KR100558145B1 - 와이어본딩 장치 - Google Patents

와이어본딩 장치 Download PDF

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Publication number
KR100558145B1
KR100558145B1 KR20030041878A KR20030041878A KR100558145B1 KR 100558145 B1 KR100558145 B1 KR 100558145B1 KR 20030041878 A KR20030041878 A KR 20030041878A KR 20030041878 A KR20030041878 A KR 20030041878A KR 100558145 B1 KR100558145 B1 KR 100558145B1
Authority
KR
South Korea
Prior art keywords
capillary
holder
bonding
actuator
impact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR20030041878A
Other languages
English (en)
Korean (ko)
Other versions
KR20040007260A (ko
Inventor
교마스류이치
곤도유타카
Original Assignee
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 신가와 filed Critical 가부시키가이샤 신가와
Publication of KR20040007260A publication Critical patent/KR20040007260A/ko
Application granted granted Critical
Publication of KR100558145B1 publication Critical patent/KR100558145B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
KR20030041878A 2002-07-11 2003-06-26 와이어본딩 장치 Expired - Fee Related KR100558145B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2002-00202115 2002-07-11
JP2002202115A JP3727616B2 (ja) 2002-07-11 2002-07-11 ワイヤボンディング装置

Publications (2)

Publication Number Publication Date
KR20040007260A KR20040007260A (ko) 2004-01-24
KR100558145B1 true KR100558145B1 (ko) 2006-03-10

Family

ID=30112603

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20030041878A Expired - Fee Related KR100558145B1 (ko) 2002-07-11 2003-06-26 와이어본딩 장치

Country Status (4)

Country Link
US (1) US6871772B2 (enExample)
JP (1) JP3727616B2 (enExample)
KR (1) KR100558145B1 (enExample)
TW (1) TWI257694B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7044356B2 (en) 2003-12-11 2006-05-16 Texas Instruments Incorporated Roller wire brake for wire bonding machine
JP2005236103A (ja) * 2004-02-20 2005-09-02 Shinkawa Ltd ワイヤボンディング装置
KR100585145B1 (ko) * 2004-06-05 2006-05-30 삼성전자주식회사 제트 레벨에 의한 리젝트 프레임 판별 시스템 및 이를 이용한 와이어 본딩 방법
KR100609634B1 (ko) 2006-02-16 2006-08-08 주식회사 탑 엔지니어링 본딩 장비의 본딩 헤드
WO2008151964A1 (de) * 2007-06-15 2008-12-18 Oerlikon Assembly Equipment Ag, Steinhausen Bondkopf fuer einen wire bonder
JP5930423B2 (ja) * 2014-05-09 2016-06-08 株式会社カイジョー ボンディング装置
CN113241319B (zh) * 2021-05-31 2021-11-30 广东工业大学 一种快速定位方法及系统
CN114388407B (zh) * 2021-12-24 2023-02-17 凌波微步半导体设备(常熟)有限公司 一种键合头装置及键合机

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4603802A (en) * 1984-02-27 1986-08-05 Fairchild Camera & Instrument Corporation Variation and control of bond force
EP0340506B1 (de) * 1988-05-05 1994-02-02 Esec Sa Vorrichtung zur ultraschallkontaktierenden Drahtverbindung an elektronischen Komponenten
JP2588068B2 (ja) * 1991-02-27 1997-03-05 株式会社カイジョー ワイヤボンディング装置及びその方法
US5169050A (en) * 1991-06-03 1992-12-08 General Scanning, Inc. Wire bonder with improved actuator
JP3007195B2 (ja) * 1991-09-18 2000-02-07 株式会社日立製作所 ボンディング装置およびボンディング部検査装置
JP3128715B2 (ja) * 1992-12-24 2001-01-29 株式会社新川 ボンデイング装置
JP3138973B2 (ja) * 1992-12-24 2001-02-26 株式会社新川 ボンデイング装置
JP3128716B2 (ja) * 1993-01-18 2001-01-29 株式会社新川 ボンデイング装置
US6098868A (en) * 1997-05-23 2000-08-08 Masushita Electric Industrial Co., Ltd. Bump forming method and bump bonder
JP2003163234A (ja) * 2001-11-27 2003-06-06 Nec Electronics Corp ワイヤボンディング装置およびワイヤボンディング方法

Also Published As

Publication number Publication date
TWI257694B (en) 2006-07-01
JP3727616B2 (ja) 2005-12-14
US20040007609A1 (en) 2004-01-15
JP2004047665A (ja) 2004-02-12
US6871772B2 (en) 2005-03-29
TW200403824A (en) 2004-03-01
KR20040007260A (ko) 2004-01-24

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