M375245 *' 五、新型說明： 【新型所屬之技術領域】 本創作係關於一種電阻式觸控面板，特指其上板模組 之結構無須設置硬化膜因而具有較佳製程良率者。 【先前技術】 電腦'行動電話及攝影機等等各種電子產品的輸入方 式’隨著科技的進展呈現不斷的進化，鍵盤、滑鼠或軌跡 • 球等均為其中的一種’而近年來觸控式螢幕由於使用者可 直接經由手指或一觸控筆等物體經由碰觸顯示螢幕即可直 接進行指令的輸入，已漸漸成為輸入方式的主流之一。 參見第六及七圖所示’現有技術之電阻式觸控面板的 結構，其主要包含有一上板模組（X，）、一下板模組以及 一軟性電路板（ζ·)，其中： 該下板模組（Υ’）係包含有：一透明基板（2〇); 一下導電 層（21) ’其設置於基板（2〇)頂面，於該下導電層（21)頂面周 • 邊形成有複數下電極（211); —間隙層（22)及一第一黏貼層 (23) ’分別設於下導電層（2丨）頂面’其中第一黏貼層（23)圍 繞於間隙層（22)周邊且覆蓋於下電極（2η)上方，另第一黏 貼層（23)上對應下電極（2U)處設有導電膠（231)與下電極 (211)相接觸； 該上板模組（X’）係包含有：一硬化膜（24); —圖案層 (25) ’其以印刷方式形成位於硬化膜（24)底面；一保護薄膜 (26) ’其透過一第二黏貼層（27)黏貼於硬化膜（24)底面且覆 蓋圖案層（25); —上導電層（28) ’其設置於保護薄膜（26)底 M375245 面，於上導電層（28)底面周邊形成有上電極（281); —絕緣 層（29)，其設置於上導電層（28)底面周邊而覆蓋上電極 (281)，且黏合於下板模組（γ，）之第一黏貼層（23)頂面，絕 緣層（29)上設有一導電膠（291)與上電極（281)相接觸； 該軟性電路板（Z，）設置於第一黏貼層（23)與絕緣層（29) 之間’其具有複數端子（Z1，）分別與第一黏貼層（23)及絕緣 • 層（29)之導電膠（23 1)(291)相接觸，而分別與下電極（211)及 上電極（281)呈電連接。 • 上述中’圖案層（25)係印刷於硬化膜（24)的底面上，用 以在觸控面板上劃定出某些特定區域，以供操作者點按該 些區域進行特定操作，在圖案層（25)印刷完畢後，再透過 第二黏貼層（27)將硬化膜（24)與保護薄膜（26)緊密貼合，然 而，在貼合時，必須確保位於保護薄膜（26)與硬化膜（24)間 的空氣完全排除，否則將造成電阻式觸控面板表面的不平 整’進而景〉響該觸控面板的操作效果，一旦硬化膜（24)與 鲁·保護薄膜（26)間殘留有空氣，則該成品將作為瑕疵品淘汰， .造成業者之損失，因此現有技術之觸控面板結構仍有進一 步改良之餘地。 【新型内容】 有鑑於上述現有技術電阻式觸控面板，其黏貼硬化膜 及保護薄膜之過程中，若未將兩者間的空氣完全排除則 成品將因屬於瑕疵品而無法販售，從而有降低良率之缺點， 本創作係改良電阻式觸控面板之結構，使其可免除硬化膜 之設置，從而解決在黏貼時必須排除空氣之問題。 為達成上述創作目的，本創作所使用之技術手段在於「 4 M375245 提供一電阻式觸控面板，发句人士 八L 3有一上板模組、— 組以及一軟性電路板，其中： 卜扳模 該下板模組係包含有： 一透明基板； -下導電層，其設置於基板頂面， 周邊形成有複數下電極以及一導線； 爷電層頂面 一間隙層，其設置於下導電層頂面； -黏貼層，其設於下導電層頂面 且覆蓋於下電極與導線上方，黏貼層上對應下=、層周邊 的-端處設有複數導電勝分別與對應之下電 ^導線 觸，黏貼層上形成有一下開槽； 肖導線相接 該上板模組係包含有： 一保護薄膜； 一上導電層，其設置於保護薄膜底面，於上導電層底 面周邊形成有一油墨電極； _ 一圖案層，其形成於上導電層底面，且相對位於油墨 電極的外側處； 一絕緣層’其設置於上導電層底面周邊而覆蓋油墨電 極與圖案層，且黏合於下板模組之黏貼層頂面，絕緣層上 形成有一上開槽； 所述上開槽與下開槽内設有一導體，該導體底端接觸 於下導電層之頂面及導線另一端，而頂端接觸於油墨電 極； 該軟性電路板設置於黏貼層與絕緣層之間，其具有複 數端子，該些端子分別與黏貼層之對應導電膠相接觸。 r M375245 -- 相較於現有技術之電阻式觸控面板，本創作係將圖案 層直接印刷於上導電層的底面，據此可省去硬化膜以及用 以黏合硬化膜與保護薄膜之黏貼層的設置，是以，本創作 自然無現有技術觸控面板在製作過程中，因空氣殘留於硬 化膜及保護薄膜之間而致使產品產生瑕疵之缺點，並且減 少使用的元件數量，更可達到節省成本及組裝工時之功效。 - 【實施方式】 _ 參見第一至三圖所示，本創作之電阻式觸控面板，於 第一實施例中包含有一上板模組（x)、一下板模組（γ)以及 一軟性電路板（ζ)。 所述下板模組（γ)包含有： 一透明透明基板（1〇)，該透明基板（1〇)例如可為一玻璃 板； 一下導電層（11)，其設置於透明基板（10)頂面，於該下 導電層（11)頂面周邊形成有複數下電極（lu)以及一導線 φ (112)，該下電極（111)例如可為使用銀漿印刷形成之銀漿電 . 極； 一間隙層（12) ’其具有複數間隙子（121)，間隙層〇2) 係設置於下導電層（11)頂面； 一黏貼層（13)，其設於下導電層（11)頂面，圍繞於間 隙層（12)周邊且覆蓋於下電極〇 n)與導線12)上方，黏貼 層（13)上對應下電極（in)與導線（112)的一端處設有複數導 電膠（Π1)分別與對應之下電極（丨丨丨）與導線（u2)相接觸， 此外’黏貼層（1 3)形成有一下開槽（i 32)。 所述上板模組（X )係包含有： 「 M375245 一保護薄膜（14); 一上導電層（15)，其設置於保護薄膜（14)底面，於上 導電層（15)底面周邊形成有一油墨電極（151)，該油墨電極 (15 1)係由油墨與奈米金屬顆粒組成； 一圖案層（16)，其形成於上導電層（15)底面，且相對 位於油墨電極（15 1)的外側處； 一絕緣層（17) ’其設置於上導電層（15)底面周邊而覆 盍油墨電極（151)與圖案層（16)，絕緣層（17)且黏合於下板 模組（Y)之黏貼層（13)頂面，絕緣層（17)上形成有一上開槽 (171)。 所述上開槽（171)與下開槽（132)内設有一導體（18)，該 導體（18)底端接觸於下導電層（n)之頂面及導線（n 2)另一 端，而頂端接觸於油墨電極（151); 該軟性電路板（Z)具有複數端子（zi)。 上述上板模組（X)、下板模組（γ)及軟性電路板（z)相互 疊合即構成本創作之電阻式觸控面板，其中上板模組（χ)之 絕緣層（17)係貼合於下板模組（γ)之黏貼層（13)頂面，而軟 性電路板（Ζ)係設置位於黏貼層（13)與絕緣層（17)之間，且 其所設端子（Ζ1)與黏貼層之導電膠（131)相接觸，而分 別可與下電極（lu)電連接，並且透過導線（112)和導體（18) 與油墨電極（15 1)電連接。 參見第四及五圖所示，為本創作之第二實施例，其中 所述上板模組（X)於油墨電極（15丨）的底面進一步形成有一 上電極（152) ’該上電極（152)例如可為使用銀漿印刷形成之 銀毁電極，而所述導體（18)的頂端係接觸於該上電極（152)、 M375245 如此由於銀漿電極的上電極（152)較油墨電極（151)的電阻值 為低，是以可進一步提升上導電層（15)與軟性電路板（z)間 電連接的可靠度。 由上述可知，本創作之電阻式觸控面板無須設置硬化 膜，因此不存在有現有技術之電阻式觸控面板中，由於必 須使用黏貼層來黏合硬化膜及保護薄膜，當貼合不夠緊密 '即會產生瑕疵之問題，此外，不使用硬化膜及黏貼層更可 具有節省成本與工時，以及減少觸控面板成品整體厚度之 B效果。 【圖式簡單說明】 第一圖為本創作第一實施例之立體分解圖。 第一圖為本創作第一實施例於2-2剖面之部分剖視 圖。 4二圖為本創作第一實施例於3-3剖面之部分别視 圖。 .第四圖為本創作第二實施例之立體分解圖。 - 第五圖為本創作第二實施例於5-5剖面之部分剖視 圖。 第六圖為現有技術電阻式觸控面板之立體分解圖。 第七圖為現有技術電阻式觸控面板之部分剖視圖。 (Y)(Y》T板模組 (ζιχζν)端子 【主要元件符號說明】 (X)(X')上板模組 (Z)(ZJ軟性電路板 M375245 (ίο)透明基板 (111)下電極 (121)間隙子 (131)導電膠 (14)保護薄膜 (151)油墨電極 (16)圖案層 (171)上開槽 (20)透明基板 (211)下電極 (23) 第一黏貼層 (24) 硬化膜 (26)保護薄膜 (28) 上導電層 (29) 絕緣層 (11) 下導電層 (12) 間隙層 (13) 黏貼層 (132)下開槽 (15)上導電層 (152)上電極 (17) 絕緣層 (18) 導體 (21) 下導電層 (22) 間隙層 (231)導電膠 (25)圖案層 (27)第二黏貼層 (281)上電極 (291)導電膠M375245 *' V. New description: [New technical field] This creation is about a resistive touch panel, especially the structure of the upper plate module, which does not need to be provided with a hardened film and thus has better process yield. [Prior Art] The input methods of various electronic products such as computer 'mobile phones and cameras' have evolved with the advancement of technology. Keyboards, mice or tracks • Balls are one of them. The screen can be directly input by the user directly through the touch screen by means of a finger or a stylus, and has gradually become one of the mainstream of the input method. Referring to the structure of the prior art resistive touch panel shown in the sixth and seventh figures, the main structure comprises an upper board module (X,), a lower board module and a flexible circuit board (ζ·), wherein: The lower plate module (Υ') comprises: a transparent substrate (2〇); the lower conductive layer (21) is disposed on the top surface of the substrate (2〇), and is on the top surface of the lower conductive layer (21). A plurality of lower electrodes (211) are formed on the side; a gap layer (22) and a first adhesive layer (23) are respectively disposed on the top surface of the lower conductive layer (2), wherein the first adhesive layer (23) surrounds the gap The layer (22) is surrounded by the upper electrode (2n), and the first adhesive layer (23) is provided with a conductive paste (231) in contact with the lower electrode (211) at the lower electrode (2U); the upper plate The module (X') comprises: a cured film (24); a pattern layer (25) 'which is formed by printing on the bottom surface of the cured film (24); and a protective film (26) 'passing through a second paste The layer (27) is adhered to the bottom surface of the cured film (24) and covers the pattern layer (25); the upper conductive layer (28) is disposed on the M375245 surface of the protective film (26). An upper electrode (281) is formed around the bottom surface of the upper conductive layer (28); an insulating layer (29) is disposed on the periphery of the bottom surface of the upper conductive layer (28) to cover the upper electrode (281), and is bonded to the lower plate module. (γ,) the top surface of the first adhesive layer (23), the insulating layer (29) is provided with a conductive paste (291) in contact with the upper electrode (281); the flexible circuit board (Z,) is disposed on the first paste The layer (23) and the insulating layer (29) have a plurality of terminals (Z1,) which are in contact with the first adhesive layer (23) and the conductive paste (23 1) (291) of the insulating layer (29), respectively. And electrically connected to the lower electrode (211) and the upper electrode (281), respectively. • The above-mentioned 'pattern layer (25) is printed on the bottom surface of the cured film (24) for delineating certain areas on the touch panel for the operator to click on the areas for specific operations. After the printing layer (25) is printed, the cured film (24) is closely adhered to the protective film (26) through the second adhesive layer (27). However, when bonding, it is necessary to ensure that the protective film (26) is located and The air between the cured film (24) is completely removed, otherwise the surface of the resistive touch panel will be uneven, and then the operation effect of the touch panel will be sounded once the cured film (24) and the Lu protective film (26) If air remains in the room, the finished product will be eliminated as a defective product, causing loss to the manufacturer. Therefore, there is still room for further improvement of the touch panel structure of the prior art. [New content] In view of the above-mentioned prior art resistive touch panel, in the process of adhering the cured film and the protective film, if the air between the two is not completely eliminated, the finished product will not be sold because it is a defective product, thereby In order to reduce the defect rate, this creation improves the structure of the resistive touch panel, so that it can eliminate the setting of the hardened film, thereby solving the problem that air must be removed when pasting. In order to achieve the above purpose, the technical means used in this creation is that "4 M375245 provides a resistive touch panel, and the sentencer L L 3 has a board module, a group and a flexible circuit board, among which: The lower plate module comprises: a transparent substrate; a lower conductive layer disposed on the top surface of the substrate, and a plurality of lower electrodes and a wire are formed on the periphery; a gap layer on the top surface of the electrical layer is disposed on the lower conductive layer a top layer; an adhesive layer disposed on the top surface of the lower conductive layer and covering the lower electrode and the upper side of the wire, corresponding to the lower layer on the adhesive layer, and a plurality of conductive wins and corresponding electrical wires at the end of the layer periphery Touching, forming a slot on the adhesive layer; the upper wire is connected to the upper plate module comprising: a protective film; an upper conductive layer disposed on the bottom surface of the protective film, and an ink electrode formed on the periphery of the bottom surface of the upper conductive layer a pattern layer formed on the bottom surface of the upper conductive layer and located opposite to the outer side of the ink electrode; an insulating layer ' disposed on the periphery of the bottom surface of the upper conductive layer to cover the ink electrode and the pattern layer, and a top surface of the adhesive layer of the lower plate module, an upper slot is formed on the insulating layer; a conductor is disposed in the upper slot and the lower slot, and the bottom end of the conductor contacts the top surface of the lower conductive layer and the wire is further One end, and the top end is in contact with the ink electrode; the flexible circuit board is disposed between the adhesive layer and the insulating layer, and has a plurality of terminals respectively contacting the corresponding conductive glue of the adhesive layer. r M375245 -- Compared with the existing The technical resistive touch panel, the creation layer directly prints the pattern layer on the bottom surface of the upper conductive layer, thereby eliminating the need for the hardened film and the adhesive layer for bonding the cured film and the protective film. Naturally, there is no disadvantage that the prior art touch panel can cause defects in the product due to air remaining between the cured film and the protective film, and the number of components used can be reduced, thereby achieving cost saving and assembly work time. - [Embodiment] _ Referring to the first to third figures, the resistive touch panel of the present invention includes an upper plate module (x) and a lower plate module (γ) in the first embodiment. And a flexible circuit board (ζ). The lower board module (γ) comprises: a transparent transparent substrate (1〇), the transparent substrate (1〇) can be, for example, a glass plate; a lower conductive layer (11) And being disposed on a top surface of the transparent substrate (10), and forming a plurality of lower electrodes (lu) and a wire φ (112) around the top surface of the lower conductive layer (11), and the lower electrode (111) can be used, for example. Silver paste formed by silver paste. A pole layer (12) 'having a plurality of gaps (121), a gap layer 〇 2) is disposed on the top surface of the lower conductive layer (11); an adhesive layer (13) It is disposed on the top surface of the lower conductive layer (11), surrounds the periphery of the gap layer (12) and covers the lower electrode 〇n) and the wire 12), and the lower electrode (in) and the wire on the adhesion layer (13) ( At one end of the 112), a plurality of conductive pastes (Π1) are respectively in contact with the corresponding lower electrodes (丨丨丨) and the wires (u2), and the 'adhesive layer (13) is formed with a slit (i 32). The upper plate module (X) comprises: "M375245 a protective film (14); an upper conductive layer (15) disposed on the bottom surface of the protective film (14) and formed around the bottom surface of the upper conductive layer (15) There is an ink electrode (151) composed of ink and nano metal particles; a pattern layer (16) formed on the bottom surface of the upper conductive layer (15) and located opposite to the ink electrode (15 1 An outer layer of the insulating layer (17) is disposed on the periphery of the bottom surface of the upper conductive layer (15) to cover the ink electrode (151) and the pattern layer (16), and the insulating layer (17) is bonded to the lower plate module (Y) a top surface of the adhesive layer (13), an upper opening (171) is formed on the insulating layer (17). A conductor (18) is disposed in the upper opening (171) and the lower opening (132). The bottom end of the conductor (18) is in contact with the top surface of the lower conductive layer (n) and the other end of the wire (n 2), and the top end is in contact with the ink electrode (151); the flexible circuit board (Z) has a plurality of terminals (zi) The upper board module (X), the lower board module (γ) and the flexible circuit board (z) are superposed on each other to form the resistive touch panel of the present invention, wherein the upper board The insulating layer (17) of the group (χ) is attached to the top surface of the adhesive layer (13) of the lower plate module (γ), and the flexible circuit board (Ζ) is disposed between the adhesive layer (13) and the insulating layer (17). Between the two, and the terminal (Ζ1) is in contact with the conductive paste (131) of the adhesive layer, and can be electrically connected to the lower electrode (lu), respectively, and through the wire (112) and the conductor (18) and the ink electrode (15 1) Electrical connection. Referring to the fourth and fifth figures, a second embodiment of the present invention, wherein the upper plate module (X) is further formed with an upper electrode on the bottom surface of the ink electrode (15 丨) ( 152) 'The upper electrode (152) may be, for example, a silver-destroyed electrode formed by printing with a silver paste, and the top end of the conductor (18) is in contact with the upper electrode (152), M375245, such that the upper electrode of the silver paste electrode (152) The resistance value of the ink electrode (151) is lower, so that the reliability of electrical connection between the upper conductive layer (15) and the flexible circuit board (z) can be further improved. As can be seen from the above, the resistive touch of the present invention The control panel does not need to be provided with a hardened film, so there is no prior art resistive touch panel, due to The adhesive layer must be used to bond the cured film and the protective film. When the bonding is not tight enough, the problem of defects can occur. In addition, the use of the cured film and the adhesive layer can save cost and work time, and reduce the overall quality of the touch panel product. The effect of the thickness B is as follows: The first figure is an exploded perspective view of the first embodiment of the creation. The first figure is a partial cross-sectional view of the first embodiment of the creation of the second embodiment. A first embodiment of the first embodiment is created in section 3-3. The fourth figure is an exploded perspective view of the second embodiment of the creation. - Figure 5 is a partial cross-sectional view of the second embodiment of the present invention taken along line 5-5. The sixth figure is an exploded perspective view of a prior art resistive touch panel. The seventh figure is a partial cross-sectional view of a prior art resistive touch panel. (Y) (Y) T board module (ζιχζν) terminal [main component symbol description] (X) (X') upper board module (Z) (ZJ flexible circuit board M375245 (ίο) transparent substrate (111) lower electrode (121) Spacer (131) Conductive glue (14) Protective film (151) Ink electrode (16) Pattern layer (171) Slotted (20) Transparent substrate (211) Lower electrode (23) First adhesive layer (24) Hardened film (26) protective film (28) upper conductive layer (29) insulating layer (11) lower conductive layer (12) gap layer (13) adhesive layer (132) under groove (15) upper conductive layer (152) Upper electrode (17) Insulation layer (18) Conductor (21) Lower conductive layer (22) Clearance layer (231) Conductive adhesive (25) Pattern layer (27) Second adhesive layer (281) Upper electrode (291) Conductive adhesive