0.000 claims description 44
- 239000010409 thin film Substances 0.000 claims description 33
- 238000007789 sealing Methods 0.000 claims description 27
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 239000012298 atmosphere Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000010453 quartz Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000000615 nonconductor Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052774 Proactinium Inorganic materials 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- -1 silane compound Chemical class 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
Description
図1は、本実施形態に係る水晶発振装置の略図的分解斜視図である。図2は、本実施形態に係る水晶発振装置の略図的断面図である。
図3は、第2の実施形態に係る水晶発振装置の略図的分解斜視図である。図4は、第2の実施形態に係る水晶発振装置の略図的断面図である。
図1または図3に示す構成の水晶発振子を作成し、封止空間内の圧力を種々変動させてドライブレベルと発振周波数変動量との関係を調べた。結果を、図5に示す。
10…支持基板
10a…配線電極
12…導電性接着剤層
13…接着剤層
14…絶縁層
15…封止部材
15a…封止空間
20…水晶発振子
21,23…電極
22…水晶基板
24a、24b…薄膜
Claims (4)
- 支持基板と、
水晶基板と、前記水晶基板に電圧を印加する一対の電極とを有し、前記支持基板上に搭載されている水晶発振子と、
前記支持基板と共に前記水晶発振子を封止する封止空間を形成するように、前記支持基板上に設けられている封止部材とを備え、
前記封止空間内の圧力は、60000Pa〜80000Paであり、
前記封止空間が、空気雰囲気である、水晶発振装置。 - 前記水晶発振子の表面を覆う薄膜が形成されている、請求項1に記載の水晶発振装置。
- 前記薄膜は、有機薄膜または無機薄膜である、請求項2に記載の水晶発振装置。
- 前記封止部材と前記支持基板とを接着している樹脂接着剤層をさらに備える、請求項1〜3のいずれか一項に記載の水晶発振装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010529174A JP5093355B2 (ja) | 2009-09-14 | 2010-02-12 | 水晶発振装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009211440 | 2009-09-14 | ||
JP2009211440 | 2009-09-14 | ||
JP2010529174A JP5093355B2 (ja) | 2009-09-14 | 2010-02-12 | 水晶発振装置 |
PCT/JP2010/052080 WO2011030572A1 (ja) | 2009-09-14 | 2010-02-12 | 水晶発振装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5093355B2 true JP5093355B2 (ja) | 2012-12-12 |
JPWO2011030572A1 JPWO2011030572A1 (ja) | 2013-02-04 |
Family
ID=43732249
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010529174A Active JP5093355B2 (ja) | 2009-09-14 | 2010-02-12 | 水晶発振装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5093355B2 (ja) |
CN (1) | CN102484465B (ja) |
TW (1) | TWI449331B (ja) |
WO (1) | WO2011030572A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06338751A (ja) * | 1993-05-31 | 1994-12-06 | Kinseki Ltd | 水晶振動子 |
JP2003318653A (ja) * | 2002-04-24 | 2003-11-07 | Daishinku Corp | 圧電振動デバイス |
JP2007201858A (ja) * | 2006-01-27 | 2007-08-09 | Epson Toyocom Corp | 水晶振動子、高精度水晶発振器 |
JP2008054272A (ja) * | 2006-07-25 | 2008-03-06 | Epson Toyocom Corp | 圧電デバイスの製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4008258B2 (ja) * | 2002-02-15 | 2007-11-14 | セイコーインスツル株式会社 | 圧電振動子の製造方法 |
JP2005297221A (ja) * | 2004-04-06 | 2005-10-27 | Smk Corp | 振動部品の樹脂封止方法 |
US20060255691A1 (en) * | 2005-03-30 | 2006-11-16 | Takahiro Kuroda | Piezoelectric resonator and manufacturing method thereof |
JP2008005471A (ja) * | 2006-05-23 | 2008-01-10 | Matsushita Electric Ind Co Ltd | 圧電発振器およびその製造方法 |
CN101278181B (zh) * | 2006-09-28 | 2011-05-04 | 日本先锋公司 | 检查装置及检查方法 |
TW200834833A (en) * | 2007-02-14 | 2008-08-16 | Besdon Technology Corp | Subminiature electronic device having hermetic cavity and method of manufacturing the same |
-
2010
- 2010-02-12 JP JP2010529174A patent/JP5093355B2/ja active Active
- 2010-02-12 WO PCT/JP2010/052080 patent/WO2011030572A1/ja active Application Filing
- 2010-02-12 CN CN201080040503.1A patent/CN102484465B/zh active Active
- 2010-08-26 TW TW099128566A patent/TWI449331B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06338751A (ja) * | 1993-05-31 | 1994-12-06 | Kinseki Ltd | 水晶振動子 |
JP2003318653A (ja) * | 2002-04-24 | 2003-11-07 | Daishinku Corp | 圧電振動デバイス |
JP2007201858A (ja) * | 2006-01-27 | 2007-08-09 | Epson Toyocom Corp | 水晶振動子、高精度水晶発振器 |
JP2008054272A (ja) * | 2006-07-25 | 2008-03-06 | Epson Toyocom Corp | 圧電デバイスの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN102484465A (zh) | 2012-05-30 |
JPWO2011030572A1 (ja) | 2013-02-04 |
CN102484465B (zh) | 2015-04-08 |
TW201119223A (en) | 2011-06-01 |
WO2011030572A1 (ja) | 2011-03-17 |
TWI449331B (zh) | 2014-08-11 |
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