CN1617300A - 多晶硅薄膜的制造方法和用多晶硅薄膜制造的显示器件 - Google Patents
多晶硅薄膜的制造方法和用多晶硅薄膜制造的显示器件 Download PDFInfo
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- CN1617300A CN1617300A CNA2004101005988A CN200410100598A CN1617300A CN 1617300 A CN1617300 A CN 1617300A CN A2004101005988 A CNA2004101005988 A CN A2004101005988A CN 200410100598 A CN200410100598 A CN 200410100598A CN 1617300 A CN1617300 A CN 1617300A
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- 229910021420 polycrystalline silicon Inorganic materials 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000010409 thin film Substances 0.000 title abstract description 4
- 230000005540 biological transmission Effects 0.000 claims abstract description 83
- 229920005591 polysilicon Polymers 0.000 claims description 35
- 239000012528 membrane Substances 0.000 claims description 23
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 16
- 238000005401 electroluminescence Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 claims description 3
- 238000002425 crystallisation Methods 0.000 abstract description 22
- 230000008025 crystallization Effects 0.000 abstract description 16
- 239000013078 crystal Substances 0.000 description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 9
- 230000004927 fusion Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000002800 charge carrier Substances 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B13/00—Single-crystal growth by zone-melting; Refining by zone-melting
- C30B13/16—Heating of the molten zone
- C30B13/22—Heating of the molten zone by irradiation or electric discharge
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/60—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
- C30B29/605—Products containing multiple oriented crystallites, e.g. columnar crystallites
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02595—Microstructure polycrystalline
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H01L21/02678—Beam shaping, e.g. using a mask
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02691—Scanning of a beam
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/127—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement
- H01L27/1274—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement using crystallisation of amorphous semiconductor or recrystallisation of crystalline semiconductor
- H01L27/1285—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement using crystallisation of amorphous semiconductor or recrystallisation of crystalline semiconductor using control of the annealing or irradiation parameters, e.g. using different scanning direction or intensity for different transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1296—Multistep manufacturing methods adapted to increase the uniformity of device parameters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
- H01L29/78672—Polycrystalline or microcrystalline silicon transistor
Abstract
Description
Claims (18)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR71592/2003 | 2003-10-14 | ||
KR71592/03 | 2003-10-14 | ||
KR1020030071592A KR100543007B1 (ko) | 2003-10-14 | 2003-10-14 | 다결정 실리콘 박막의 제조 방법 및 이를 사용하여 제조된디스플레이 디바이스 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1617300A true CN1617300A (zh) | 2005-05-18 |
CN100375233C CN100375233C (zh) | 2008-03-12 |
Family
ID=34420666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004101005988A Active CN100375233C (zh) | 2003-10-14 | 2004-10-14 | 多晶硅薄膜的制造方法和用多晶硅薄膜制造的显示器件 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8486812B2 (zh) |
JP (1) | JP4849782B2 (zh) |
KR (1) | KR100543007B1 (zh) |
CN (1) | CN100375233C (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7687328B2 (en) | 2005-07-12 | 2010-03-30 | Samsung Mobile Display Co., Ltd. | Method of making a polycrystalline thin film, a mask pattern used in the same and a method of making a flat panel display device using the same |
CN103537794B (zh) * | 2013-10-22 | 2015-09-30 | 中山大学 | 样品做一维精密平动实现二维激光sls晶化的方法 |
CN107615451A (zh) * | 2015-05-19 | 2018-01-19 | 株式会社V技术 | 激光退火方法、激光退火装置以及薄膜晶体管的制造方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6906349B2 (en) * | 2003-01-08 | 2005-06-14 | Samsung Electronics Co., Ltd. | Polysilicon thin film transistor array panel and manufacturing method thereof |
KR100543007B1 (ko) | 2003-10-14 | 2006-01-20 | 삼성에스디아이 주식회사 | 다결정 실리콘 박막의 제조 방법 및 이를 사용하여 제조된디스플레이 디바이스 |
KR100543010B1 (ko) * | 2003-10-20 | 2006-01-20 | 삼성에스디아이 주식회사 | 다결정 실리콘 박막의 제조 방법 및 이를 사용하여 제조된디스플레이 디바이스 |
KR101365185B1 (ko) * | 2005-12-16 | 2014-02-21 | 삼성디스플레이 주식회사 | 실리콘 결정화 마스크 및 이를 갖는 실리콘 결정화 장치 |
JP2008046210A (ja) * | 2006-08-11 | 2008-02-28 | Elpida Memory Inc | レチクル及びこれを用いた露光方法及び装置、並びにレチクルのパターン作成方法、パターン形成方法及び半導体装置 |
JP2018107403A (ja) * | 2016-12-28 | 2018-07-05 | 株式会社ブイ・テクノロジー | レーザ照射装置、薄膜トランジスタおよび薄膜トランジスタの製造方法 |
JP2019036635A (ja) * | 2017-08-15 | 2019-03-07 | 株式会社ブイ・テクノロジー | レーザ照射装置、薄膜トランジスタの製造方法、プログラムおよび投影マスク |
FR3106932B1 (fr) * | 2020-02-04 | 2023-10-27 | Commissariat Energie Atomique | Procede de fabrication d’un substrat structure |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
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US4309225A (en) * | 1979-09-13 | 1982-01-05 | Massachusetts Institute Of Technology | Method of crystallizing amorphous material with a moving energy beam |
JP3204986B2 (ja) * | 1996-05-28 | 2001-09-04 | ザ トラスティース オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク | 基板上の半導体膜領域の結晶化処理及びこの方法により製造されたデバイス |
US6555449B1 (en) * | 1996-05-28 | 2003-04-29 | Trustees Of Columbia University In The City Of New York | Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidfication |
US6177391B1 (en) * | 1999-05-27 | 2001-01-23 | Alam Zafar | One time use disposable soap and method of making |
EP1354341A1 (en) | 2001-04-19 | 2003-10-22 | The Trustees Of Columbia University In The City Of New York | Method for single-scan, continuous motion sequential lateral solidification |
KR100405080B1 (ko) | 2001-05-11 | 2003-11-10 | 엘지.필립스 엘시디 주식회사 | 실리콘 결정화방법. |
KR100379361B1 (ko) * | 2001-05-30 | 2003-04-07 | 엘지.필립스 엘시디 주식회사 | 실리콘막의 결정화 방법 |
KR100424593B1 (ko) | 2001-06-07 | 2004-03-27 | 엘지.필립스 엘시디 주식회사 | 실리콘 결정화방법 |
TW527732B (en) | 2001-08-21 | 2003-04-11 | Samsung Electronics Co Ltd | Masks for forming polysilicon and methods for manufacturing thin film transistor using the masks |
JP4667682B2 (ja) * | 2001-10-16 | 2011-04-13 | ソニー株式会社 | 半導体装置の製造方法、液晶表示装置の製造方法およびエレクトロルミネッセンス表示装置の製造方法 |
US6767804B2 (en) * | 2001-11-08 | 2004-07-27 | Sharp Laboratories Of America, Inc. | 2N mask design and method of sequential lateral solidification |
US6660576B2 (en) * | 2002-03-11 | 2003-12-09 | Sharp Laboratories Of America, Inc. | Substrate and method for producing variable quality substrate material |
US6906349B2 (en) * | 2003-01-08 | 2005-06-14 | Samsung Electronics Co., Ltd. | Polysilicon thin film transistor array panel and manufacturing method thereof |
KR100543007B1 (ko) | 2003-10-14 | 2006-01-20 | 삼성에스디아이 주식회사 | 다결정 실리콘 박막의 제조 방법 및 이를 사용하여 제조된디스플레이 디바이스 |
-
2003
- 2003-10-14 KR KR1020030071592A patent/KR100543007B1/ko active IP Right Grant
-
2004
- 2004-07-09 JP JP2004202984A patent/JP4849782B2/ja active Active
- 2004-10-12 US US10/961,266 patent/US8486812B2/en active Active
- 2004-10-14 CN CNB2004101005988A patent/CN100375233C/zh active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7687328B2 (en) | 2005-07-12 | 2010-03-30 | Samsung Mobile Display Co., Ltd. | Method of making a polycrystalline thin film, a mask pattern used in the same and a method of making a flat panel display device using the same |
CN103537794B (zh) * | 2013-10-22 | 2015-09-30 | 中山大学 | 样品做一维精密平动实现二维激光sls晶化的方法 |
CN107615451A (zh) * | 2015-05-19 | 2018-01-19 | 株式会社V技术 | 激光退火方法、激光退火装置以及薄膜晶体管的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR100543007B1 (ko) | 2006-01-20 |
KR20050035804A (ko) | 2005-04-19 |
US20050079736A1 (en) | 2005-04-14 |
CN100375233C (zh) | 2008-03-12 |
JP4849782B2 (ja) | 2012-01-11 |
JP2005123573A (ja) | 2005-05-12 |
US8486812B2 (en) | 2013-07-16 |
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