KR100351695B1 - 평면연마장치 - Google Patents

평면연마장치 Download PDF

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Publication number
KR100351695B1
KR100351695B1 KR1020000038424A KR20000038424A KR100351695B1 KR 100351695 B1 KR100351695 B1 KR 100351695B1 KR 1020000038424 A KR1020000038424 A KR 1020000038424A KR 20000038424 A KR20000038424 A KR 20000038424A KR 100351695 B1 KR100351695 B1 KR 100351695B1
Authority
KR
South Korea
Prior art keywords
polishing
platen
light
wafer
light transmission
Prior art date
Application number
KR1020000038424A
Other languages
English (en)
Korean (ko)
Other versions
KR20010015184A (ko
Inventor
사토유이치
요시노요시카즈
후루야마나오히로
나가모토노부히로
미쓰하시마사시게
Original Assignee
닛본 덴기 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛본 덴기 가부시끼가이샤 filed Critical 닛본 덴기 가부시끼가이샤
Publication of KR20010015184A publication Critical patent/KR20010015184A/ko
Application granted granted Critical
Publication of KR100351695B1 publication Critical patent/KR100351695B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020000038424A 1999-07-05 2000-07-05 평면연마장치 KR100351695B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP18991699A JP2001009699A (ja) 1999-07-05 1999-07-05 平面研磨装置
JP11-189916 1999-07-05

Publications (2)

Publication Number Publication Date
KR20010015184A KR20010015184A (ko) 2001-02-26
KR100351695B1 true KR100351695B1 (ko) 2002-09-11

Family

ID=16249366

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020000038424A KR100351695B1 (ko) 1999-07-05 2000-07-05 평면연마장치

Country Status (4)

Country Link
JP (1) JP2001009699A (zh)
KR (1) KR100351695B1 (zh)
CN (1) CN1279506A (zh)
TW (1) TW480204B (zh)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6776692B1 (en) * 1999-07-09 2004-08-17 Applied Materials Inc. Closed-loop control of wafer polishing in a chemical mechanical polishing system
JP3506114B2 (ja) * 2000-01-25 2004-03-15 株式会社ニコン モニタ装置及びこのモニタ装置を具えた研磨装置及び研磨方法
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
JP2003001560A (ja) * 2001-06-22 2003-01-08 Semiconductor Leading Edge Technologies Inc 基板研磨装置、基板研磨方法及び半導体装置
AU2003285800A1 (en) * 2002-12-28 2004-07-22 Skc Co., Ltd. Polishing pad having multi-windows
KR100653725B1 (ko) * 2004-10-01 2006-12-04 주식회사 신안에스엔피 오엘이디용 아이티오 박막 연마장치
CN100395079C (zh) * 2004-11-10 2008-06-18 中国科学院长春光学精密机械与物理研究所 一种数控抛光用非接触式喷液磨头
JP4955624B2 (ja) * 2008-07-31 2012-06-20 信越半導体株式会社 両面研磨装置
JP4654275B2 (ja) * 2008-07-31 2011-03-16 信越半導体株式会社 両面研磨装置
US8834230B2 (en) 2008-07-31 2014-09-16 Shin-Etsu Handotai Co., Ltd. Wafer polishing method and double-side polishing apparatus
JP5028354B2 (ja) * 2008-07-31 2012-09-19 信越半導体株式会社 ウェーハの研磨方法
US20110281510A1 (en) * 2010-05-12 2011-11-17 Applied Materials, Inc. Pad Window Insert
US8298041B2 (en) 2010-10-08 2012-10-30 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for wafer back-grinding control
JP5980476B2 (ja) * 2010-12-27 2016-08-31 株式会社荏原製作所 ポリッシング装置およびポリッシング方法
US8535115B2 (en) * 2011-01-28 2013-09-17 Applied Materials, Inc. Gathering spectra from multiple optical heads
JP5375895B2 (ja) * 2011-08-17 2013-12-25 旭硝子株式会社 研磨システム
US10226853B2 (en) * 2013-01-18 2019-03-12 Applied Materials, Inc. Methods and apparatus for conditioning of chemical mechanical polishing pads
JP6027454B2 (ja) * 2013-02-05 2016-11-16 株式会社荏原製作所 研磨装置
CN103471899B (zh) * 2013-08-28 2016-01-20 西安隆基硅材料股份有限公司 硅片加工装置
JP2016007689A (ja) * 2014-06-26 2016-01-18 株式会社ディスコ ワイヤーソー装置
JP2019528187A (ja) * 2016-08-31 2019-10-10 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 環状プラテン又は研磨パッドを有する研磨システム
CN107799433B (zh) * 2016-09-07 2020-03-17 台湾积体电路制造股份有限公司 半导体制造装置及其研磨模块
JP6791553B2 (ja) * 2016-11-24 2020-11-25 株式会社ディスコ スピンドルユニット及び研削装置
JP6985107B2 (ja) * 2017-11-06 2021-12-22 株式会社荏原製作所 研磨方法および研磨装置
CN108838870B (zh) * 2018-06-05 2020-02-14 南通瑞森光学股份有限公司 一种半导体晶圆研磨设备
KR102580487B1 (ko) * 2018-06-18 2023-09-21 주식회사 케이씨텍 패드 모니터링 장치 및 이를 포함하는 패드 모니터링 시스템, 패드 모니터링 방법
JP7117171B2 (ja) * 2018-06-20 2022-08-12 株式会社荏原製作所 研磨装置、研磨方法、及び研磨制御プログラム
CN109171960B (zh) * 2018-07-25 2020-11-06 杭州三坛医疗科技有限公司 光束定位方法、导向通道定位方法和定位机构
US11328965B2 (en) 2018-07-31 2022-05-10 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for suction pad assemblies
CN109397032A (zh) * 2018-12-30 2019-03-01 苏州富强科技有限公司 一种3d曲面玻璃抛光机构
CN111668121B (zh) * 2019-03-05 2022-05-27 台湾积体电路制造股份有限公司 晶圆接合结构及其形成方法
KR102339948B1 (ko) * 2019-07-02 2021-12-17 (주)미래컴퍼니 연마 시스템 및 연마 방법
CN112405305A (zh) * 2020-11-20 2021-02-26 西安奕斯伟硅片技术有限公司 单面抛光装置及方法
JP2023030756A (ja) * 2021-08-24 2023-03-08 株式会社荏原製作所 研磨装置

Also Published As

Publication number Publication date
CN1279506A (zh) 2001-01-10
JP2001009699A (ja) 2001-01-16
TW480204B (en) 2002-03-21
KR20010015184A (ko) 2001-02-26

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