JPH1070387A - ファラデーケージ - Google Patents
ファラデーケージInfo
- Publication number
- JPH1070387A JPH1070387A JP9113969A JP11396997A JPH1070387A JP H1070387 A JPH1070387 A JP H1070387A JP 9113969 A JP9113969 A JP 9113969A JP 11396997 A JP11396997 A JP 11396997A JP H1070387 A JPH1070387 A JP H1070387A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- conductive
- housing
- electronic component
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/643292 | 1996-05-08 | ||
| US08/643,292 US5761053A (en) | 1996-05-08 | 1996-05-08 | Faraday cage |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1070387A true JPH1070387A (ja) | 1998-03-10 |
| JPH1070387A5 JPH1070387A5 (enExample) | 2005-04-07 |
Family
ID=24580167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9113969A Pending JPH1070387A (ja) | 1996-05-08 | 1997-05-01 | ファラデーケージ |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US5761053A (enExample) |
| EP (1) | EP0806892B1 (enExample) |
| JP (1) | JPH1070387A (enExample) |
| KR (2) | KR100451291B1 (enExample) |
| DE (1) | DE69700261T2 (enExample) |
| ES (1) | ES2132997T3 (enExample) |
Families Citing this family (124)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE511926C2 (sv) * | 1997-04-16 | 1999-12-20 | Ericsson Telefon Ab L M | Skärmningshölje jämte förfarande för framställning och användning av ett skärmningshölje samt mobiltelefon med skärmningshölje |
| SE511330C2 (sv) * | 1997-12-29 | 1999-09-13 | Ericsson Telefon Ab L M | Förfarande för framställning av ett kretskort jämte skärmningselement för skärmning av komponenter på ett dylikt kretskort |
| US6613976B1 (en) * | 1998-12-15 | 2003-09-02 | Vanguard Products Corporation | Electromagnetic interference shielding gasket |
| US6673460B2 (en) * | 1999-02-04 | 2004-01-06 | Bridgestone Corporation | Composite structure and production method thereof |
| JP3714088B2 (ja) * | 1999-02-18 | 2005-11-09 | 株式会社村田製作所 | 電子部品及びその製造方法 |
| JP3287330B2 (ja) * | 1999-04-22 | 2002-06-04 | 日本電気株式会社 | 高周波回路のシールド構造 |
| US7596409B2 (en) * | 1999-06-07 | 2009-09-29 | The Johns Hopkins University | Cardiac shock electrode system and corresponding implantable defibrillator system |
| AU6951500A (en) | 1999-06-07 | 2000-12-28 | Johns Hopkins University, The | Cardiac shock electrode system and corresponding implantable defibrillator system |
| US6399875B1 (en) | 1999-08-13 | 2002-06-04 | Ptmw, Inc. | Lightning protected housing structure |
| US6271465B1 (en) * | 1999-08-31 | 2001-08-07 | Nokia Mobile Phones Limited | Low cost conformal EMI/RFI shield |
| KR100385976B1 (ko) * | 1999-12-30 | 2003-06-02 | 삼성전자주식회사 | 회로기판 및 그 제조방법 |
| JP2001237585A (ja) * | 2000-02-22 | 2001-08-31 | Murata Mfg Co Ltd | 電子部品及びその製造方法 |
| US6400015B1 (en) * | 2000-03-31 | 2002-06-04 | Intel Corporation | Method of creating shielded structures to protect semiconductor devices |
| DE10026353A1 (de) * | 2000-05-27 | 2001-11-29 | Mannesmann Vdo Ag | Abgeschirmte, elektronische Schaltung |
| US6757181B1 (en) * | 2000-08-22 | 2004-06-29 | Skyworks Solutions, Inc. | Molded shield structures and method for their fabrication |
| JP4137356B2 (ja) * | 2000-09-07 | 2008-08-20 | Tdk株式会社 | 表面弾性波素子を含む高周波モジュール部品の製造方法 |
| US6515352B1 (en) * | 2000-09-25 | 2003-02-04 | Micron Technology, Inc. | Shielding arrangement to protect a circuit from stray magnetic fields |
| NL1016549C2 (nl) * | 2000-10-06 | 2002-04-10 | Stork Screens Bv | Werkwijze voor het vervaardigen van een tegen stoorstraling beschermde kaart met een gedrukte schakeling. |
| WO2002043456A2 (en) * | 2000-11-20 | 2002-05-30 | Parker-Hannifin, Inc. | Interference mitigation through conductive thermoplastic composite materials |
| US7434305B2 (en) | 2000-11-28 | 2008-10-14 | Knowles Electronics, Llc. | Method of manufacturing a microphone |
| US8623710B1 (en) | 2000-11-28 | 2014-01-07 | Knowles Electronics, Llc | Methods of manufacture of bottom port multi-part surface mount silicon condenser microphone packages |
| KR100411206B1 (ko) * | 2001-02-19 | 2003-12-18 | 삼성전자주식회사 | 반도체 패키지 |
| US6844236B2 (en) * | 2001-07-23 | 2005-01-18 | Agere Systems Inc. | Method and structure for DC and RF shielding of integrated circuits |
| US6740959B2 (en) | 2001-08-01 | 2004-05-25 | International Business Machines Corporation | EMI shielding for semiconductor chip carriers |
| US20030130697A1 (en) * | 2001-10-23 | 2003-07-10 | Halperin Henry R. | System and/or method for refibrillation of the heart for treatment of post-countershock pulseless electrical activity and/or asystole |
| US6906396B2 (en) * | 2002-01-15 | 2005-06-14 | Micron Technology, Inc. | Magnetic shield for integrated circuit packaging |
| US7039361B1 (en) * | 2002-02-01 | 2006-05-02 | Ciena Corporation | System and method for reducing electromagnetic interference |
| JP3762313B2 (ja) * | 2002-02-27 | 2006-04-05 | 富士通株式会社 | 金属筐体 |
| US7033336B2 (en) * | 2002-03-29 | 2006-04-25 | Gore Enterprise Holdings, Inc. | Proximal catheter assembly having a relief valve |
| JP4024103B2 (ja) * | 2002-05-29 | 2007-12-19 | アルプス電気株式会社 | 高周波回路の接続構造 |
| US6952046B2 (en) | 2002-06-19 | 2005-10-04 | Foster-Miller, Inc. | Electronic and optoelectronic component packaging technique |
| JP4195975B2 (ja) * | 2002-10-16 | 2008-12-17 | パナソニック株式会社 | 高周波装置 |
| US20040079549A1 (en) * | 2002-10-29 | 2004-04-29 | Yu Yuan Liang | Conductive substrate structure |
| US6816372B2 (en) * | 2003-01-08 | 2004-11-09 | International Business Machines Corporation | System, method and apparatus for noise and heat suppression, and for managing cables in a computer system |
| US7259969B2 (en) * | 2003-02-26 | 2007-08-21 | Wavezero, Inc. | Methods and devices for connecting and grounding an EMI shield to a printed circuit board |
| US6927654B2 (en) * | 2003-02-26 | 2005-08-09 | Raytheon Company | Corrosion resistant waveguide system and method |
| US7248484B2 (en) * | 2003-03-12 | 2007-07-24 | Hewlett-Packard Development Company, L.P. | Electro-magnetic suppressive structure |
| JP4090928B2 (ja) * | 2003-03-31 | 2008-05-28 | 信越ポリマー株式会社 | シールドボックス |
| US7009106B2 (en) * | 2003-10-09 | 2006-03-07 | Bosch Security Systems, Inc. | Shielding assembly and method |
| USD599798S1 (en) | 2004-09-10 | 2009-09-08 | Hand Held Products, Inc. | Hand held computer device |
| US7446753B2 (en) * | 2004-09-10 | 2008-11-04 | Hand Held Products, Inc. | Hand held computer device |
| US7446265B2 (en) * | 2005-04-15 | 2008-11-04 | Parker Hannifin Corporation | Board level shielding module |
| US7728417B2 (en) * | 2005-05-27 | 2010-06-01 | Stats Chippac Ltd. | Integrated circuit package system including shield |
| EP1969913A1 (en) * | 2005-12-13 | 2008-09-17 | MALECKI, Zbigniew | System and method for excluding electromagnetic waves from a protected region |
| US20080080160A1 (en) * | 2005-12-16 | 2008-04-03 | Laird Technologies, Inc. | Emi shielding assemblies |
| US7262369B1 (en) | 2006-03-09 | 2007-08-28 | Laird Technologies, Inc. | Combined board level EMI shielding and thermal management |
| US20070163802A1 (en) * | 2006-01-19 | 2007-07-19 | Triquint Semiconductors, Inc. | Electronic package including an electromagnetic shield |
| US7381906B2 (en) * | 2006-03-01 | 2008-06-03 | Sony Ericsson Mobile Communications Ab | Shielding device |
| US7463496B2 (en) * | 2006-03-09 | 2008-12-09 | Laird Technologies, Inc. | Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith |
| US7317618B2 (en) * | 2006-03-09 | 2008-01-08 | Laird Technologies, Inc. | Combined board level shielding and thermal management |
| US7623360B2 (en) * | 2006-03-09 | 2009-11-24 | Laird Technologies, Inc. | EMI shielding and thermal management assemblies including frames and covers with multi-position latching |
| CN2891137Y (zh) * | 2006-04-10 | 2007-04-18 | 富士康(昆山)电脑接插件有限公司 | 线控器 |
| KR100782774B1 (ko) * | 2006-05-25 | 2007-12-05 | 삼성전기주식회사 | Sip 모듈 |
| US7518067B2 (en) * | 2006-09-27 | 2009-04-14 | Advanced Micro Devices, Inc. | Metal cage structure and method for EMI shielding |
| US8063727B2 (en) * | 2006-12-08 | 2011-11-22 | Teradyne, Inc. | Conductive shielding device |
| US20090008431A1 (en) * | 2007-07-03 | 2009-01-08 | Kossi Zonvide | Solderable EMI Gasket and Grounding Pad |
| TW200939328A (en) * | 2007-12-03 | 2009-09-16 | United Test & Assembly Ct Lt | Avoiding electrical shorts in packaging |
| US8167231B2 (en) * | 2007-12-21 | 2012-05-01 | Airbus Deutschland Gmbh | Shielding arrangement for lines, in particular electrical lines, in aircraft |
| US8059416B2 (en) * | 2008-03-31 | 2011-11-15 | Universal Scientific Industrial (Shanghai) Co., Ltd. | Multi-cavity electromagnetic shielding device |
| US8751561B2 (en) * | 2008-04-08 | 2014-06-10 | Roderick B. Wideman | Methods and systems for improved throughput performance in a distributed data de-duplication environment |
| US7759168B2 (en) * | 2008-05-13 | 2010-07-20 | International Business Machines Corporation | Electromagnetic interference shield for semiconductors using a continuous or near-continuous peripheral conducting seal and a conducting lid |
| JP4489133B2 (ja) * | 2008-09-10 | 2010-06-23 | 株式会社東芝 | プリント配線板、電子機器 |
| US8138864B2 (en) * | 2009-06-01 | 2012-03-20 | Eaton Corporation | Circuit interrupter including a molded case made of liquid crystal polymer |
| US8477499B2 (en) | 2009-06-05 | 2013-07-02 | Laird Technologies, Inc. | Assemblies and methods for dissipating heat from handheld electronic devices |
| US7965514B2 (en) | 2009-06-05 | 2011-06-21 | Laird Technologies, Inc. | Assemblies and methods for dissipating heat from handheld electronic devices |
| JP5625339B2 (ja) * | 2009-12-01 | 2014-11-19 | 富士通株式会社 | シールドケース、及び、通信装置 |
| US9030159B2 (en) * | 2010-03-26 | 2015-05-12 | Boston Scientific Neuromodulation Corporation | Inductive charger with magnetic shielding |
| TWI549386B (zh) | 2010-04-13 | 2016-09-11 | 康寧吉伯特公司 | 具有防止進入及改良接地之同軸連接器 |
| US20110255250A1 (en) * | 2010-04-19 | 2011-10-20 | Richard Hung Minh Dinh | Printed circuit board components for electronic devices |
| US8964352B2 (en) | 2010-04-19 | 2015-02-24 | Apple Inc. | Mounting structures for components in electronic devices |
| US8610822B2 (en) | 2010-04-19 | 2013-12-17 | Apple Inc. | Camera alignment and mounting structures |
| CA2704683A1 (en) * | 2010-05-28 | 2010-08-12 | Ibm Canada Limited - Ibm Canada Limitee | Grounded lid for micro-electronic assemblies |
| WO2012074775A1 (en) | 2010-11-19 | 2012-06-07 | Analog Devices, Inc. | Packaged integrated device with electrically conductive lid |
| US8654537B2 (en) | 2010-12-01 | 2014-02-18 | Apple Inc. | Printed circuit board with integral radio-frequency shields |
| US8279625B2 (en) | 2010-12-14 | 2012-10-02 | Apple Inc. | Printed circuit board radio-frequency shielding structures |
| KR20120110435A (ko) * | 2011-03-29 | 2012-10-10 | 삼성전기주식회사 | Rf 모듈 차폐 방법 및 이를 이용한 rf 통신 모듈 |
| US9179538B2 (en) | 2011-06-09 | 2015-11-03 | Apple Inc. | Electromagnetic shielding structures for selectively shielding components on a substrate |
| US20130032718A1 (en) * | 2011-08-03 | 2013-02-07 | Robert Bosch Gmbh | Rf immunity improved pyro sensor |
| US20130072057A1 (en) | 2011-09-15 | 2013-03-21 | Donald Andrew Burris | Coaxial cable connector with integral radio frequency interference and grounding shield |
| ITTO20110876A1 (it) * | 2011-09-30 | 2013-03-31 | Stmicroelectronics Malta Ltd | Metodo di saldatura di un cappuccio ad uno strato di supporto |
| CN103999484B (zh) | 2011-11-04 | 2017-06-30 | 美商楼氏电子有限公司 | 作为声学设备中的屏障的嵌入式电介质和制造方法 |
| US9136654B2 (en) | 2012-01-05 | 2015-09-15 | Corning Gilbert, Inc. | Quick mount connector for a coaxial cable |
| CN102779811B (zh) | 2012-07-20 | 2015-02-04 | 华为技术有限公司 | 一种芯片封装及封装方法 |
| US9078063B2 (en) | 2012-08-10 | 2015-07-07 | Knowles Electronics, Llc | Microphone assembly with barrier to prevent contaminant infiltration |
| US9287659B2 (en) | 2012-10-16 | 2016-03-15 | Corning Optical Communications Rf Llc | Coaxial cable connector with integral RFI protection |
| US8952503B2 (en) * | 2013-01-29 | 2015-02-10 | International Business Machines Corporation | Organic module EMI shielding structures and methods |
| US9538693B2 (en) * | 2013-03-15 | 2017-01-03 | A.K. Stamping Company, Inc. | Aluminum EMI / RF shield |
| US9172154B2 (en) | 2013-03-15 | 2015-10-27 | Corning Gilbert Inc. | Coaxial cable connector with integral RFI protection |
| US10290958B2 (en) | 2013-04-29 | 2019-05-14 | Corning Optical Communications Rf Llc | Coaxial cable connector with integral RFI protection and biasing ring |
| WO2014189718A1 (en) | 2013-05-20 | 2014-11-27 | Corning Optical Communications Rf Llc | Coaxial cable connector with integral rfi protection |
| US9241432B1 (en) | 2013-09-27 | 2016-01-19 | The United States Of America, As Represented By The Secretary Of The Navy | Seawater faraday cage |
| WO2015121875A2 (en) * | 2014-02-17 | 2015-08-20 | Dasari Vamshi Nag | A system and method for improving capabilities of security system integrated with premises |
| CN103943610B (zh) | 2014-04-16 | 2016-12-07 | 华为技术有限公司 | 一种电子元件封装结构及电子设备 |
| WO2016000184A1 (zh) | 2014-06-30 | 2016-01-07 | 华为技术有限公司 | 一种交换机模式切换方法、设备及系统 |
| US9357683B2 (en) * | 2014-09-26 | 2016-05-31 | Laird Technologies, Inc. | Electromagnetic interference (EMI) shielding apparatus including electrically-conductive foam |
| US9548572B2 (en) | 2014-11-03 | 2017-01-17 | Corning Optical Communications LLC | Coaxial cable connector having a coupler and a post with a contacting portion and a shoulder |
| US9839168B2 (en) * | 2015-01-30 | 2017-12-05 | Digi International Inc. | Systems and methods for serviceable EMI shielding |
| US9584709B2 (en) | 2015-02-17 | 2017-02-28 | Microsoft Technology Licensing, Llc | Actuator housing for shielding electromagnetic interference |
| US10033122B2 (en) | 2015-02-20 | 2018-07-24 | Corning Optical Communications Rf Llc | Cable or conduit connector with jacket retention feature |
| WO2016144039A1 (en) | 2015-03-06 | 2016-09-15 | Samsung Electronics Co., Ltd. | Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof |
| US9794661B2 (en) | 2015-08-07 | 2017-10-17 | Knowles Electronics, Llc | Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package |
| US10211547B2 (en) | 2015-09-03 | 2019-02-19 | Corning Optical Communications Rf Llc | Coaxial cable connector |
| KR102437673B1 (ko) * | 2015-09-09 | 2022-08-26 | 삼성전자주식회사 | 반도체 장치 |
| WO2017081527A1 (en) | 2015-11-10 | 2017-05-18 | Smartbox Limited | Systems and methods for assessing a mobile device |
| US9525220B1 (en) | 2015-11-25 | 2016-12-20 | Corning Optical Communications LLC | Coaxial cable connector |
| US10156870B2 (en) * | 2016-01-29 | 2018-12-18 | Google Llc | Flexible electromagnetic interference (EMI) shield |
| US10446309B2 (en) | 2016-04-20 | 2019-10-15 | Vishay Dale Electronics, Llc | Shielded inductor and method of manufacturing |
| US10477737B2 (en) | 2016-05-04 | 2019-11-12 | Samsung Electronics Co., Ltd. | Manufacturing method of a hollow shielding structure for circuit elements |
| US10477687B2 (en) | 2016-08-04 | 2019-11-12 | Samsung Electronics Co., Ltd. | Manufacturing method for EMI shielding structure |
| KR102551657B1 (ko) | 2016-12-12 | 2023-07-06 | 삼성전자주식회사 | 전자파 차폐구조 및 그 제조방법 |
| US10542644B2 (en) | 2016-12-14 | 2020-01-21 | A.K. Stamping Company, Inc. | Two-piece solderable shield |
| JP6817858B2 (ja) * | 2017-03-17 | 2021-01-20 | 日本電波工業株式会社 | 表面実装型デバイス及びその製造方法 |
| US10594020B2 (en) | 2017-07-19 | 2020-03-17 | Samsung Electronics Co., Ltd. | Electronic device having antenna element and method for manufacturing the same |
| KR102373931B1 (ko) | 2017-09-08 | 2022-03-14 | 삼성전자주식회사 | 전자파 차폐구조 |
| KR102273971B1 (ko) * | 2017-10-20 | 2021-07-07 | 주식회사 엘지화학 | 파라데이 상자를 이용한 플라즈마 식각 방법 |
| KR102273970B1 (ko) * | 2017-12-26 | 2021-07-07 | 주식회사 엘지화학 | 파라데이 상자를 이용한 플라즈마 식각 방법 |
| KR102548183B1 (ko) * | 2018-06-29 | 2023-06-28 | 주식회사 엘지화학 | 파라데이 상자를 이용한 플라즈마 식각 방법 |
| KR102273084B1 (ko) | 2018-06-29 | 2021-07-06 | 주식회사 엘지화학 | 파라데이 상자를 이용한 플라즈마 식각 방법 |
| US10496137B1 (en) * | 2018-09-13 | 2019-12-03 | Fujifilm Sonosite, Inc. | Electronics board mounting system |
| WO2020111210A1 (ja) * | 2018-11-30 | 2020-06-04 | 積水化学工業株式会社 | 導電性不織布 |
| US11661196B2 (en) * | 2019-06-25 | 2023-05-30 | B/E Aerospace, Inc. | Optimized electronics grounding path for high-frequency noise |
| KR102673637B1 (ko) * | 2020-02-18 | 2024-06-13 | 삼성전자주식회사 | 메모리 카드 소켓 및 전자 장치 |
| CN112635436B (zh) * | 2020-12-17 | 2023-12-15 | 长江存储科技有限责任公司 | 芯片封装结构及其制备方法 |
| US12436137B2 (en) | 2021-10-25 | 2025-10-07 | Carrier Corporation | Systems and methods for membrane blockage detection in gas detectors |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA962021A (en) * | 1970-05-21 | 1975-02-04 | Robert W. Gore | Porous products and process therefor |
| DE2250639B2 (de) * | 1972-10-16 | 1976-03-18 | Siemens AG, 1000 Berlin und 8000 München | Elektromagnetische abdichtung von verbindungsfugen bei verschraubten schirmungselementen |
| DE3013991A1 (de) * | 1980-04-11 | 1981-10-15 | Bayer Ag, 5090 Leverkusen | Grossflaechige photovoltaische zelle |
| US4575578A (en) * | 1983-01-05 | 1986-03-11 | Keene Corporation | Radiation shielding and thermally conductive gasket with internal bonding agent |
| US4557957A (en) * | 1983-03-18 | 1985-12-10 | W. L. Gore & Associates, Inc. | Microporous metal-plated polytetrafluoroethylene articles and method of manufacture |
| DE3520531A1 (de) * | 1985-06-07 | 1986-12-11 | Hagenuk GmbH, 2300 Kiel | Elektromagnetische abschirmung fuer leiterplatten |
| JPS6286841A (ja) * | 1985-10-14 | 1987-04-21 | Mitsubishi Electric Corp | 高周波混成集積回路 |
| US4912594A (en) * | 1986-11-03 | 1990-03-27 | The Boeing Company | Integral lightning protection repair system and method for its use |
| US4857668A (en) * | 1988-04-15 | 1989-08-15 | Schlegel Corporation | Multi-function gasket |
| US4967315A (en) * | 1990-01-02 | 1990-10-30 | General Electric Company | Metallized ceramic circuit package |
| US5297007A (en) * | 1990-09-19 | 1994-03-22 | Rockwell International Corporation | E/M shielded RF circuit board |
| JP3003952B2 (ja) * | 1991-01-14 | 2000-01-31 | ソニーケミカル株式会社 | 異方性導電剤による接続構造 |
| WO1992016095A1 (en) * | 1991-03-04 | 1992-09-17 | Motorola, Inc. | Shielding apparatus for non-conductive electronic circuit package |
| FI109960B (fi) * | 1991-09-19 | 2002-10-31 | Nokia Corp | Elektroninen laite |
| US5202536A (en) * | 1992-02-03 | 1993-04-13 | Schlegel Corporation | EMI shielding seal with partial conductive sheath |
| EP0560072A3 (en) * | 1992-03-13 | 1993-10-06 | Nitto Denko Corporation | Anisotropic electrically conductive adhesive film and connection structure using the same |
| US5269810A (en) * | 1992-06-19 | 1993-12-14 | W. L. Gore & Associates, Inc. | Patch electrode |
| KR0135404B1 (ko) * | 1992-07-31 | 1998-05-15 | 다케우치 도시아키 | 다중모드 수정진동자 |
| US5318855A (en) * | 1992-08-25 | 1994-06-07 | International Business Machines Corporation | Electronic assembly with flexible film cover for providing electrical and environmental protection |
| US5317107A (en) * | 1992-09-24 | 1994-05-31 | Motorola, Inc. | Shielded stripline configuration semiconductor device and method for making the same |
| DE9214394U1 (de) * | 1992-10-23 | 1992-12-17 | Siemens AG, 8000 München | Befestigung einer Abschirmung mit einer Leiterplatte |
| JPH06283884A (ja) * | 1993-03-25 | 1994-10-07 | Nippon Chemicon Corp | シールド基板及びその処理方法 |
| US5459368A (en) * | 1993-08-06 | 1995-10-17 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave device mounted module |
| US5373102A (en) * | 1993-08-19 | 1994-12-13 | The United States Of America As Represented By The Secretary Of The Army | Optically transmissive Faraday cage |
| EP0726925B1 (en) * | 1993-11-03 | 1998-07-22 | W.L. Gore & Associates, Inc. | Electrically conductive adhesives |
| AU7979394A (en) * | 1994-08-19 | 1996-03-14 | W.L. Gore & Associates, Inc. | A see-through radiation shielded assembly |
| US5566055A (en) * | 1995-03-03 | 1996-10-15 | Parker-Hannifin Corporation | Shieled enclosure for electronics |
-
1996
- 1996-05-08 US US08/643,292 patent/US5761053A/en not_active Expired - Lifetime
- 1996-10-23 US US08/735,838 patent/US5763824A/en not_active Expired - Lifetime
-
1997
- 1997-04-30 ES ES97302949T patent/ES2132997T3/es not_active Expired - Lifetime
- 1997-04-30 DE DE69700261T patent/DE69700261T2/de not_active Expired - Lifetime
- 1997-04-30 EP EP97302949A patent/EP0806892B1/en not_active Expired - Lifetime
- 1997-05-01 JP JP9113969A patent/JPH1070387A/ja active Pending
- 1997-05-06 KR KR1019970017206A patent/KR100451291B1/ko not_active Expired - Lifetime
- 1997-05-06 KR KR1019970017207A patent/KR100455015B1/ko not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR100455015B1 (ko) | 2005-01-17 |
| KR100451291B1 (ko) | 2005-01-13 |
| KR970078796A (ko) | 1997-12-12 |
| EP0806892A1 (en) | 1997-11-12 |
| DE69700261T2 (de) | 1999-12-30 |
| DE69700261D1 (de) | 1999-07-15 |
| ES2132997T3 (es) | 1999-08-16 |
| EP0806892B1 (en) | 1999-06-09 |
| US5763824A (en) | 1998-06-09 |
| US5761053A (en) | 1998-06-02 |
| KR19980032113A (ko) | 1998-07-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH1070387A (ja) | ファラデーケージ | |
| US6377475B1 (en) | Removable electromagnetic interference shield | |
| EP1351562B1 (en) | Electromagnetic interference shield for overmolded packaging of an electronic assembly | |
| US7446265B2 (en) | Board level shielding module | |
| US5704117A (en) | Method of assembling an EMI shield around an electronic component | |
| CN100454533C (zh) | 用于电子元件封装的emi屏蔽 | |
| US10455688B2 (en) | Board level shields with virtual grounding capability | |
| EP0806891B1 (en) | A lid assembly for shielding electronic components from EMI/RFI interferences | |
| AU2002250184A1 (en) | Removable electromagnetic interference shield | |
| EP1649733A2 (en) | Electromagnetic interference shield and method of making the same | |
| US6477052B1 (en) | Multiple layer thin flexible circuit board | |
| JP2004072051A (ja) | シールド構造及びその形成方法 | |
| JPH01135099A (ja) | 電子回路パッケージ | |
| JPH04142068A (ja) | 電子部品搭載用基板及びその製造方法 | |
| JPH0775279B2 (ja) | 半導体装置 | |
| JPS63314898A (ja) | 表面実装部品用シ−ルドパッケ−ジ | |
| HK1060815B (en) | Removable electromagnetic interference shield | |
| JPS61166200A (ja) | ハイブリツド集積回路装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040506 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040506 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20061003 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20061228 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20070109 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20070529 |