KR100526668B1 - 박막두께측정방법 및 장치 - Google Patents

박막두께측정방법 및 장치 Download PDF

Info

Publication number
KR100526668B1
KR100526668B1 KR10-2003-0001380A KR20030001380A KR100526668B1 KR 100526668 B1 KR100526668 B1 KR 100526668B1 KR 20030001380 A KR20030001380 A KR 20030001380A KR 100526668 B1 KR100526668 B1 KR 100526668B1
Authority
KR
South Korea
Prior art keywords
substrate
thin film
current value
substrate current
electron beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-2003-0001380A
Other languages
English (en)
Korean (ko)
Other versions
KR20030063129A (ko
Inventor
이타가키요스케
야마다게이조
우시키다케오
Original Assignee
파브 솔루션 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 파브 솔루션 가부시키가이샤 filed Critical 파브 솔루션 가부시키가이샤
Publication of KR20030063129A publication Critical patent/KR20030063129A/ko
Application granted granted Critical
Publication of KR100526668B1 publication Critical patent/KR100526668B1/ko
Assigned to 가부시키가이샤 탑콘 reassignment 가부시키가이샤 탑콘 권리의 전부이전등록 Assignors: 파브 솔루션 가부시키가이샤
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
    • G01B15/02—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/28—Scanning microscopes
    • H01J2237/2813—Scanning microscopes characterised by the application
    • H01J2237/2814—Measurement of surface topography
    • H01J2237/2815—Depth profile

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
KR10-2003-0001380A 2002-01-17 2003-01-09 박막두께측정방법 및 장치 Expired - Fee Related KR100526668B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002009304A JP3953821B2 (ja) 2002-01-17 2002-01-17 膜厚測定方法および膜厚測定装置
JPJP-P-2002-00009304 2002-01-17

Publications (2)

Publication Number Publication Date
KR20030063129A KR20030063129A (ko) 2003-07-28
KR100526668B1 true KR100526668B1 (ko) 2005-11-08

Family

ID=19191506

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2003-0001380A Expired - Fee Related KR100526668B1 (ko) 2002-01-17 2003-01-09 박막두께측정방법 및 장치

Country Status (4)

Country Link
US (1) US6683308B2 (https=)
JP (1) JP3953821B2 (https=)
KR (1) KR100526668B1 (https=)
TW (1) TW580560B (https=)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3913555B2 (ja) * 2002-01-17 2007-05-09 ファブソリューション株式会社 膜厚測定方法および膜厚測定装置
JP3953821B2 (ja) * 2002-01-17 2007-08-08 ファブソリューション株式会社 膜厚測定方法および膜厚測定装置
JP4090303B2 (ja) * 2002-08-08 2008-05-28 株式会社日立ハイテクノロジーズ 電子ビーム計測用センサー及び電子ビーム計測方法
US7459913B2 (en) * 2004-08-13 2008-12-02 International Business Machines Corporation Methods for the determination of film continuity and growth modes in thin dielectric films
US7162133B2 (en) * 2004-08-20 2007-01-09 Agency For Science Technology And Research Method to trim and smooth high index contrast waveguide structures
JP4987486B2 (ja) * 2005-01-07 2012-07-25 エスアイアイ・ナノテクノロジー株式会社 薄膜試料測定方法および装置ならびに薄膜試料作製方法および装置
JP2008034475A (ja) * 2006-07-26 2008-02-14 Renesas Technology Corp 半導体装置の製造方法
PT2251454E (pt) 2009-05-13 2014-10-01 Sio2 Medical Products Inc Revestimento e inspeção de vaso
US7985188B2 (en) 2009-05-13 2011-07-26 Cv Holdings Llc Vessel, coating, inspection and processing apparatus
US9458536B2 (en) 2009-07-02 2016-10-04 Sio2 Medical Products, Inc. PECVD coating methods for capped syringes, cartridges and other articles
JP2011029271A (ja) * 2009-07-22 2011-02-10 Micronics Japan Co Ltd 薄膜特性測定装置及び方法、並びに、薄膜加工装置及び方法
US11624115B2 (en) 2010-05-12 2023-04-11 Sio2 Medical Products, Inc. Syringe with PECVD lubrication
US9878101B2 (en) 2010-11-12 2018-01-30 Sio2 Medical Products, Inc. Cyclic olefin polymer vessels and vessel coating methods
US9272095B2 (en) 2011-04-01 2016-03-01 Sio2 Medical Products, Inc. Vessels, contact surfaces, and coating and inspection apparatus and methods
JP5754296B2 (ja) * 2011-08-18 2015-07-29 Ｊｆｅスチール株式会社 膜厚均一性評価方法
JP5754297B2 (ja) * 2011-08-18 2015-07-29 Ｊｆｅスチール株式会社 膜厚均一性評価方法
CA2855353C (en) 2011-11-11 2021-01-19 Sio2 Medical Products, Inc. Passivation, ph protective or lubricity coating for pharmaceutical package, coating process and apparatus
US11116695B2 (en) 2011-11-11 2021-09-14 Sio2 Medical Products, Inc. Blood sample collection tube
EP2846755A1 (en) 2012-05-09 2015-03-18 SiO2 Medical Products, Inc. Saccharide protective coating for pharmaceutical package
US20150297800A1 (en) 2012-07-03 2015-10-22 Sio2 Medical Products, Inc. SiOx BARRIER FOR PHARMACEUTICAL PACKAGE AND COATING PROCESS
US9664626B2 (en) 2012-11-01 2017-05-30 Sio2 Medical Products, Inc. Coating inspection method
WO2014078666A1 (en) 2012-11-16 2014-05-22 Sio2 Medical Products, Inc. Method and apparatus for detecting rapid barrier coating integrity characteristics
US9764093B2 (en) 2012-11-30 2017-09-19 Sio2 Medical Products, Inc. Controlling the uniformity of PECVD deposition
AU2013352436B2 (en) 2012-11-30 2018-10-25 Sio2 Medical Products, Inc. Controlling the uniformity of PECVD deposition on medical syringes, cartridges, and the like
US9662450B2 (en) 2013-03-01 2017-05-30 Sio2 Medical Products, Inc. Plasma or CVD pre-treatment for lubricated pharmaceutical package, coating process and apparatus
CN105392916B (zh) 2013-03-11 2019-03-08 Sio2医药产品公司 涂布包装材料
US9937099B2 (en) 2013-03-11 2018-04-10 Sio2 Medical Products, Inc. Trilayer coated pharmaceutical packaging with low oxygen transmission rate
EP2971227B1 (en) 2013-03-15 2017-11-15 Si02 Medical Products, Inc. Coating method.
WO2015148471A1 (en) 2014-03-28 2015-10-01 Sio2 Medical Products, Inc. Antistatic coatings for plastic vessels
US10203202B2 (en) * 2014-04-07 2019-02-12 John Weber Schultz Non-contact determination of coating thickness
KR101630798B1 (ko) * 2014-11-05 2016-06-15 한국표준과학연구원 코팅 두께 측정 장치 및 방법
KR102786617B1 (ko) 2015-08-18 2025-03-26 에스아이오2 메디컬 프로덕츠, 엘엘씨 산소 전달률이 낮은, 의약품 및 다른 제품의 포장용기
CN105470162B (zh) * 2016-01-08 2019-07-02 武汉新芯集成电路制造有限公司 一种侦测接触孔缺陷的方法
US11410830B1 (en) 2019-03-23 2022-08-09 Kla Corporation Defect inspection and review using transmissive current image of charged particle beam system
EP4099091B1 (en) 2021-06-02 2024-04-10 IMEC vzw Pattern height metrology using an e-beam system

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS639807A (ja) 1986-06-30 1988-01-16 Nec Corp 膜厚測定方法およびその装置
US5162240A (en) * 1989-06-16 1992-11-10 Hitachi, Ltd. Method and apparatus of fabricating electric circuit pattern on thick and thin film hybrid multilayer wiring substrate
JPH0817166B2 (ja) * 1991-04-27 1996-02-21 信越半導体株式会社 超薄膜ｓｏｉ基板の製造方法及び製造装置
JPH06273297A (ja) 1993-03-19 1994-09-30 Casio Comput Co Ltd イオンビームによるエッチング方法
JP3058394B2 (ja) 1994-06-23 2000-07-04 シャープ株式会社 透過電子顕微鏡用断面試料作成方法
JP3075535B2 (ja) * 1998-05-01 2000-08-14 キヤノン株式会社 電子放出素子、電子源及び画像形成装置の製造方法
JP3292159B2 (ja) 1998-12-10 2002-06-17 日本電気株式会社 膜厚測定装置および膜厚測定方法
JP3953821B2 (ja) * 2002-01-17 2007-08-08 ファブソリューション株式会社 膜厚測定方法および膜厚測定装置
JP3913555B2 (ja) * 2002-01-17 2007-05-09 ファブソリューション株式会社 膜厚測定方法および膜厚測定装置

Also Published As

Publication number Publication date
KR20030063129A (ko) 2003-07-28
JP3953821B2 (ja) 2007-08-08
JP2003214831A (ja) 2003-07-30
TW580560B (en) 2004-03-21
US6683308B2 (en) 2004-01-27
TW200302341A (en) 2003-08-01
US20030132381A1 (en) 2003-07-17

Similar Documents

Publication Publication Date Title
KR100526668B1 (ko) 박막두께측정방법 및 장치
KR100526669B1 (ko) 막두께측정장치 및 막두께측정방법
US7518109B2 (en) Method and apparatus of measuring thin film sample and method and apparatus of fabricating thin film sample
JP5075431B2 (ja) 帯電測定方法、焦点調整方法、及び走査電子顕微鏡
US20070272858A1 (en) Charged particle beam apparatus and pattern measuring method
KR100614238B1 (ko) 기판 측정 장치 및 기판 측정 방법
Rishton et al. Measurement of the profile of finely focused electron beams in a scanning electron microscope
US6420702B1 (en) Non-charging critical dimension SEM metrology standard
US7910885B2 (en) System and method for determining a cross sectional feature of a structural element using a reference structural element
JP2001273865A (ja) 走査型電子顕微鏡装置とその制御方法
JP5074262B2 (ja) 帯電電位測定方法、及び荷電粒子顕微鏡
JP4095510B2 (ja) 表面電位測定方法及び試料観察方法
US7235794B2 (en) System and method for inspecting charged particle responsive resist
US20060011869A1 (en) Measurement method of electron beam current, electron beam lithography method and system
JP2001221755A (ja) 二次イオン質量分析法
JP4053913B2 (ja) 試料観察装置、エッジ位置算出装置、及びプログラム
JP2004064006A (ja) 非破壊測定装置および半導体装置製造方法
JP5391942B2 (ja) 二次イオン質量分析における一次イオンエネルギー補正方法
JP6740736B2 (ja) 元素分布測定方法及び元素分布測定装置
JP2012013502A (ja) イオン散乱分光測定方法及びイオン散乱分光測定装置
JPS63308510A (ja) 荷電ビ−ム測長法および測長装置
Ballarotto et al. A Study of Photoelectron Emission Microscopy Contrast Mechanisms Relevant to Microelectronics
JP2006514408A5 (https=)
JP2006514408A (ja) 帯電粒子ビームの角状変位を測定および縮小するための方法
JPH0580133A (ja) 半導体集積回路試験装置

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

N231 Notification of change of applicant
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20121002

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20131001

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20141101

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20141101