KR100445273B1 - 세라믹 절연체의 세정방법 - Google Patents

세라믹 절연체의 세정방법 Download PDF

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Publication number
KR100445273B1
KR100445273B1 KR10-2001-0066482A KR20010066482A KR100445273B1 KR 100445273 B1 KR100445273 B1 KR 100445273B1 KR 20010066482 A KR20010066482 A KR 20010066482A KR 100445273 B1 KR100445273 B1 KR 100445273B1
Authority
KR
South Korea
Prior art keywords
ceramic insulator
insulator
cleaning
high pressure
ceramic
Prior art date
Application number
KR10-2001-0066482A
Other languages
English (en)
Korean (ko)
Other versions
KR20030034759A (ko
Inventor
손정하
Original Assignee
손정하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 손정하 filed Critical 손정하
Priority to KR10-2001-0066482A priority Critical patent/KR100445273B1/ko
Priority to JP2001388246A priority patent/JP3699678B2/ja
Publication of KR20030034759A publication Critical patent/KR20030034759A/ko
Application granted granted Critical
Publication of KR100445273B1 publication Critical patent/KR100445273B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0064—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes
    • B08B7/0071—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes by heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning In General (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR10-2001-0066482A 2001-10-26 2001-10-26 세라믹 절연체의 세정방법 KR100445273B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR10-2001-0066482A KR100445273B1 (ko) 2001-10-26 2001-10-26 세라믹 절연체의 세정방법
JP2001388246A JP3699678B2 (ja) 2001-10-26 2001-12-20 セラミック絶縁体の洗浄方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-2001-0066482A KR100445273B1 (ko) 2001-10-26 2001-10-26 세라믹 절연체의 세정방법

Publications (2)

Publication Number Publication Date
KR20030034759A KR20030034759A (ko) 2003-05-09
KR100445273B1 true KR100445273B1 (ko) 2004-08-21

Family

ID=19715432

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2001-0066482A KR100445273B1 (ko) 2001-10-26 2001-10-26 세라믹 절연체의 세정방법

Country Status (2)

Country Link
JP (1) JP3699678B2 (ja)
KR (1) KR100445273B1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140134739A (ko) * 2013-04-30 2014-11-25 웅진에너지 주식회사 Ｉｃｐ 분석을 위한 폴리실리콘 전처리방법
KR20160133794A (ko) * 2015-05-13 2016-11-23 주식회사 우림테크 폴리실리콘 제품의 재사용을 위한 처리방법

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005000911A (ja) * 2003-05-21 2005-01-06 Nihon Ceratec Co Ltd セラミックス部材の洗浄方法
JP4615246B2 (ja) * 2004-05-07 2011-01-19 株式会社デジタルネットワーク 洗浄方法
JP2005327929A (ja) * 2004-05-14 2005-11-24 Murata Mfg Co Ltd 半導体セラミック電子部品の製造方法
JP4666576B2 (ja) * 2004-11-08 2011-04-06 東京エレクトロン株式会社 セラミック溶射部材の洗浄方法、該方法を実行するためのプログラム、記憶媒体、及びセラミック溶射部材
JP2009027104A (ja) * 2007-07-24 2009-02-05 Tokyo Electron Ltd 薄膜形成装置の洗浄方法
JP2009302401A (ja) * 2008-06-16 2009-12-24 Tokyo Seimitsu Co Ltd チャックテーブル洗浄方法、チャックテーブル洗浄装置及び半導体ウェーハ平面加工装置
JP2010207815A (ja) * 2010-04-27 2010-09-24 Digital Network:Kk 洗浄方法
US9406534B2 (en) * 2014-09-17 2016-08-02 Lam Research Corporation Wet clean process for cleaning plasma processing chamber components
KR101533981B1 (ko) * 2015-05-20 2015-07-07 한국세라믹기술원 초음파와 플라즈마를 이용한 세라믹 분쇄 및 분산 장치 및 이를 이용한 세라믹 분쇄 및 분산 방법
KR101793431B1 (ko) * 2016-04-25 2017-11-03 나노윈 주식회사 세라믹 모재 보호용 비정질 세라믹 코팅막의 세정방법
US9947558B2 (en) * 2016-08-12 2018-04-17 Lam Research Corporation Method for conditioning silicon part
CN109939984B (zh) * 2019-03-19 2021-09-03 盐城东方天成机械有限公司 一种油漆渣回收利用设备
CN112317457A (zh) * 2020-09-27 2021-02-05 山东国晶新材料有限公司 一种氧化铝陶瓷制品的清洗方法
CN114904835A (zh) * 2022-05-06 2022-08-16 合肥升滕半导体技术有限公司 一种适用于物理气相沉积工艺的陶瓷绝缘环的清洗方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950032735A (ko) * 1994-05-31 1995-12-22 김광호 다이아몬드 증착장비의 세정방법
KR970052670A (ko) * 1995-12-27 1997-07-29 김광호 플라즈마를 이용한 체임버 세정방법
US5861065A (en) * 1997-01-21 1999-01-19 Air Products And Chemicals, Inc. Nitrogen trifluoride-oxygen thermal cleaning process
KR20000025416A (ko) * 1998-10-12 2000-05-06 윤종용 돔 표면 구조 개선을 통한 파티클 제거 방법
US6254689B1 (en) * 1999-03-09 2001-07-03 Lucent Technologies Inc. System and method for flash photolysis cleaning of a semiconductor processing chamber

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950032735A (ko) * 1994-05-31 1995-12-22 김광호 다이아몬드 증착장비의 세정방법
KR970052670A (ko) * 1995-12-27 1997-07-29 김광호 플라즈마를 이용한 체임버 세정방법
US5861065A (en) * 1997-01-21 1999-01-19 Air Products And Chemicals, Inc. Nitrogen trifluoride-oxygen thermal cleaning process
KR20000025416A (ko) * 1998-10-12 2000-05-06 윤종용 돔 표면 구조 개선을 통한 파티클 제거 방법
US6254689B1 (en) * 1999-03-09 2001-07-03 Lucent Technologies Inc. System and method for flash photolysis cleaning of a semiconductor processing chamber

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140134739A (ko) * 2013-04-30 2014-11-25 웅진에너지 주식회사 Ｉｃｐ 분석을 위한 폴리실리콘 전처리방법
KR102111641B1 (ko) 2013-04-30 2020-05-18 웅진에너지 주식회사 Ｉｃｐ 분석을 위한 폴리실리콘 전처리방법 및 폴리실리콘의 ｉｃｐ 분석방법
KR20160133794A (ko) * 2015-05-13 2016-11-23 주식회사 우림테크 폴리실리콘 제품의 재사용을 위한 처리방법
KR101706673B1 (ko) * 2015-05-13 2017-02-27 주식회사 우림테크 폴리실리콘 제품의 재사용을 위한 처리방법

Also Published As

Publication number Publication date
JP3699678B2 (ja) 2005-09-28
JP2003126795A (ja) 2003-05-07
KR20030034759A (ko) 2003-05-09

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