KR100488959B1 - 다결정 실리콘 박막트랜지스터의 제조 방법 - Google Patents
다결정 실리콘 박막트랜지스터의 제조 방법 Download PDFInfo
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- KR100488959B1 KR100488959B1 KR10-2002-0012457A KR20020012457A KR100488959B1 KR 100488959 B1 KR100488959 B1 KR 100488959B1 KR 20020012457 A KR20020012457 A KR 20020012457A KR 100488959 B1 KR100488959 B1 KR 100488959B1
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- South Korea
- Prior art keywords
- amorphous silicon
- silicon film
- metal
- phosphorus
- film
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 229910021420 polycrystalline silicon Inorganic materials 0.000 title claims abstract description 25
- 239000010408 film Substances 0.000 claims abstract description 56
- 239000002184 metal Substances 0.000 claims abstract description 49
- 229910052751 metal Inorganic materials 0.000 claims abstract description 49
- 229910021417 amorphous silicon Inorganic materials 0.000 claims abstract description 33
- 238000002425 crystallisation Methods 0.000 claims abstract description 31
- 230000008025 crystallization Effects 0.000 claims abstract description 29
- 239000010409 thin film Substances 0.000 claims abstract description 27
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 25
- 239000011574 phosphorus Substances 0.000 claims abstract description 25
- 238000005247 gettering Methods 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 239000012535 impurity Substances 0.000 claims abstract description 10
- 238000005468 ion implantation Methods 0.000 claims abstract description 9
- 238000005224 laser annealing Methods 0.000 claims abstract description 9
- 239000011521 glass Substances 0.000 claims abstract description 6
- 238000000059 patterning Methods 0.000 claims abstract description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 9
- 238000004544 sputter deposition Methods 0.000 claims description 9
- 238000007598 dipping method Methods 0.000 claims description 6
- 238000001771 vacuum deposition Methods 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- -1 paradium Chemical compound 0.000 claims description 2
- 150000002500 ions Chemical class 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 4
- 238000000137 annealing Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66757—Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02672—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using crystallisation enhancing elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H01L21/02686—Pulsed laser beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
- H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
- H01L21/3226—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering of silicon on insulator
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
- H01L29/78672—Polycrystalline or microcrystalline silicon transistor
- H01L29/78675—Polycrystalline or microcrystalline silicon transistor with normal-type structure, e.g. with top gate
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Ceramic Engineering (AREA)
- Recrystallisation Techniques (AREA)
Abstract
Description
Claims (7)
- 유리기판 상에 인(P) 레이어를 형성하는 단계;상기 인(P) 레이어 상에 비정질 실리콘막을 형성하는 단계;상기 비정질 실리콘막과 인(P) 레이어를 패터닝하여 액티브 영역을 형성하는 단계;상기 액티브 영역으로 패터닝된 비정질 실리콘막 상에 게이트 절연막과 게이트 전극을 차례로 형성하는 단계;상기 기판 결과물 상에 금속유도 측면결정화를 위한 금속막을 형성하는 단계;상기 게이트 전극 양측의 비정질 실리콘막 내에 소오스/드레인 오믹 콘택을 위한 이온주입을 수행하는 단계; 및상기 기판 결과물을 열처리 또는 엑시머 레이저 어닐링하는 것을 통해 비정질 실리콘막을 다결정 실리콘막으로 결정화시킴과 아울러 게이트 전극 아래의 채널내 금속 불순물을 제거하는 게터링이 이루어지도록 하는 단계를 포함하는 것을 특징으로 하는 다결정 실리콘 박막트랜지스터의 제조 방법.
- 제 1 항에 있어서, 상기 인(P) 레이어는 진공 증착, 스퍼터링 및 용액 디핑으로 구성된 그룹으로부터 선택되는 어느 하나의 방법을 이용하여 형성하는 것을 특징으로 하는 다결정 실리콘 박막트랜지스터의 제조 방법.
- 제 1 항에 있어서, 상기 인(P) 레이어는 0.1∼1000Å 두께로 형성하는 것을 특징으로 하는 다결정 실리콘 박막트랜지스터의 제조 방법.
- 제 1 항에 있어서, 상기 비정질 실리콘막은 진공 증착 또는 스퍼터링 방법으로 형성하는 것을 특징으로 하는 다결정 실리콘 박막트랜지스터의 제조 방법.
- 제 1 항에 있어서, 상기 금속막은 니켈, 패러디움, 구리 및 코발트로 구성된 그룹으로부터 선택되는 어느 하나를 사용하여 0.1∼500Å 두께로 형성하는 것을 특징으로 하는 다결정 실리콘 박막트랜지스터의 제조 방법.
- 제 1 항에 있어서,상기 금속막은 스퍼터링 또는 용액 디핑법을 사용하여 형성하는 것을 특징으로 하는 다결정 실리콘 박막트랜지스터의 제조 방법.
- 제 1 항에 있어서, 상기 게터링은 상기 비정질 실리콘막의 결정화와 동시에 이루어지도록 하거나, 또는, 상기 비정질 실리콘막의 결정화 후, 추가 열처리 또는 엑시머 레이저 어닐링을 수행하는 것에 의해 이루어지도록 하는 것을 특징으로 하는 다결정 실리콘 박막트랜지스터의 제조 방법.
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KR10-2002-0012457A KR100488959B1 (ko) | 2002-03-08 | 2002-03-08 | 다결정 실리콘 박막트랜지스터의 제조 방법 |
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KR10-2002-0012457A KR100488959B1 (ko) | 2002-03-08 | 2002-03-08 | 다결정 실리콘 박막트랜지스터의 제조 방법 |
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KR20030073076A KR20030073076A (ko) | 2003-09-19 |
KR100488959B1 true KR100488959B1 (ko) | 2005-05-11 |
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Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100848341B1 (ko) | 2007-06-13 | 2008-07-25 | 삼성에스디아이 주식회사 | 박막트랜지스터, 그의 제조방법, 및 이를 포함하는유기전계발광표시장치 |
KR100889626B1 (ko) | 2007-08-22 | 2009-03-20 | 삼성모바일디스플레이주식회사 | 박막트랜지스터, 그의 제조방법, 이를 구비한유기전계발광표시장치, 및 그의 제조방법 |
KR100889627B1 (ko) | 2007-08-23 | 2009-03-20 | 삼성모바일디스플레이주식회사 | 박막트랜지스터, 그의 제조방법, 및 이를 구비한유기전계발광표시장치 |
KR100982310B1 (ko) | 2008-03-27 | 2010-09-15 | 삼성모바일디스플레이주식회사 | 박막트랜지스터, 그의 제조방법, 및 이를 포함하는유기전계발광표시장치 |
KR101002666B1 (ko) | 2008-07-14 | 2010-12-21 | 삼성모바일디스플레이주식회사 | 박막트랜지스터, 그의 제조방법, 및 이를 포함하는유기전계발광표시장치 |
KR101733196B1 (ko) | 2010-09-03 | 2017-05-25 | 삼성디스플레이 주식회사 | 박막 트랜지스터, 이의 제조 방법, 및 이를 구비한 표시 장치 |
CN102709185A (zh) * | 2011-07-25 | 2012-10-03 | 京东方科技集团股份有限公司 | 含有多晶硅有源层的薄膜晶体管、其制造方法及阵列基板 |
US11024736B2 (en) | 2019-08-09 | 2021-06-01 | Micron Technology, Inc. | Transistor and methods of forming integrated circuitry |
CN114270530A (zh) | 2019-08-09 | 2022-04-01 | 美光科技公司 | 晶体管及形成晶体管的方法 |
US11637175B2 (en) | 2020-12-09 | 2023-04-25 | Micron Technology, Inc. | Vertical transistors |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10242476A (ja) * | 1997-02-26 | 1998-09-11 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
JPH1197352A (ja) * | 1997-07-24 | 1999-04-09 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
KR100265179B1 (ko) * | 1995-03-27 | 2000-09-15 | 야마자끼 순페이 | 반도체장치와 그의 제작방법 |
KR20020090429A (ko) * | 2001-05-25 | 2002-12-05 | 엘지.필립스 엘시디 주식회사 | 다결정화 방법과 이를 이용한 박막트랜지스터 제조방법 및액정표시장치 제조방법 |
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2002
- 2002-03-08 KR KR10-2002-0012457A patent/KR100488959B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100265179B1 (ko) * | 1995-03-27 | 2000-09-15 | 야마자끼 순페이 | 반도체장치와 그의 제작방법 |
JPH10242476A (ja) * | 1997-02-26 | 1998-09-11 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
JPH1197352A (ja) * | 1997-07-24 | 1999-04-09 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
KR20020090429A (ko) * | 2001-05-25 | 2002-12-05 | 엘지.필립스 엘시디 주식회사 | 다결정화 방법과 이를 이용한 박막트랜지스터 제조방법 및액정표시장치 제조방법 |
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