KR100543007B1 - 다결정 실리콘 박막의 제조 방법 및 이를 사용하여 제조된디스플레이 디바이스 - Google Patents
다결정 실리콘 박막의 제조 방법 및 이를 사용하여 제조된디스플레이 디바이스 Download PDFInfo
- Publication number
- KR100543007B1 KR100543007B1 KR1020030071592A KR20030071592A KR100543007B1 KR 100543007 B1 KR100543007 B1 KR 100543007B1 KR 1020030071592 A KR1020030071592 A KR 1020030071592A KR 20030071592 A KR20030071592 A KR 20030071592A KR 100543007 B1 KR100543007 B1 KR 100543007B1
- Authority
- KR
- South Korea
- Prior art keywords
- pattern
- laser
- transmission pattern
- thin film
- display device
- Prior art date
Links
- 229910021420 polycrystalline silicon Inorganic materials 0.000 title claims abstract description 37
- 239000010409 thin film Substances 0.000 title claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 229920005591 polysilicon Polymers 0.000 title 2
- 230000005540 biological transmission Effects 0.000 claims abstract description 53
- 238000000034 method Methods 0.000 claims description 20
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 17
- 239000004973 liquid crystal related substance Substances 0.000 claims description 3
- 238000002425 crystallisation Methods 0.000 abstract description 20
- 230000008025 crystallization Effects 0.000 abstract description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 11
- 229910052710 silicon Inorganic materials 0.000 abstract description 10
- 239000010703 silicon Substances 0.000 abstract description 10
- 239000013078 crystal Substances 0.000 description 7
- 230000001678 irradiating effect Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000002800 charge carrier Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B13/00—Single-crystal growth by zone-melting; Refining by zone-melting
- C30B13/16—Heating of the molten zone
- C30B13/22—Heating of the molten zone by irradiation or electric discharge
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/60—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
- C30B29/605—Products containing multiple oriented crystallites, e.g. columnar crystallites
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02595—Microstructure polycrystalline
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H01L21/02678—Beam shaping, e.g. using a mask
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02691—Scanning of a beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/127—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement
- H01L27/1274—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement using crystallisation of amorphous semiconductor or recrystallisation of crystalline semiconductor
- H01L27/1285—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement using crystallisation of amorphous semiconductor or recrystallisation of crystalline semiconductor using control of the annealing or irradiation parameters, e.g. using different scanning direction or intensity for different transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1296—Multistep manufacturing methods adapted to increase the uniformity of device parameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
- H01L29/78672—Polycrystalline or microcrystalline silicon transistor
Abstract
Description
Claims (11)
- 레이저가 투과하는 투과 패턴 그룹과 레이저가 투과하지 못하는 불투과 패턴 그룹이 혼합된 구조를 갖는 마스크를 사용하여 비정질 실리콘을 레이저를 이용하여 결정화하는 디스플레이 디바이스용 다결정 실리콘 박막의 제조 방법에 있어서,상기 마스크는 상기 레이저가 스캔하는 방향축을 기준으로 상기 투과 패턴 그룹이 비대칭적으로 존재하며, 일정 중심축을 기준으로 하여 좌우 대칭인 영역이 비대칭적으로 존재하는 투과 패턴이 상기 일정 중심축과 평행한 또 다른 축을 기준으로 하여 일정거리만큼 쉬프트되어 투과 패턴과 불투과 패턴이 서로 바뀌어 위치하는 것을 특징으로 하는 디스플레이 디바이스용 다결정 실리콘 박막의 제조 방법.
- 제 1항에 있어서,상기 레이저가 투과하는 패턴 그룹은 라인 형태의 투과 패턴으로 이루어진 디스플레이 디바이스용 다결정 실리콘 박막의 제조 방법.
- 제 1항에 있어서,상기 레이저가 투과하는 패턴 그룹은 제 1 투과 패턴과 상기 제 1 투과 패턴의 길이에 비하여 상대적으로 짧은 길이를 갖는 라인 형태의 제 2 투과 패턴을 포함하는 디스플레이 디바이스용 다결정 실리콘 박막의 제조 방법.
- 제 3항에 있어서,상기 레이저가 투과하는 패턴 그룹은 상기 제 1 투과 패턴의 길이보다 상대적으로 짧은 길이를 가지며, 패턴 길이가 서로 다른 제 3 투과 패턴과 제 4 투과 패턴을 포함하는 디스플레이 디바이스용 다결정 실리콘 박막의 제조 방법.
- 제 1항에 있어서,상기 일정 거리는 마스크 패턴 중 투과 패턴의 폭에서 투과 패턴과 투과 패턴 사이의 불투과 패턴의 거리 중 제일 작은 영역의 거리만큼 제외한 거리이며, 상기 투과 패턴의 폭은 상기 제일 작은 영역의 거리보다 큰 것인 디스플레이 디바이스용 다결정 실리콘 박막의 제조 방법.
- 제 1항에서 있어서,상기 일정축은 상기 스캔 방향축과 수직한 디스플레이 디바이스용 다결정 실리콘 박막의 제조 방법.
- 제 1항에 있어서,상기 일정축과 평행한 또 다른 축은 상기 스캔 방향축과 수직하며 마스크의 중심에 위치하는 것인 디스플레이 디바이스용 다결정 실리콘 박막의 제조 방법.
- 제 1항에 있어서,상기 레이저가 투과하는 패턴 그룹은 스캔 방향축에 수직한 방향에 대하여 서로 일정 거리만큼 어긋나 있는 구조를 갖는 것을 특징으로 하는 디스플레이 디바이스용 다결정 실리콘 박막의 제조 방법.
- 제 8항에 있어서,상기 일정 거리는 투과 영역의 폭보다 작은 거리인 디스플레이 디바이스용 다결정 실리콘 박막의 제조 방법.
- 제 1항의 디스플레이 디바이스용 다결정 실리콘 박막의 제조 방법을 사용하여 제조되는 다결정 실리콘 박막을 사용하는 것을 특징으로 하는 디스플레이 디바이스.
- 제 10항에 있어서,상기 디스플레이 디바이스는 유기 전계 발광 소자 또는 액정 표시 소자인 디스플레이 디바이스.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030071592A KR100543007B1 (ko) | 2003-10-14 | 2003-10-14 | 다결정 실리콘 박막의 제조 방법 및 이를 사용하여 제조된디스플레이 디바이스 |
JP2004202984A JP4849782B2 (ja) | 2003-10-14 | 2004-07-09 | 多結晶シリコン薄膜の製造方法及びこれを使用して製造されたディスプレーデバイス |
US10/961,266 US8486812B2 (en) | 2003-10-14 | 2004-10-12 | Fabrication method for polycrystalline silicon thin film and display device fabricated using the same |
CNB2004101005988A CN100375233C (zh) | 2003-10-14 | 2004-10-14 | 多晶硅薄膜的制造方法和用多晶硅薄膜制造的显示器件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030071592A KR100543007B1 (ko) | 2003-10-14 | 2003-10-14 | 다결정 실리콘 박막의 제조 방법 및 이를 사용하여 제조된디스플레이 디바이스 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050035804A KR20050035804A (ko) | 2005-04-19 |
KR100543007B1 true KR100543007B1 (ko) | 2006-01-20 |
Family
ID=34420666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020030071592A KR100543007B1 (ko) | 2003-10-14 | 2003-10-14 | 다결정 실리콘 박막의 제조 방법 및 이를 사용하여 제조된디스플레이 디바이스 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8486812B2 (ko) |
JP (1) | JP4849782B2 (ko) |
KR (1) | KR100543007B1 (ko) |
CN (1) | CN100375233C (ko) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6906349B2 (en) * | 2003-01-08 | 2005-06-14 | Samsung Electronics Co., Ltd. | Polysilicon thin film transistor array panel and manufacturing method thereof |
KR100543007B1 (ko) | 2003-10-14 | 2006-01-20 | 삼성에스디아이 주식회사 | 다결정 실리콘 박막의 제조 방법 및 이를 사용하여 제조된디스플레이 디바이스 |
KR100543010B1 (ko) * | 2003-10-20 | 2006-01-20 | 삼성에스디아이 주식회사 | 다결정 실리콘 박막의 제조 방법 및 이를 사용하여 제조된디스플레이 디바이스 |
KR100796590B1 (ko) * | 2005-07-12 | 2008-01-21 | 삼성에스디아이 주식회사 | 다결정 실리콘 박막의 제조 방법, 이에 사용되는 마스크패턴 및 이를 사용하는 평판 표시 장치의 제조 방법 |
KR101365185B1 (ko) * | 2005-12-16 | 2014-02-21 | 삼성디스플레이 주식회사 | 실리콘 결정화 마스크 및 이를 갖는 실리콘 결정화 장치 |
JP2008046210A (ja) * | 2006-08-11 | 2008-02-28 | Elpida Memory Inc | レチクル及びこれを用いた露光方法及び装置、並びにレチクルのパターン作成方法、パターン形成方法及び半導体装置 |
CN103537794B (zh) * | 2013-10-22 | 2015-09-30 | 中山大学 | 样品做一维精密平动实现二维激光sls晶化的方法 |
JP6655301B2 (ja) * | 2015-05-19 | 2020-02-26 | 株式会社ブイ・テクノロジー | レーザアニール装置及び薄膜トランジスタの製造方法 |
JP2018107403A (ja) * | 2016-12-28 | 2018-07-05 | 株式会社ブイ・テクノロジー | レーザ照射装置、薄膜トランジスタおよび薄膜トランジスタの製造方法 |
JP2019036635A (ja) * | 2017-08-15 | 2019-03-07 | 株式会社ブイ・テクノロジー | レーザ照射装置、薄膜トランジスタの製造方法、プログラムおよび投影マスク |
FR3106932B1 (fr) * | 2020-02-04 | 2023-10-27 | Commissariat Energie Atomique | Procede de fabrication d’un substrat structure |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4309225A (en) * | 1979-09-13 | 1982-01-05 | Massachusetts Institute Of Technology | Method of crystallizing amorphous material with a moving energy beam |
US6555449B1 (en) * | 1996-05-28 | 2003-04-29 | Trustees Of Columbia University In The City Of New York | Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidfication |
JP3204986B2 (ja) * | 1996-05-28 | 2001-09-04 | ザ トラスティース オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク | 基板上の半導体膜領域の結晶化処理及びこの方法により製造されたデバイス |
US6177391B1 (en) * | 1999-05-27 | 2001-01-23 | Alam Zafar | One time use disposable soap and method of making |
US6908835B2 (en) * | 2001-04-19 | 2005-06-21 | The Trustees Of Columbia University In The City Of New York | Method and system for providing a single-scan, continuous motion sequential lateral solidification |
KR100405080B1 (ko) | 2001-05-11 | 2003-11-10 | 엘지.필립스 엘시디 주식회사 | 실리콘 결정화방법. |
KR100379361B1 (ko) * | 2001-05-30 | 2003-04-07 | 엘지.필립스 엘시디 주식회사 | 실리콘막의 결정화 방법 |
KR100424593B1 (ko) * | 2001-06-07 | 2004-03-27 | 엘지.필립스 엘시디 주식회사 | 실리콘 결정화방법 |
TW527732B (en) | 2001-08-21 | 2003-04-11 | Samsung Electronics Co Ltd | Masks for forming polysilicon and methods for manufacturing thin film transistor using the masks |
JP4667682B2 (ja) * | 2001-10-16 | 2011-04-13 | ソニー株式会社 | 半導体装置の製造方法、液晶表示装置の製造方法およびエレクトロルミネッセンス表示装置の製造方法 |
US6767804B2 (en) * | 2001-11-08 | 2004-07-27 | Sharp Laboratories Of America, Inc. | 2N mask design and method of sequential lateral solidification |
US6660576B2 (en) * | 2002-03-11 | 2003-12-09 | Sharp Laboratories Of America, Inc. | Substrate and method for producing variable quality substrate material |
US6906349B2 (en) * | 2003-01-08 | 2005-06-14 | Samsung Electronics Co., Ltd. | Polysilicon thin film transistor array panel and manufacturing method thereof |
KR100543007B1 (ko) | 2003-10-14 | 2006-01-20 | 삼성에스디아이 주식회사 | 다결정 실리콘 박막의 제조 방법 및 이를 사용하여 제조된디스플레이 디바이스 |
-
2003
- 2003-10-14 KR KR1020030071592A patent/KR100543007B1/ko active IP Right Grant
-
2004
- 2004-07-09 JP JP2004202984A patent/JP4849782B2/ja active Active
- 2004-10-12 US US10/961,266 patent/US8486812B2/en active Active
- 2004-10-14 CN CNB2004101005988A patent/CN100375233C/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN100375233C (zh) | 2008-03-12 |
JP2005123573A (ja) | 2005-05-12 |
KR20050035804A (ko) | 2005-04-19 |
US8486812B2 (en) | 2013-07-16 |
CN1617300A (zh) | 2005-05-18 |
US20050079736A1 (en) | 2005-04-14 |
JP4849782B2 (ja) | 2012-01-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7892704B2 (en) | Mask for silicon crystallization, method for crystallizing silicon using the same and display device | |
US7767507B2 (en) | Polycrystalline silicon thin film, fabrication method thereof, and thin film transistor without directional dependency on active channels fabricated using the same | |
US7642623B2 (en) | Fabrication method for polycrystalline silicon thin film and apparatus using the same | |
KR100742380B1 (ko) | 마스크 패턴, 박막 트랜지스터의 제조 방법 및 이를사용하는 유기 전계 발광 표시 장치의 제조 방법 | |
KR100543007B1 (ko) | 다결정 실리콘 박막의 제조 방법 및 이를 사용하여 제조된디스플레이 디바이스 | |
KR20040085310A (ko) | 결정화 방법 | |
KR100796590B1 (ko) | 다결정 실리콘 박막의 제조 방법, 이에 사용되는 마스크패턴 및 이를 사용하는 평판 표시 장치의 제조 방법 | |
US7651931B2 (en) | Laser beam projection mask, and laser beam machining method and laser beam machine using same | |
US20060166469A1 (en) | Method of laser beam maching and laser beam machining apparatus | |
KR100707026B1 (ko) | 비정질실리콘막의 결정화 방법 | |
JP2008227077A (ja) | レーザ光のマスク構造、レーザ加工方法、tft素子およびレーザ加工装置 | |
KR101289055B1 (ko) | 레이저 어닐링 방법, 레이저 어닐링 시스템, 반도체막,반도체 장치, 및 전기 광학 장치 | |
KR100713895B1 (ko) | 다결정막의 형성방법 | |
JP4571486B2 (ja) | 結晶化装備及びこれを用いた結晶化方法 | |
KR100600852B1 (ko) | 다결정 실리콘 박막의 제조 방법 및 이를 사용하여 제조된디스플레이 디바이스 | |
KR100579199B1 (ko) | 폴리실리콘 박막의 제조 방법 및 이를 사용하여 제조된폴리실리콘을 사용하는 디스플레이 디바이스 | |
KR101095368B1 (ko) | 다결정 박막 형성방법 | |
JP2008147236A (ja) | 結晶化装置およびレーザ加工方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130102 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20140102 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20141231 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20151230 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20170102 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20180102 Year of fee payment: 13 |
|
FPAY | Annual fee payment |
Payment date: 20190102 Year of fee payment: 14 |
|
FPAY | Annual fee payment |
Payment date: 20191223 Year of fee payment: 15 |