JP2001009699A - 平面研磨装置 - Google Patents

平面研磨装置

Info

Publication number
JP2001009699A
JP2001009699A JP18991699A JP18991699A JP2001009699A JP 2001009699 A JP2001009699 A JP 2001009699A JP 18991699 A JP18991699 A JP 18991699A JP 18991699 A JP18991699 A JP 18991699A JP 2001009699 A JP2001009699 A JP 2001009699A
Authority
JP
Japan
Prior art keywords
platen
light
polishing
wafer
polished
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18991699A
Other languages
English (en)
Japanese (ja)
Inventor
Kiichi Yoshino
喜一 吉野
Naohiro Furuyama
尚宏 古山
Nobuhiro Nagamoto
信裕 永元
Uichi Sato
右一 佐藤
Masanari Mihashi
眞成 三橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Canon Machinery Inc
Original Assignee
NEC Corp
Nichiden Machinery Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nichiden Machinery Ltd filed Critical NEC Corp
Priority to JP18991699A priority Critical patent/JP2001009699A/ja
Priority to TW089113343A priority patent/TW480204B/zh
Priority to KR1020000038424A priority patent/KR100351695B1/ko
Priority to CN00109568A priority patent/CN1279506A/zh
Publication of JP2001009699A publication Critical patent/JP2001009699A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP18991699A 1999-07-05 1999-07-05 平面研磨装置 Pending JP2001009699A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP18991699A JP2001009699A (ja) 1999-07-05 1999-07-05 平面研磨装置
TW089113343A TW480204B (en) 1999-07-05 2000-07-04 Apparatus for polishing a flat surface
KR1020000038424A KR100351695B1 (ko) 1999-07-05 2000-07-05 평면연마장치
CN00109568A CN1279506A (zh) 1999-07-05 2000-07-05 平面研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18991699A JP2001009699A (ja) 1999-07-05 1999-07-05 平面研磨装置

Publications (1)

Publication Number Publication Date
JP2001009699A true JP2001009699A (ja) 2001-01-16

Family

ID=16249366

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18991699A Pending JP2001009699A (ja) 1999-07-05 1999-07-05 平面研磨装置

Country Status (4)

Country Link
JP (1) JP2001009699A (zh)
KR (1) KR100351695B1 (zh)
CN (1) CN1279506A (zh)
TW (1) TW480204B (zh)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001060572A (ja) * 1999-07-09 2001-03-06 Applied Materials Inc 化学機械研磨装置でのウェーハ研磨の閉ループ制御
WO2001056068A1 (fr) * 2000-01-25 2001-08-02 Nikon Corporation Systeme de controle et procede associe, dispositif de polissage et procede de fabrication d'une tranche de silicium
JP2003001560A (ja) * 2001-06-22 2003-01-08 Semiconductor Leading Edge Technologies Inc 基板研磨装置、基板研磨方法及び半導体装置
WO2010013390A1 (ja) * 2008-07-31 2010-02-04 信越半導体株式会社 ウェーハの研磨方法および両面研磨装置
JP2010030019A (ja) * 2008-07-31 2010-02-12 Shin Etsu Handotai Co Ltd 両面研磨装置
JP2010034479A (ja) * 2008-07-31 2010-02-12 Shin Etsu Handotai Co Ltd ウェーハの研磨方法
JP2010034462A (ja) * 2008-07-31 2010-02-12 Shin Etsu Handotai Co Ltd 両面研磨装置
US8070909B2 (en) 2001-06-19 2011-12-06 Applied Materials, Inc. Feedback control of chemical mechanical polishing device providing manipulation of removal rate profiles
JP2012138442A (ja) * 2010-12-27 2012-07-19 Ebara Corp ポリッシング装置およびポリッシング方法
WO2012102871A2 (en) * 2011-01-28 2012-08-02 Applied Materials, Inc. Gathering spectra from multiple optical heads
WO2014113108A1 (en) * 2013-01-18 2014-07-24 Applied Materials, Inc. Methods and apparatus for conditioning of chemical mechanical polishing pads
JP2016007689A (ja) * 2014-06-26 2016-01-18 株式会社ディスコ ワイヤーソー装置
JP2018083253A (ja) * 2016-11-24 2018-05-31 株式会社ディスコ スピンドルユニット及び研削装置
CN109746823A (zh) * 2017-11-06 2019-05-14 株式会社荏原制作所 研磨方法及研磨装置
KR20190142571A (ko) * 2018-06-18 2019-12-27 주식회사 케이씨텍 패드 모니터링 장치 및 이를 포함하는 패드 모니터링 시스템, 패드 모니터링 방법
WO2023026723A1 (ja) * 2021-08-24 2023-03-02 株式会社荏原製作所 研磨装置

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003285800A1 (en) * 2002-12-28 2004-07-22 Skc Co., Ltd. Polishing pad having multi-windows
KR100653725B1 (ko) * 2004-10-01 2006-12-04 주식회사 신안에스엔피 오엘이디용 아이티오 박막 연마장치
CN100395079C (zh) * 2004-11-10 2008-06-18 中国科学院长春光学精密机械与物理研究所 一种数控抛光用非接触式喷液磨头
US20110281510A1 (en) * 2010-05-12 2011-11-17 Applied Materials, Inc. Pad Window Insert
US8298041B2 (en) * 2010-10-08 2012-10-30 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for wafer back-grinding control
JP5375895B2 (ja) * 2011-08-17 2013-12-25 旭硝子株式会社 研磨システム
JP6027454B2 (ja) * 2013-02-05 2016-11-16 株式会社荏原製作所 研磨装置
CN103471899B (zh) * 2013-08-28 2016-01-20 西安隆基硅材料股份有限公司 硅片加工装置
CN109641342A (zh) 2016-08-31 2019-04-16 应用材料公司 具有环形工作台或抛光垫的抛光系统
CN107799433B (zh) * 2016-09-07 2020-03-17 台湾积体电路制造股份有限公司 半导体制造装置及其研磨模块
CN108838870B (zh) * 2018-06-05 2020-02-14 南通瑞森光学股份有限公司 一种半导体晶圆研磨设备
JP7117171B2 (ja) * 2018-06-20 2022-08-12 株式会社荏原製作所 研磨装置、研磨方法、及び研磨制御プログラム
CN109171960B (zh) * 2018-07-25 2020-11-06 杭州三坛医疗科技有限公司 光束定位方法、导向通道定位方法和定位机构
US11328965B2 (en) 2018-07-31 2022-05-10 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for suction pad assemblies
CN109397032A (zh) * 2018-12-30 2019-03-01 苏州富强科技有限公司 一种3d曲面玻璃抛光机构
CN111668121B (zh) * 2019-03-05 2022-05-27 台湾积体电路制造股份有限公司 晶圆接合结构及其形成方法
KR102339948B1 (ko) * 2019-07-02 2021-12-17 (주)미래컴퍼니 연마 시스템 및 연마 방법
CN112405305A (zh) * 2020-11-20 2021-02-26 西安奕斯伟硅片技术有限公司 单面抛光装置及方法

Cited By (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4719339B2 (ja) * 1999-07-09 2011-07-06 アプライド マテリアルズ インコーポレイテッド 化学機械研磨装置でのウェーハ研磨の閉ループ制御
JP2001060572A (ja) * 1999-07-09 2001-03-06 Applied Materials Inc 化学機械研磨装置でのウェーハ研磨の閉ループ制御
WO2001056068A1 (fr) * 2000-01-25 2001-08-02 Nikon Corporation Systeme de controle et procede associe, dispositif de polissage et procede de fabrication d'une tranche de silicium
US6916225B2 (en) 2000-01-25 2005-07-12 Nikon Corporation Monitor, method of monitoring, polishing device, and method of manufacturing semiconductor wafer
US8694145B2 (en) 2001-06-19 2014-04-08 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US8070909B2 (en) 2001-06-19 2011-12-06 Applied Materials, Inc. Feedback control of chemical mechanical polishing device providing manipulation of removal rate profiles
JP2003001560A (ja) * 2001-06-22 2003-01-08 Semiconductor Leading Edge Technologies Inc 基板研磨装置、基板研磨方法及び半導体装置
US9108289B2 (en) 2008-07-31 2015-08-18 Shin-Etsu Handotai Co., Ltd. Double-side polishing apparatus
WO2010013390A1 (ja) * 2008-07-31 2010-02-04 信越半導体株式会社 ウェーハの研磨方法および両面研磨装置
KR20110038685A (ko) * 2008-07-31 2011-04-14 신에쯔 한도타이 가부시키가이샤 웨이퍼의 연마 방법 및 양면 연마 장치
JP2010034462A (ja) * 2008-07-31 2010-02-12 Shin Etsu Handotai Co Ltd 両面研磨装置
JP2010034479A (ja) * 2008-07-31 2010-02-12 Shin Etsu Handotai Co Ltd ウェーハの研磨方法
JP4654275B2 (ja) * 2008-07-31 2011-03-16 信越半導体株式会社 両面研磨装置
KR101587226B1 (ko) * 2008-07-31 2016-01-20 신에쯔 한도타이 가부시키가이샤 웨이퍼의 연마 방법 및 양면 연마 장치
US8834230B2 (en) 2008-07-31 2014-09-16 Shin-Etsu Handotai Co., Ltd. Wafer polishing method and double-side polishing apparatus
DE112009001875B4 (de) 2008-07-31 2023-06-22 Shin-Etsu Handotai Co., Ltd. Waferpolierverfahren und Doppelseitenpoliervorrichtung
JP2010030019A (ja) * 2008-07-31 2010-02-12 Shin Etsu Handotai Co Ltd 両面研磨装置
JP2012138442A (ja) * 2010-12-27 2012-07-19 Ebara Corp ポリッシング装置およびポリッシング方法
US8535115B2 (en) 2011-01-28 2013-09-17 Applied Materials, Inc. Gathering spectra from multiple optical heads
WO2012102871A3 (en) * 2011-01-28 2012-11-08 Applied Materials, Inc. Gathering spectra from multiple optical heads
US8932107B2 (en) 2011-01-28 2015-01-13 Applied Materials, Inc. Gathering spectra from multiple optical heads
KR20170122268A (ko) * 2011-01-28 2017-11-03 어플라이드 머티어리얼스, 인코포레이티드 다수의 광학적 헤드들로부터의 스펙트럼들 수집
KR102185780B1 (ko) * 2011-01-28 2020-12-02 어플라이드 머티어리얼스, 인코포레이티드 다수의 광학적 헤드들로부터의 스펙트럼들 수집
WO2012102871A2 (en) * 2011-01-28 2012-08-02 Applied Materials, Inc. Gathering spectra from multiple optical heads
JP2016185590A (ja) * 2011-01-28 2016-10-27 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 多数の光ヘッドからのスペクトルの収集
KR101786034B1 (ko) 2011-01-28 2017-10-16 어플라이드 머티어리얼스, 인코포레이티드 다수의 광학적 헤드들로부터의 스펙트럼들 수집
TWI594839B (zh) * 2013-01-18 2017-08-11 應用材料股份有限公司 用於化學機械硏磨墊之調節的方法及設備
US10226853B2 (en) 2013-01-18 2019-03-12 Applied Materials, Inc. Methods and apparatus for conditioning of chemical mechanical polishing pads
WO2014113108A1 (en) * 2013-01-18 2014-07-24 Applied Materials, Inc. Methods and apparatus for conditioning of chemical mechanical polishing pads
JP2016007689A (ja) * 2014-06-26 2016-01-18 株式会社ディスコ ワイヤーソー装置
JP2018083253A (ja) * 2016-11-24 2018-05-31 株式会社ディスコ スピンドルユニット及び研削装置
KR102522855B1 (ko) * 2017-11-06 2023-04-18 가부시키가이샤 에바라 세이사꾸쇼 연마 방법 및 연마 장치
CN109746823A (zh) * 2017-11-06 2019-05-14 株式会社荏原制作所 研磨方法及研磨装置
KR20190051825A (ko) * 2017-11-06 2019-05-15 가부시키가이샤 에바라 세이사꾸쇼 연마 방법 및 연마 장치
JP2019084614A (ja) * 2017-11-06 2019-06-06 株式会社荏原製作所 研磨方法および研磨装置
US11478893B2 (en) 2017-11-06 2022-10-25 Ebara Corporation Polishing method and polishing apparatus
CN110617786A (zh) * 2018-06-18 2019-12-27 凯斯科技股份有限公司 垫监测装置及包括其的垫监测系统、垫监测方法
KR20190142571A (ko) * 2018-06-18 2019-12-27 주식회사 케이씨텍 패드 모니터링 장치 및 이를 포함하는 패드 모니터링 시스템, 패드 모니터링 방법
KR102580487B1 (ko) 2018-06-18 2023-09-21 주식회사 케이씨텍 패드 모니터링 장치 및 이를 포함하는 패드 모니터링 시스템, 패드 모니터링 방법
WO2023026723A1 (ja) * 2021-08-24 2023-03-02 株式会社荏原製作所 研磨装置

Also Published As

Publication number Publication date
CN1279506A (zh) 2001-01-10
KR100351695B1 (ko) 2002-09-11
KR20010015184A (ko) 2001-02-26
TW480204B (en) 2002-03-21

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