KR100472856B1 - 반도체 소자의 금속 배선 형성 방법 - Google Patents
반도체 소자의 금속 배선 형성 방법 Download PDFInfo
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- KR100472856B1 KR100472856B1 KR10-2002-0085427A KR20020085427A KR100472856B1 KR 100472856 B1 KR100472856 B1 KR 100472856B1 KR 20020085427 A KR20020085427 A KR 20020085427A KR 100472856 B1 KR100472856 B1 KR 100472856B1
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- metal wiring
- semiconductor device
- metal layer
- electroless plating
- barrier metal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
- H01L21/2855—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System by physical means, e.g. sputtering, evaporation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76807—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
Abstract
Description
Claims (13)
- 층간 절연막에 콘택홀이 형성되어 하부 구조의 소정 영역이 노출되는 반도체 기판이 제공되는 단계;전체 상부 표면에 장벽 금속층을 형성하는 단계;상기 콘택홀 저면의 상기 하부 구조 상에 형성된 상기 장벽 금속층을 선택적으로 제거하여 상기 하부 구조의 상부 표면을 노출시키는 단계;상기 노출된 하부 구조를 포함한 전체 상부 표면에 산화 방지막을 형성하는 단계; 및상기 기판을 무전해 도금액에 침전시켜, 상기 산화 방지막이 제거되면서 노출되는 상기 하부 구조의 표면으로부터 도금층을 성장시키는 단계를 포함하는 것을 특징으로 하는 반도체 소자의 금속 배선 형성 방법.
- 제 1 항에 있어서,상기 장벽 금속층은 화학기상 증착법이나 물리기상 증착법으로 Ta, TaN, TaC, WN, TiW, WBN 또는 WC을 증착하여 형성하는 것을 특징으로 하는 반도체 소자의 금속 배선 형성 방법.
- 제 1 항에 있어서,상기 장벽 금속층은 PVD 모듈에서 리스퍼터링 방법으로 제거하는 것을 특징으로 하는 반도체 소자의 금속 배선 형성 방법.
- 제 3 항에 있어서,상기 리스퍼터링 방법은 13.56MHz rf 제네레이터를 이용하여 50 내지 1000W의 rf 파워를 인가하고, 플라즈마 형성을 위한 DC 파워를 1 내지 30kW 인가한 상태에서 전이 금속을 이용하여 실시하는 것을 특징으로 하는 반도체 소자의 금속 배선 형성 방법.
- 제 4 항에 있어서,상기 전이 금속으로 Ta, Ti 또는 W의 전이 금속을 사용하는 것을 특징으로 하는 반도체 소자의 금속 배선 형성 방법.
- 제 1 항에 있어서,상기 산화 방지막은 상기 무전해 도금액의 pH를 고려하여 상기 무전해 도금액에 쉽게 부식될 수 있는 물질로 형성하는 것을 특징으로 하는 반도체 소자의 금속 배선 형성 방법.
- 제 1 항에 있어서,상기 산화 방지막은 알루미늄으로 형성하는 것을 특징으로 하는 반도체 소자의 금속 배선 형성 방법.
- 제 1 항 또는 제 7 항에 있어서,상기 산화 방지막은 상기 장벽 금속층을 제거한 챔버에서 인-시투로 형성되는 것을 특징으로 하는 반도체 소자의 금속 배선 형성 방법.
- 제 1 항 또는 제 7 항에 있어서,상기 산화 방지막은 20 내지 2000Å의 두께로 형성하는 것을 특징으로 하는 반도체 소자의 금속 배선 형성 방법.
- 제 1 항에 있어서,상기 무전해 도금액은 구리를 도금하는 경우 Cu2+가 10-4 내지 101 의 M(mol/L)이고 pH는 10 내지 13인 것을 특징으로 하는 반도체 소자의 금속 배선 형성 방법.
- 제 10 항에 있어서,상기 무전해 도금액의 온도는 20 내지 100℃로 유지하는 것을 특징으로 하는 반도체 소자의 금속 배선 형성 방법.
- 제 1 항에 있어서, 상기 도금층을 형성한 후,상기 층간 절연막의 상부 표면이 노출되도록 화학적 기계적 연마 공정을 실시하여 상기 층간 절연막 상부의 상기 장벽 금속층과, 상기 층간 절연막의 표면 상부로 돌출된 상기 도금층을 제거하는 단계; 및소정의 세정 공정을 실시하고 열처리를 실시하는 단계를 더 포함하는 것을 특징으로 하는 반도체 소자의 금속 배선 형성 방법.
- 제 12 항에 있어서,상기 열처리 공정은 150 내지 450℃의 온도에서 실시하는 것을 특징으로 하는 반도체 소자의 금속 배선 형성 방법.
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KR10-2002-0085427A KR100472856B1 (ko) | 2002-12-27 | 2002-12-27 | 반도체 소자의 금속 배선 형성 방법 |
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KR10-2002-0085427A KR100472856B1 (ko) | 2002-12-27 | 2002-12-27 | 반도체 소자의 금속 배선 형성 방법 |
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KR20040058909A KR20040058909A (ko) | 2004-07-05 |
KR100472856B1 true KR100472856B1 (ko) | 2005-03-10 |
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KR101127025B1 (ko) * | 2004-12-07 | 2012-03-26 | 매그나칩 반도체 유한회사 | 반도체 소자의 구리 배선 형성방법 |
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