KR100384265B1 - 프로그램가능한고집적전자검사장치 - Google Patents

프로그램가능한고집적전자검사장치 Download PDF

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Publication number
KR100384265B1
KR100384265B1 KR1019970702795A KR19970702795A KR100384265B1 KR 100384265 B1 KR100384265 B1 KR 100384265B1 KR 1019970702795 A KR1019970702795 A KR 1019970702795A KR 19970702795 A KR19970702795 A KR 19970702795A KR 100384265 B1 KR100384265 B1 KR 100384265B1
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KR
South Korea
Prior art keywords
inspection
test
block
substrate
switching circuit
Prior art date
Application number
KR1019970702795A
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English (en)
Korean (ko)
Other versions
KR970707708A (ko
Inventor
푸 치웅 총
Original Assignee
클리크 앤드 소파 홀딩스 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 클리크 앤드 소파 홀딩스 인코포레이티드 filed Critical 클리크 앤드 소파 홀딩스 인코포레이티드
Publication of KR970707708A publication Critical patent/KR970707708A/ko
Application granted granted Critical
Publication of KR100384265B1 publication Critical patent/KR100384265B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31908—Tester set-up, e.g. configuring the tester to the device under test [DUT], down loading test patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1019970702795A 1994-10-28 1995-10-19 프로그램가능한고집적전자검사장치 KR100384265B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US33105594A 1994-10-28 1994-10-28
US08/331055 1994-10-28
US08/331,055 1994-10-28

Publications (2)

Publication Number Publication Date
KR970707708A KR970707708A (ko) 1997-12-01
KR100384265B1 true KR100384265B1 (ko) 2003-08-14

Family

ID=23292443

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970702795A KR100384265B1 (ko) 1994-10-28 1995-10-19 프로그램가능한고집적전자검사장치

Country Status (6)

Country Link
US (1) US5973504A (US07576128-20090818-C00048.png)
EP (1) EP0788729A4 (US07576128-20090818-C00048.png)
JP (1) JP3685498B2 (US07576128-20090818-C00048.png)
KR (1) KR100384265B1 (US07576128-20090818-C00048.png)
TW (1) TW278138B (US07576128-20090818-C00048.png)
WO (1) WO1996013967A1 (US07576128-20090818-C00048.png)

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US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US7382142B2 (en) 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US6812718B1 (en) 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US6578264B1 (en) 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
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US6838890B2 (en) * 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
US6927586B2 (en) * 2000-03-06 2005-08-09 Wentworth Laboratories, Inc. Temperature compensated vertical pin probing device
US6633175B1 (en) 2000-03-06 2003-10-14 Wenworth Laboratories, Inc. Temperature compensated vertical pin probing device
US6661244B2 (en) 2000-03-06 2003-12-09 Wentworth Laboratories, Inc. Nickel alloy probe card frame laminate
US6566898B2 (en) 2000-03-06 2003-05-20 Wentworth Laboratories, Inc. Temperature compensated vertical pin probing device
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US6965244B2 (en) * 2002-05-08 2005-11-15 Formfactor, Inc. High performance probe system
US6971045B1 (en) 2002-05-20 2005-11-29 Cyress Semiconductor Corp. Reducing tester channels for high pinout integrated circuits
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US6847203B1 (en) * 2003-07-02 2005-01-25 International Business Machines Corporation Applying parametric test patterns for high pin count ASICs on low pin count testers
JP4465995B2 (ja) * 2003-07-02 2010-05-26 株式会社日立製作所 プローブシート、プローブカード、半導体検査装置および半導体装置の製造方法
US6853205B1 (en) * 2003-07-17 2005-02-08 Chipmos Technologies (Bermuda) Ltd. Probe card assembly
US7224173B2 (en) * 2003-10-01 2007-05-29 Taiwan Semiconductor Manufacturing Co., Ltd. Electrical bias electrical test apparatus and method
WO2005065258A2 (en) 2003-12-24 2005-07-21 Cascade Microtech, Inc. Active wafer probe
US20050289415A1 (en) * 2004-06-24 2005-12-29 Celerity Research, Inc. Intelligent probe chips/heads
WO2006031646A2 (en) 2004-09-13 2006-03-23 Cascade Microtech, Inc. Double sided probing structures
US20060087331A1 (en) * 2004-10-22 2006-04-27 Young Michael E System and method for a multisite, integrated, combination probe card and spider card
KR100688517B1 (ko) * 2005-01-11 2007-03-02 삼성전자주식회사 전압공급유닛 분할을 통한 반도체 소자의 병렬검사 방법
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7541819B2 (en) * 2005-10-28 2009-06-02 Teradyne, Inc. Modularized device interface with grounding insert between two strips
US7504822B2 (en) * 2005-10-28 2009-03-17 Teradyne, Inc. Automatic testing equipment instrument card and probe cabling system and apparatus
JP2007205960A (ja) * 2006-02-03 2007-08-16 Tokyo Electron Ltd プローブカード及びプローブ装置
US7859277B2 (en) * 2006-04-24 2010-12-28 Verigy (Singapore) Pte. Ltd. Apparatus, systems and methods for processing signals between a tester and a plurality of devices under test at high temperatures and with single touchdown of a probe array
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
EP2040781A1 (en) * 2006-07-11 2009-04-01 Eli Lilly & Company Medication cartridge piston
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
WO2010059247A2 (en) 2008-11-21 2010-05-27 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
JP5427536B2 (ja) * 2009-10-01 2014-02-26 東京エレクトロン株式会社 プローブカード
US8954014B2 (en) * 2009-10-26 2015-02-10 Anite Telecoms Oy Over-the air test
KR102016427B1 (ko) * 2013-09-10 2019-09-02 삼성전자주식회사 포고 핀 및 이를 포함하는 프로브 카드
CN107942223A (zh) * 2016-10-12 2018-04-20 肖敏 用于芯片测试和编程的装置及其制造方法
TWI779586B (zh) * 2021-04-30 2022-10-01 瑞昱半導體股份有限公司 測試電路系統的方法及相關電路系統

Citations (1)

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US5020219A (en) * 1988-05-16 1991-06-04 Leedy Glenn J Method of making a flexible tester surface for testing integrated circuits

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Also Published As

Publication number Publication date
US5973504A (en) 1999-10-26
JPH10508380A (ja) 1998-08-18
KR970707708A (ko) 1997-12-01
WO1996013967A1 (en) 1996-05-09
EP0788729A4 (en) 1998-06-03
EP0788729A1 (en) 1997-08-13
TW278138B (US07576128-20090818-C00048.png) 1996-06-11
JP3685498B2 (ja) 2005-08-17

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