KR100501961B1 - 화학기계연마용플래튼코팅구조및방법 - Google Patents

화학기계연마용플래튼코팅구조및방법 Download PDF

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Publication number
KR100501961B1
KR100501961B1 KR1019970066581A KR19970066581A KR100501961B1 KR 100501961 B1 KR100501961 B1 KR 100501961B1 KR 1019970066581 A KR1019970066581 A KR 1019970066581A KR 19970066581 A KR19970066581 A KR 19970066581A KR 100501961 B1 KR100501961 B1 KR 100501961B1
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KR
South Korea
Prior art keywords
coating
platen
substrate
resistant metal
heat resistant
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Expired - Fee Related
Application number
KR1019970066581A
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English (en)
Korean (ko)
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KR19980063880A (ko
Inventor
제임스에프. 배널
Original Assignee
프리스케일 세미컨덕터, 인크.
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Publication date
Application filed by 프리스케일 세미컨덕터, 인크. filed Critical 프리스케일 세미컨덕터, 인크.
Publication of KR19980063880A publication Critical patent/KR19980063880A/ko
Application granted granted Critical
Publication of KR100501961B1 publication Critical patent/KR100501961B1/ko
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
    • C23C4/10—Oxides, borides, carbides, nitrides or silicides; Mixtures thereof
    • C23C4/11—Oxides

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Physics & Mathematics (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1019970066581A 1996-12-02 1997-12-02 화학기계연마용플래튼코팅구조및방법 Expired - Fee Related KR100501961B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/755,870 US5743788A (en) 1996-12-02 1996-12-02 Platen coating structure for chemical mechanical polishing and method
US08/755,870 1996-12-02
US8/755,870 1996-12-02

Publications (2)

Publication Number Publication Date
KR19980063880A KR19980063880A (ko) 1998-10-07
KR100501961B1 true KR100501961B1 (ko) 2005-10-06

Family

ID=25041012

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970066581A Expired - Fee Related KR100501961B1 (ko) 1996-12-02 1997-12-02 화학기계연마용플래튼코팅구조및방법

Country Status (7)

Country Link
US (1) US5743788A (https=)
EP (1) EP0850725B1 (https=)
JP (1) JPH10156709A (https=)
KR (1) KR100501961B1 (https=)
CN (1) CN1161211C (https=)
DE (1) DE69716866T2 (https=)
TW (1) TW351835B (https=)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5964413A (en) * 1997-11-05 1999-10-12 Mok; Peter Apparatus for dispensing slurry
JPH11333703A (ja) * 1998-05-28 1999-12-07 Speedfam-Ipec Co Ltd ポリッシング加工機
JPH11347921A (ja) * 1998-06-05 1999-12-21 Memc Kk シリコンウェーハの研磨方法
US6036586A (en) * 1998-07-29 2000-03-14 Micron Technology, Inc. Apparatus and method for reducing removal forces for CMP pads
US20040053566A1 (en) * 2001-01-12 2004-03-18 Applied Materials, Inc. CMP platen with patterned surface
US6220942B1 (en) * 1999-04-02 2001-04-24 Applied Materials, Inc. CMP platen with patterned surface
FR2791917B1 (fr) * 1999-04-06 2001-06-22 Prec Machines Outils Procede de realisation d'une machine a rectifier de precision du type comprenant un bati et machine a rectifier de precision correspondante
US6468135B1 (en) 1999-04-30 2002-10-22 International Business Machines Corporation Method and apparatus for multiphase chemical mechanical polishing
US6363599B1 (en) 1999-08-04 2002-04-02 Komag, Inc. Method for manufacturing a magnetic disk including a glass substrate
AU7851000A (en) * 1999-10-08 2001-04-23 Speed-Fam-Ipec Corporation Optimal offset, pad size and pad shape for cmp buffing and polishing
US6793561B2 (en) 1999-10-14 2004-09-21 International Business Machines Corporation Removable/disposable platen top
US6422921B1 (en) 1999-10-22 2002-07-23 Applied Materials, Inc. Heat activated detachable polishing pad
US6203417B1 (en) * 1999-11-05 2001-03-20 Speedfam-Ipec Corporation Chemical mechanical polishing tool components with improved corrosion resistance
US6264536B1 (en) * 2000-02-01 2001-07-24 Lucent Technologies Inc. Reducing polish platen corrosion during integrated circuit fabrication
US6599175B2 (en) 2001-08-06 2003-07-29 Speedfam-Ipeca Corporation Apparatus for distributing a fluid through a polishing pad
US7040957B2 (en) * 2002-08-14 2006-05-09 Novellus Systems Inc. Platen and manifold for polishing workpieces
US6951504B2 (en) * 2003-03-20 2005-10-04 3M Innovative Properties Company Abrasive article with agglomerates and method of use
KR100810893B1 (ko) 2003-12-31 2008-03-07 동부일렉트로닉스 주식회사 씨엠피 장비용 평면 코팅 장치
JP5065574B2 (ja) * 2005-01-12 2012-11-07 住友電気工業株式会社 ＧａＮ基板の研磨方法
CN102380818A (zh) * 2010-09-01 2012-03-21 无锡华润上华半导体有限公司 化学机械研磨方法和研磨设备
US9719166B2 (en) 2011-06-21 2017-08-01 Spts Technologies Limited Method of supporting a workpiece during physical vapour deposition
GB201110476D0 (en) * 2011-06-21 2011-08-03 Spp Process Technology Systems Uk Ltd A method of supporting a workpiece during physical vapour deposition
CN103659576A (zh) * 2012-09-20 2014-03-26 苏州赫瑞特电子专用设备科技有限公司 一种单面研磨抛光机的研磨抛光盘
CN103276214B (zh) * 2013-05-30 2014-11-19 上海交通大学 利用电镀废水制备防腐蚀涂层的方法
US11397139B2 (en) * 2017-02-27 2022-07-26 Leco Corporation Metallographic grinder and components thereof
WO2018175758A1 (en) * 2017-03-24 2018-09-27 Axus Technology, Llc Atmospheric plasma in wafer processing system optimization
KR102699594B1 (ko) * 2019-05-31 2024-08-28 어플라이드 머티어리얼스, 인코포레이티드 연마 플래튼들 및 연마 플래튼 제조 방법들
CN115488754B (zh) * 2022-09-30 2024-12-24 上海芯物科技有限公司 Cmp自动贴膜装置及方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995029039A1 (en) * 1994-04-22 1995-11-02 Kabushiki Kaisha Toshiba Separation type grinding surface plate and grinding apparatus using same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5855562A (ja) * 1981-09-28 1983-04-01 Hitachi Ltd 研磨皿とその製造方法
GB9010833D0 (en) * 1990-05-15 1990-07-04 Electrotech Research Limited Workpiece support
US5558717A (en) * 1994-11-30 1996-09-24 Applied Materials CVD Processing chamber
US5533923A (en) * 1995-04-10 1996-07-09 Applied Materials, Inc. Chemical-mechanical polishing pad providing polishing unformity

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995029039A1 (en) * 1994-04-22 1995-11-02 Kabushiki Kaisha Toshiba Separation type grinding surface plate and grinding apparatus using same

Also Published As

Publication number Publication date
DE69716866T2 (de) 2003-03-27
CN1161211C (zh) 2004-08-11
US5743788A (en) 1998-04-28
EP0850725A3 (en) 1999-01-13
TW351835B (en) 1999-02-01
EP0850725A2 (en) 1998-07-01
DE69716866D1 (de) 2002-12-12
EP0850725B1 (en) 2002-11-06
JPH10156709A (ja) 1998-06-16
CN1184019A (zh) 1998-06-10
KR19980063880A (ko) 1998-10-07

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