KR100451291B1 - 패러데이케이지 - Google Patents
패러데이케이지 Download PDFInfo
- Publication number
- KR100451291B1 KR100451291B1 KR1019970017206A KR19970017206A KR100451291B1 KR 100451291 B1 KR100451291 B1 KR 100451291B1 KR 1019970017206 A KR1019970017206 A KR 1019970017206A KR 19970017206 A KR19970017206 A KR 19970017206A KR 100451291 B1 KR100451291 B1 KR 100451291B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- housing
- conductive
- adhesive
- pwb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/643,292 | 1996-05-08 | ||
| US08/643,292 US5761053A (en) | 1996-05-08 | 1996-05-08 | Faraday cage |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970078796A KR970078796A (ko) | 1997-12-12 |
| KR100451291B1 true KR100451291B1 (ko) | 2005-01-13 |
Family
ID=24580167
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019970017206A Expired - Lifetime KR100451291B1 (ko) | 1996-05-08 | 1997-05-06 | 패러데이케이지 |
| KR1019970017207A Expired - Lifetime KR100455015B1 (ko) | 1996-05-08 | 1997-05-06 | 전자기장애/고주파간섭방해로부터전자소자를차폐하는리드어셈블리 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019970017207A Expired - Lifetime KR100455015B1 (ko) | 1996-05-08 | 1997-05-06 | 전자기장애/고주파간섭방해로부터전자소자를차폐하는리드어셈블리 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US5761053A (enExample) |
| EP (1) | EP0806892B1 (enExample) |
| JP (1) | JPH1070387A (enExample) |
| KR (2) | KR100451291B1 (enExample) |
| DE (1) | DE69700261T2 (enExample) |
| ES (1) | ES2132997T3 (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100864568B1 (ko) * | 2002-02-27 | 2008-10-20 | 후지쯔 가부시끼가이샤 | 금속 하우징 |
| KR20190044295A (ko) * | 2017-10-20 | 2019-04-30 | 주식회사 엘지화학 | 파라데이 상자를 이용한 플라즈마 식각 방법 |
| KR20190077810A (ko) * | 2017-12-26 | 2019-07-04 | 주식회사 엘지화학 | 파라데이 상자를 이용한 플라즈마 식각 방법 |
| KR20200002162A (ko) * | 2018-06-29 | 2020-01-08 | 주식회사 엘지화학 | 파라데이 상자를 이용한 플라즈마 식각 방법 |
| KR20200002161A (ko) * | 2018-06-29 | 2020-01-08 | 주식회사 엘지화학 | 파라데이 상자를 이용한 플라즈마 식각 방법 |
Families Citing this family (119)
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| SE511926C2 (sv) * | 1997-04-16 | 1999-12-20 | Ericsson Telefon Ab L M | Skärmningshölje jämte förfarande för framställning och användning av ett skärmningshölje samt mobiltelefon med skärmningshölje |
| SE511330C2 (sv) * | 1997-12-29 | 1999-09-13 | Ericsson Telefon Ab L M | Förfarande för framställning av ett kretskort jämte skärmningselement för skärmning av komponenter på ett dylikt kretskort |
| US6613976B1 (en) * | 1998-12-15 | 2003-09-02 | Vanguard Products Corporation | Electromagnetic interference shielding gasket |
| US6673460B2 (en) * | 1999-02-04 | 2004-01-06 | Bridgestone Corporation | Composite structure and production method thereof |
| JP3714088B2 (ja) * | 1999-02-18 | 2005-11-09 | 株式会社村田製作所 | 電子部品及びその製造方法 |
| JP3287330B2 (ja) * | 1999-04-22 | 2002-06-04 | 日本電気株式会社 | 高周波回路のシールド構造 |
| US7596409B2 (en) * | 1999-06-07 | 2009-09-29 | The Johns Hopkins University | Cardiac shock electrode system and corresponding implantable defibrillator system |
| AU6951500A (en) | 1999-06-07 | 2000-12-28 | Johns Hopkins University, The | Cardiac shock electrode system and corresponding implantable defibrillator system |
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| JP2001237585A (ja) * | 2000-02-22 | 2001-08-31 | Murata Mfg Co Ltd | 電子部品及びその製造方法 |
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| DE10026353A1 (de) * | 2000-05-27 | 2001-11-29 | Mannesmann Vdo Ag | Abgeschirmte, elektronische Schaltung |
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| NL1016549C2 (nl) * | 2000-10-06 | 2002-04-10 | Stork Screens Bv | Werkwijze voor het vervaardigen van een tegen stoorstraling beschermde kaart met een gedrukte schakeling. |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100864568B1 (ko) * | 2002-02-27 | 2008-10-20 | 후지쯔 가부시끼가이샤 | 금속 하우징 |
| KR20190044295A (ko) * | 2017-10-20 | 2019-04-30 | 주식회사 엘지화학 | 파라데이 상자를 이용한 플라즈마 식각 방법 |
| US11276561B2 (en) | 2017-10-20 | 2022-03-15 | Lg Chem, Ltd. | Plasma etching method using Faraday cage |
| KR102273971B1 (ko) * | 2017-10-20 | 2021-07-07 | 주식회사 엘지화학 | 파라데이 상자를 이용한 플라즈마 식각 방법 |
| KR102273970B1 (ko) * | 2017-12-26 | 2021-07-07 | 주식회사 엘지화학 | 파라데이 상자를 이용한 플라즈마 식각 방법 |
| KR20190077810A (ko) * | 2017-12-26 | 2019-07-04 | 주식회사 엘지화학 | 파라데이 상자를 이용한 플라즈마 식각 방법 |
| US11462393B2 (en) | 2017-12-26 | 2022-10-04 | Lg Chem, Ltd. | Plasma etching method using faraday cage |
| JP2021509490A (ja) * | 2017-12-26 | 2021-03-25 | エルジー・ケム・リミテッド | ファラデーケージを用いたプラズマエッチング方法 |
| KR102273084B1 (ko) * | 2018-06-29 | 2021-07-06 | 주식회사 엘지화학 | 파라데이 상자를 이용한 플라즈마 식각 방법 |
| US11276563B2 (en) | 2018-06-29 | 2022-03-15 | Lg Chem, Ltd. | Plasma etching method using faraday box |
| KR20200002161A (ko) * | 2018-06-29 | 2020-01-08 | 주식회사 엘지화학 | 파라데이 상자를 이용한 플라즈마 식각 방법 |
| KR20200002162A (ko) * | 2018-06-29 | 2020-01-08 | 주식회사 엘지화학 | 파라데이 상자를 이용한 플라즈마 식각 방법 |
| KR102548183B1 (ko) | 2018-06-29 | 2023-06-28 | 주식회사 엘지화학 | 파라데이 상자를 이용한 플라즈마 식각 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100455015B1 (ko) | 2005-01-17 |
| JPH1070387A (ja) | 1998-03-10 |
| KR970078796A (ko) | 1997-12-12 |
| EP0806892A1 (en) | 1997-11-12 |
| DE69700261T2 (de) | 1999-12-30 |
| DE69700261D1 (de) | 1999-07-15 |
| ES2132997T3 (es) | 1999-08-16 |
| EP0806892B1 (en) | 1999-06-09 |
| US5763824A (en) | 1998-06-09 |
| US5761053A (en) | 1998-06-02 |
| KR19980032113A (ko) | 1998-07-25 |
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