KR100551937B1 - 분별된 노볼락 수지 및 그로부터의 포토레지스트 조성물 - Google Patents
분별된 노볼락 수지 및 그로부터의 포토레지스트 조성물 Download PDFInfo
- Publication number
- KR100551937B1 KR100551937B1 KR1020007006534A KR20007006534A KR100551937B1 KR 100551937 B1 KR100551937 B1 KR 100551937B1 KR 1020007006534 A KR1020007006534 A KR 1020007006534A KR 20007006534 A KR20007006534 A KR 20007006534A KR 100551937 B1 KR100551937 B1 KR 100551937B1
- Authority
- KR
- South Korea
- Prior art keywords
- water
- solution
- photoresist
- soluble organic
- polar solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
- G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US8/991,034 | 1997-12-15 | ||
| US08/991,034 US6045966A (en) | 1997-12-15 | 1997-12-15 | Fractionated novolak resin and photoresist composition therefrom |
| US08/991,034 | 1997-12-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20010033157A KR20010033157A (ko) | 2001-04-25 |
| KR100551937B1 true KR100551937B1 (ko) | 2006-02-20 |
Family
ID=25536786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020007006534A Expired - Fee Related KR100551937B1 (ko) | 1997-12-15 | 1998-12-01 | 분별된 노볼락 수지 및 그로부터의 포토레지스트 조성물 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6045966A (https=) |
| EP (1) | EP1042381B1 (https=) |
| JP (1) | JP2002508415A (https=) |
| KR (1) | KR100551937B1 (https=) |
| CN (1) | CN1146604C (https=) |
| DE (1) | DE69835693D1 (https=) |
| MY (1) | MY114498A (https=) |
| TW (1) | TW448199B (https=) |
| WO (1) | WO1999031157A1 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6936680B2 (en) * | 2000-12-12 | 2005-08-30 | Chang Chun Plastics Co., Ltd. | Method of producing novolak resin |
| JP3694692B2 (ja) * | 2003-12-11 | 2005-09-14 | 丸善石油化学株式会社 | レジスト用ポリマー溶液およびその製造方法 |
| KR20070108713A (ko) * | 2006-05-08 | 2007-11-13 | 주식회사 동진쎄미켐 | 포토레지스트 조성물 |
| US7642333B2 (en) * | 2007-05-21 | 2010-01-05 | Georgia-Pacific Chemicals Llc | Anhydride and resorcinol latent catalyst system for improving cure characteristics of phenolic resins |
| WO2012026465A1 (ja) * | 2010-08-27 | 2012-03-01 | 住友ベークライト株式会社 | フォトレジスト用樹脂組成物 |
| JP2013195497A (ja) | 2012-03-16 | 2013-09-30 | Sumitomo Bakelite Co Ltd | フォトレジスト用樹脂組成物 |
| JP6221316B2 (ja) * | 2012-05-11 | 2017-11-01 | 住友ベークライト株式会社 | フォトレジスト用樹脂組成物の製造方法、フォトレジストの製造方法および液晶デバイスの製造方法 |
| TW201806996A (zh) * | 2016-04-06 | 2018-03-01 | 迪愛生股份有限公司 | 酚醛清漆型樹脂及抗蝕劑材料 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2590342B2 (ja) * | 1986-11-08 | 1997-03-12 | 住友化学工業株式会社 | ポジ型フォトレジスト用ノボラック樹脂及びそれを含有するポジ型フォトレジスト組成物 |
| CA2023791A1 (en) * | 1989-08-24 | 1991-02-25 | Ayako Ida | Radiation-sensitive positive resist composition |
| JPH03253860A (ja) * | 1990-03-05 | 1991-11-12 | Fuji Photo Film Co Ltd | ポジ型フオトレジスト組成物 |
| US5750632A (en) * | 1994-12-30 | 1998-05-12 | Clariant Finance (Bvi) Limited | Isolation of novolak resin by low temperature sub surface forced steam distillation |
| TW442710B (en) * | 1995-12-07 | 2001-06-23 | Clariant Finance Bvi Ltd | Isolation of novolak resin without high temperature distillation and photoresist composition therefrom |
| US5910559A (en) * | 1996-12-18 | 1999-06-08 | Clariant Finance (Bvi) Limited | Fractionated novolak resin from cresol-formaldehyde reaction mixture and photoresist composition therefrom |
| US5853954A (en) * | 1996-12-18 | 1998-12-29 | Clariant Finance (Bvi) Limited | Fractionated novolak resin and photoresist composition therefrom |
-
1997
- 1997-12-15 US US08/991,034 patent/US6045966A/en not_active Expired - Fee Related
-
1998
- 1998-12-01 WO PCT/EP1998/007754 patent/WO1999031157A1/en not_active Ceased
- 1998-12-01 JP JP2000539076A patent/JP2002508415A/ja active Pending
- 1998-12-01 DE DE69835693T patent/DE69835693D1/de not_active Expired - Lifetime
- 1998-12-01 EP EP98965207A patent/EP1042381B1/en not_active Expired - Lifetime
- 1998-12-01 KR KR1020007006534A patent/KR100551937B1/ko not_active Expired - Fee Related
- 1998-12-01 CN CNB988122332A patent/CN1146604C/zh not_active Expired - Fee Related
- 1998-12-08 TW TW087120328A patent/TW448199B/zh not_active IP Right Cessation
- 1998-12-11 MY MYPI98005610A patent/MY114498A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW448199B (en) | 2001-08-01 |
| MY114498A (en) | 2002-10-31 |
| CN1146604C (zh) | 2004-04-21 |
| EP1042381A1 (en) | 2000-10-11 |
| DE69835693D1 (de) | 2006-10-05 |
| US6045966A (en) | 2000-04-04 |
| EP1042381B1 (en) | 2006-08-23 |
| WO1999031157A1 (en) | 1999-06-24 |
| KR20010033157A (ko) | 2001-04-25 |
| JP2002508415A (ja) | 2002-03-19 |
| CN1304420A (zh) | 2001-07-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1023637B1 (en) | Fractionated novolak resin copolymer and photoresist composition therefrom | |
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| KR100503994B1 (ko) | 축합 중합체를 함유하는 포토레지스트 조성물 | |
| KR100551937B1 (ko) | 분별된 노볼락 수지 및 그로부터의 포토레지스트 조성물 | |
| US6096477A (en) | Fractionated novolak resin from cresol-formaldehyde reaction mixture and photoresist composition therefrom | |
| KR100540029B1 (ko) | 분별된 노볼락 수지 및 이것으로 제조된 포토레지스트 조성물 | |
| US5665517A (en) | Acidic ion exchange resin as a catalyst to synthesize a novolak resin and photoresist composition therefrom | |
| US5863700A (en) | Isolation of novolak resin without high temperature distillation and photoresist composition therefrom | |
| EP0948552B1 (en) | Method for producing a water insoluble, aqueous alkali soluble novolak resin | |
| JPH09143237A (ja) | 安定した分子量を有するノボラック樹脂およびそれから製造されるフォトレジスト | |
| JP2000503693A (ja) | ノボラック樹脂を合成するための触媒としての酸性イオン交換樹脂およびそれらからのフォトレジスト組成物 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| N231 | Notification of change of applicant | ||
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
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| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20090208 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
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| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20090208 |
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| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
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| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |