KR100407052B1 - 가열 장치 - Google Patents
가열 장치 Download PDFInfo
- Publication number
- KR100407052B1 KR100407052B1 KR10-2001-0004793A KR20010004793A KR100407052B1 KR 100407052 B1 KR100407052 B1 KR 100407052B1 KR 20010004793 A KR20010004793 A KR 20010004793A KR 100407052 B1 KR100407052 B1 KR 100407052B1
- Authority
- KR
- South Korea
- Prior art keywords
- resistance heating
- heating element
- planar
- heating
- resistance
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 146
- 239000000919 ceramic Substances 0.000 claims abstract description 27
- 238000009826 distribution Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 3
- 238000009413 insulation Methods 0.000 abstract description 7
- 239000007789 gas Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
- H05B1/0227—Applications
- H05B1/023—Industrial applications
- H05B1/0233—Industrial applications for semiconductors manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
- H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
Abstract
Description
Claims (10)
- 가열면을 갖는 세라믹스제의 기체와, 이 기체 내에 매설되어 있는 복수개의 저항 발열체와, 각 저항 발열체에 대하여 각각 교류 전력을 공급하기 위해 각 저항 발열체마다 설치되어 있는 한 쌍의 단자와, 각 저항 발열체에 대응하는 각 쌍의 단자에 대하여 각각 상기 교류 전력을 공급하기 위해 접속되어 있는 교류 전원과, 각 교류 전원과 각 쌍의 단자 사이에 각각 개재하는 절연 트랜스를 구비하는 것을 특징으로 하는 가열 장치.
- 제1항에 있어서, 상기 세라믹스의 체적 저항율의 온도 계수는 마이너스인 것을 특징으로 하는 가열 장치.
- 제2항에 있어서, 상기 세라믹스는 질화 알루미늄인 것을 특징으로 하는 가열 장치.
- 제2항 또는 제3항에 있어서, 상기 저항 발열체를 구성하는 재질의 체적 저항율의 온도 계수는 플러스인 것을 특징으로 하는 가열 장치.
- 제1항 내지 제3항 중 어느 한 항에 있어서, 상기 저항 발열체는 상기 기체의 두께 방향으로 층 형상을 이루어 설치되어 있는 복수의 평면형 저항 발열체로 이루어지며,상기 복수의 평면형 저항 발열체는 각각 평면적으로 보아 서로 다른 부분에서 발열 밀도 증가 부분을 구비하고 있는 것을 특징으로 하는 가열 장치.
- 제5항에 있어서, 상기 평면형 저항 발열체는 상기 기체의 상기 가열면과 거의 평행하게 배치되어 있는 것을 특징으로 하는 가열 장치.
- 제5항에 있어서, 상기 복수의 평면형 저항 발열체 중 어느 하나에만 상기 교류 전력을 공급하여 발열시킨 경우의 상기 가열면 내의 온도 분포는 50℃ 이내인 것을 특징으로 하는 가열 장치.
- 제4항에 있어서, 상기 저항 발열체는 상기 기체의 두께 방향으로 층 형상을 이루어 설치되어 있는 복수의 평면형 저항 발열체로 이루어지며,상기 복수의 평면형 저항 발열체는 각각 평면적으로 보아 서로 다른 부분에서 발열 밀도 증가 부분을 구비하고 있는 것을 특징으로 하는 가열 장치.
- 제8항에 있어서, 상기 복수의 평면형 저항 발열체 중 어느 하나에만 상기 교류 전력을 공급하여 발열시킨 경우의 상기 가열면 내의 온도 분포는 50℃ 이내인 것을 특징으로 하는 가열 장치.
- 제6항에 있어서, 상기 복수의 평면형 저항 발열체 중 어느 하나에만 상기 교류 전력을 공급하여 발열시킨 경우의 상기 가열면 내의 온도 분포는 50℃ 이내인 것을 특징으로 하는 가열 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000026582A JP4028149B2 (ja) | 2000-02-03 | 2000-02-03 | 加熱装置 |
JP2000-026582 | 2000-02-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010078235A KR20010078235A (ko) | 2001-08-20 |
KR100407052B1 true KR100407052B1 (ko) | 2003-11-28 |
Family
ID=18552299
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2001-0004793A KR100407052B1 (ko) | 2000-02-03 | 2001-02-01 | 가열 장치 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6376811B2 (ko) |
EP (1) | EP1122982B1 (ko) |
JP (1) | JP4028149B2 (ko) |
KR (1) | KR100407052B1 (ko) |
DE (1) | DE60100216T2 (ko) |
TW (1) | TW472498B (ko) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3293594B2 (ja) * | 1999-06-29 | 2002-06-17 | 住友電気工業株式会社 | 光ファイバ融着接続部の保護部材加熱装置及び加熱方法 |
ATE301916T1 (de) * | 1999-11-19 | 2005-08-15 | Ibiden Co Ltd | Keramisches heizgerät |
AU2002239522A1 (en) * | 2000-11-16 | 2002-05-27 | Mattson Technology, Inc. | Apparatuses and methods for resistively heating a thermal processing system |
JP2004253665A (ja) * | 2003-02-21 | 2004-09-09 | Sumitomo Electric Ind Ltd | 半導体製造装置用ウェハ保持体およびそれを搭載した半導体製造装置 |
JP2004296254A (ja) * | 2003-03-27 | 2004-10-21 | Sumitomo Electric Ind Ltd | セラミックスヒータおよびそれを搭載した半導体あるいは液晶製造装置 |
US20040222210A1 (en) * | 2003-05-08 | 2004-11-11 | Hongy Lin | Multi-zone ceramic heating system and method of manufacture thereof |
US7126092B2 (en) * | 2005-01-13 | 2006-10-24 | Watlow Electric Manufacturing Company | Heater for wafer processing and methods of operating and manufacturing the same |
US8168926B2 (en) * | 2007-03-26 | 2012-05-01 | Ngk Insulators, Ltd. | Heating device |
US8459259B2 (en) | 2007-07-31 | 2013-06-11 | Resmed Limited | Heating element, humidifier for respiratory apparatus including heating element, and respiratory apparatus |
JP5426892B2 (ja) * | 2008-02-08 | 2014-02-26 | 日本碍子株式会社 | 基板加熱装置 |
KR101433865B1 (ko) * | 2008-02-25 | 2014-08-29 | 주성엔지니어링(주) | 고정식 리프트 핀을 가지는 기판 처리 장치 및 이를 이용한기판의 로딩 및 언로딩 방법 |
US20100108661A1 (en) * | 2008-10-31 | 2010-05-06 | United Technologies Corporation | Multi-layer heating assembly and method |
CN102280366B (zh) * | 2011-08-19 | 2014-01-01 | 清华大学 | 一种用于激光加工的旋转窗片装置 |
WO2013130918A1 (en) | 2012-02-29 | 2013-09-06 | Harris, Jonathan, H. | Transient liquid phase, pressureless joining of aluminum nitride components |
JP6077258B2 (ja) * | 2012-10-05 | 2017-02-08 | 日本特殊陶業株式会社 | 積層発熱体、静電チャック、及びセラミックヒータ |
JP6690918B2 (ja) * | 2015-10-16 | 2020-04-28 | 日本特殊陶業株式会社 | 加熱部材、静電チャック、及びセラミックヒータ |
US20170140956A1 (en) * | 2015-11-13 | 2017-05-18 | Varian Semiconductor Equipment Associates, Inc. | Single Piece Ceramic Platen |
US11031271B2 (en) * | 2016-04-28 | 2021-06-08 | Kyocera Corporation | Heater system, ceramic heater, plasma treatment system, and adsorption system |
JP6758143B2 (ja) * | 2016-09-29 | 2020-09-23 | 日本特殊陶業株式会社 | 加熱装置 |
US10679873B2 (en) * | 2016-09-30 | 2020-06-09 | Ngk Spark Plug Co., Ltd. | Ceramic heater |
US11289355B2 (en) * | 2017-06-02 | 2022-03-29 | Lam Research Corporation | Electrostatic chuck for use in semiconductor processing |
CN212365925U (zh) * | 2017-11-21 | 2021-01-15 | 沃特洛电气制造公司 | 一种支撑基座 |
US11086233B2 (en) | 2018-03-20 | 2021-08-10 | Lam Research Corporation | Protective coating for electrostatic chucks |
JP7216746B2 (ja) * | 2019-01-25 | 2023-02-01 | 日本碍子株式会社 | セラミックヒータ |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4449039A (en) * | 1981-09-14 | 1984-05-15 | Nippondenso Co., Ltd. | Ceramic heater |
JPS61109289A (ja) * | 1984-11-01 | 1986-05-27 | 日本碍子株式会社 | セラミツクヒ−タおよびその製造方法 |
US4912304A (en) * | 1987-09-09 | 1990-03-27 | Philippbar Jay E | Thick-film incubator |
US5225663A (en) | 1988-06-15 | 1993-07-06 | Tel Kyushu Limited | Heat process device |
US5408574A (en) * | 1989-12-01 | 1995-04-18 | Philip Morris Incorporated | Flat ceramic heater having discrete heating zones |
EP0447155B1 (en) * | 1990-03-12 | 1995-07-26 | Ngk Insulators, Ltd. | Wafer heaters for use in semi-conductor-producing apparatus, heating units using such wafer heaters, and production of heaters |
JPH05326112A (ja) | 1992-05-21 | 1993-12-10 | Shin Etsu Chem Co Ltd | 複層セラミックスヒーター |
DE4240812A1 (de) * | 1992-12-04 | 1994-06-09 | Bosch Gmbh Robert | Heizeranordnung für einen Meßfühler zur Bestimmung von Bestandteilen in Gasen |
JP3228581B2 (ja) * | 1992-12-24 | 2001-11-12 | 京セラ株式会社 | セラミックヒータ |
JPH06202512A (ja) * | 1992-12-29 | 1994-07-22 | Canon Inc | 加熱装置及び画像記録装置 |
JP2642858B2 (ja) * | 1993-12-20 | 1997-08-20 | 日本碍子株式会社 | セラミックスヒーター及び加熱装置 |
JP2813148B2 (ja) * | 1994-03-02 | 1998-10-22 | 日本碍子株式会社 | セラミックス製品 |
US6002109A (en) * | 1995-07-10 | 1999-12-14 | Mattson Technology, Inc. | System and method for thermal processing of a semiconductor substrate |
US5940579A (en) * | 1997-02-26 | 1999-08-17 | White Consolidated Industries, Inc. | Capacitive leakage current cancellation for heating panel |
JP3318514B2 (ja) * | 1997-08-06 | 2002-08-26 | 日本碍子株式会社 | 半導体支持装置 |
JP3762061B2 (ja) | 1997-09-11 | 2006-03-29 | キヤノン株式会社 | 画像記録装置 |
JP3691649B2 (ja) * | 1997-10-28 | 2005-09-07 | 日本特殊陶業株式会社 | セラミックヒータ |
JPH11204238A (ja) * | 1998-01-08 | 1999-07-30 | Ngk Insulators Ltd | セラミックスヒーター |
JPH11260534A (ja) * | 1998-01-09 | 1999-09-24 | Ngk Insulators Ltd | 加熱装置およびその製造方法 |
-
2000
- 2000-02-03 JP JP2000026582A patent/JP4028149B2/ja not_active Expired - Lifetime
- 2000-12-16 TW TW089126966A patent/TW472498B/zh not_active IP Right Cessation
-
2001
- 2001-01-31 US US09/773,235 patent/US6376811B2/en not_active Expired - Lifetime
- 2001-02-01 KR KR10-2001-0004793A patent/KR100407052B1/ko active IP Right Grant
- 2001-02-02 DE DE60100216T patent/DE60100216T2/de not_active Expired - Lifetime
- 2001-02-02 EP EP01300946A patent/EP1122982B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1122982A1 (en) | 2001-08-08 |
US20010027972A1 (en) | 2001-10-11 |
DE60100216D1 (de) | 2003-06-05 |
US6376811B2 (en) | 2002-04-23 |
DE60100216T2 (de) | 2004-03-18 |
JP2001217059A (ja) | 2001-08-10 |
TW472498B (en) | 2002-01-11 |
EP1122982B1 (en) | 2003-05-02 |
KR20010078235A (ko) | 2001-08-20 |
JP4028149B2 (ja) | 2007-12-26 |
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