JP4471832B2 - 光学センサ付き研磨パッド - Google Patents
光学センサ付き研磨パッド Download PDFInfo
- Publication number
- JP4471832B2 JP4471832B2 JP2004504680A JP2004504680A JP4471832B2 JP 4471832 B2 JP4471832 B2 JP 4471832B2 JP 2004504680 A JP2004504680 A JP 2004504680A JP 2004504680 A JP2004504680 A JP 2004504680A JP 4471832 B2 JP4471832 B2 JP 4471832B2
- Authority
- JP
- Japan
- Prior art keywords
- pad
- section
- polishing pad
- optical assembly
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
Claims (15)
- ウェーハその他のワークピースの化学的機械的平坦化で使用される研磨パッドで、
上面、下面、及び厚さを特徴とする研磨パッドで、該研磨パッドがその中に配置された1つの孔を有し、該孔が完全に上面から下面に伸びている研磨パッドと、
前記孔中に配置されたカプセルで、該カプセルは研磨中ウェーハその他のワークピースの光学特性を検出する手段を収容し、該カプセルはパッドの上面と実質的に同面である上面を有し、パッドの厚さより小さい厚さを有するカプセルと
で構成されていることを特徴とする研磨パッド。 - 前記孔は上部孔セクション及び下部孔セクションがあり、該下部セクションは該上部孔セクションより大きく、かつ
前記カプセルは上部カプセル・セクション及び下部カプセル・セクションで特徴つけられており、前記上部カプセル・セクションは前記孔の上部セクション内に嵌るような大きさと寸法を有し、前記下部セクションは前記孔の下部セクション内に嵌るような大きさと寸法を有することを特徴とする
請求項1に記載の研磨パッド。 - 前記上部孔セクションは前記下部孔セクションの上方にある突出唇部の形状を規定し、前記パッドは前記下部カプセル・セクションを突出唇部に吊り下げることにより前記パッドに固定したことを特徴とする
請求項1に記載の研磨パッド。 - 前記上部孔セクションは前記下部孔セクションの上方にある突出唇部の形状を規定し、前記パッドは前記下部カプセル・セクションを突出唇部に吊り下げることにより前記パッドに固定したことを特徴とする
請求項2に記載の研磨パッド。 - ウェーハを研磨する装置で、該装置は
研磨パッド、
該研磨パッド中に配置された光学アセンブリで構成され、
前記光学アセンブリは更に前記研磨パッド中に配置され、該光学アセンブリが研磨パッド中に上下に移動できるようにしたことを特徴とする
ウェーハを研磨する装置。 - 上部パッド層及び下部パッド層と、
該上部及び下部パッド層中に配置された光学アセンブリとで構成され、該光学アセンブリはフランジを有し、該フランジは前記下部パッド層中の円形ボイド中に配置され、光学アセンブリが研磨パッド中で上下に移動できるようにのりのビードで該パッド上層より吊り下げられていることを特徴とする研磨パッド。 - 前記フランジ中に配置されたシムでも構成されていることを特徴とする請求項6に記載の研磨パッド。
- 前記光学アセンブリの上部が面取り縁を有することを特徴とする請求項6に記載の研磨パッド。
- 前記光学アセンブリの上部が面取り縁を有することを特徴とする請求項7に記載の研磨パッド。
- 上部パッド層及び下部パッド層で、1つの孔が該上部及び下部パッド層に配置され、該孔は上部パッド層に配置された上部孔セクションと下部パッド層に配置された下部孔セクションを有し、下部孔セクションが上部孔セクションより大きい、上部パッド層及び下部パッド層と、
前記孔に配置された光学アセンブリで、該光学アセンブリはセンサ筐体中に配置されたセンサで構成され、該センサ筐体は上部セクションと下部セクションを有し、センサ筐体の底部セクションに延長部が配置されている、光学アセンブリと
で構成され、
前記延長部は前記下部孔セクション中に配置され、前記延長部は上部パッド層より吊り下がっている
ことを特徴とする研磨パッド。 - 前記延長部は前記光学アセンブリの底部セクションに配置された柔軟性膜で構成されていることを特徴とする、請求項10に記載のパッド。
- 前記光学アセンブリの厚さと延長部の厚さは、前記光学アセンブリが前記下部孔セクション内で上下に移動できるように小さいことを特徴とする、請求項10に記載のパッド。
- 前記センサは光学センサで構成されていることを特徴とする、請求項10に記載のパッド。
- 前記センサは光学センサで構成されていることを特徴とする、請求項12に記載のパッド。
- 前記ワークピースの光学特性を検出する手段は、光源からの光が前記ワークピースの表面で反射した反射光の強度を検出するものであることを特徴とする、請求項1に記載の研磨パッド。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/146,494 US6726528B2 (en) | 2002-05-14 | 2002-05-14 | Polishing pad with optical sensor |
PCT/US2003/014950 WO2003097300A1 (en) | 2002-05-14 | 2003-05-12 | Polishing pad with optical sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005525246A JP2005525246A (ja) | 2005-08-25 |
JP4471832B2 true JP4471832B2 (ja) | 2010-06-02 |
Family
ID=29418829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004504680A Expired - Fee Related JP4471832B2 (ja) | 2002-05-14 | 2003-05-12 | 光学センサ付き研磨パッド |
Country Status (8)
Country | Link |
---|---|
US (2) | US6726528B2 (ja) |
EP (1) | EP1513652B1 (ja) |
JP (1) | JP4471832B2 (ja) |
KR (1) | KR100973126B1 (ja) |
CN (1) | CN100571982C (ja) |
AU (1) | AU2003234417A1 (ja) |
TW (1) | TWI228065B (ja) |
WO (1) | WO2003097300A1 (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7127362B2 (en) * | 2000-08-22 | 2006-10-24 | Mundt Randall S | Process tolerant methods and apparatus for obtaining data |
SE521608C2 (sv) * | 2002-03-13 | 2003-11-18 | Htc Sweden Ab | Anordning vid ett för städning avsett cirkulärt, skivformigt städningselement samt användning av städningselementet |
US7235154B2 (en) * | 2004-01-08 | 2007-06-26 | Strasbaugh | Devices and methods for optical endpoint detection during semiconductor wafer polishing |
US7066788B2 (en) * | 2004-11-10 | 2006-06-27 | Ultra Tec Manufacturing, Inc. | Electronic die positioning device and method |
US7722434B2 (en) | 2005-03-29 | 2010-05-25 | Kla-Tencor Corporation | Apparatus for measurement of parameters in process equipment |
US20070235133A1 (en) * | 2006-03-29 | 2007-10-11 | Strasbaugh | Devices and methods for measuring wafer characteristics during semiconductor wafer polishing |
US7698952B2 (en) * | 2006-10-03 | 2010-04-20 | Kla-Tencor Corporation | Pressure sensing device |
US7575504B2 (en) * | 2006-11-22 | 2009-08-18 | Applied Materials, Inc. | Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly |
TWM347669U (en) * | 2008-06-19 | 2008-12-21 | Bestac Advanced Material Co Ltd | Polishing pad and polishing device |
US20110183583A1 (en) * | 2008-07-18 | 2011-07-28 | Joseph William D | Polishing Pad with Floating Elements and Method of Making and Using the Same |
US8182312B2 (en) * | 2008-09-06 | 2012-05-22 | Strasbaugh | CMP system with wireless endpoint detection system |
US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
US8439994B2 (en) | 2010-09-30 | 2013-05-14 | Nexplanar Corporation | Method of fabricating a polishing pad with an end-point detection region for eddy current end-point detection |
US8628384B2 (en) * | 2010-09-30 | 2014-01-14 | Nexplanar Corporation | Polishing pad for eddy current end-point detection |
US8657653B2 (en) | 2010-09-30 | 2014-02-25 | Nexplanar Corporation | Homogeneous polishing pad for eddy current end-point detection |
CN107649953A (zh) * | 2016-07-26 | 2018-02-02 | 万象设计江苏有限责任公司 | 一种可检测打磨轮的圆管外表面打磨工装 |
CN110919513B (zh) * | 2019-12-16 | 2021-06-29 | 江西桔王药业有限公司 | 一种胶囊药品抛光机 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03234467A (ja) | 1990-02-05 | 1991-10-18 | Canon Inc | スタンパの金型取付面の研磨方法およびその研磨機 |
US5081796A (en) | 1990-08-06 | 1992-01-21 | Micron Technology, Inc. | Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer |
US6614529B1 (en) | 1992-12-28 | 2003-09-02 | Applied Materials, Inc. | In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization |
US5433651A (en) | 1993-12-22 | 1995-07-18 | International Business Machines Corporation | In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
JP3313505B2 (ja) * | 1994-04-14 | 2002-08-12 | 株式会社日立製作所 | 研磨加工法 |
US5893796A (en) | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
US5838447A (en) | 1995-07-20 | 1998-11-17 | Ebara Corporation | Polishing apparatus including thickness or flatness detector |
US6068539A (en) | 1998-03-10 | 2000-05-30 | Lam Research Corporation | Wafer polishing device with movable window |
US6106662A (en) | 1998-06-08 | 2000-08-22 | Speedfam-Ipec Corporation | Method and apparatus for endpoint detection for chemical mechanical polishing |
US6322422B1 (en) * | 1999-01-19 | 2001-11-27 | Nec Corporation | Apparatus for accurately measuring local thickness of insulating layer on semiconductor wafer during polishing and polishing system using the same |
US6190234B1 (en) | 1999-01-25 | 2001-02-20 | Applied Materials, Inc. | Endpoint detection with light beams of different wavelengths |
US6146242A (en) | 1999-06-11 | 2000-11-14 | Strasbaugh, Inc. | Optical view port for chemical mechanical planarization endpoint detection |
US6454630B1 (en) * | 1999-09-14 | 2002-09-24 | Applied Materials, Inc. | Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same |
US6485354B1 (en) * | 2000-06-09 | 2002-11-26 | Strasbaugh | Polishing pad with built-in optical sensor |
US6447369B1 (en) * | 2000-08-30 | 2002-09-10 | Micron Technology, Inc. | Planarizing machines and alignment systems for mechanical and/or chemical-mechanical planarization of microelectronic substrates |
US6257953B1 (en) * | 2000-09-25 | 2001-07-10 | Center For Tribology, Inc. | Method and apparatus for controlled polishing |
US20020137431A1 (en) * | 2001-03-23 | 2002-09-26 | Labunsky Michael A. | Methods and apparatus for polishing and planarization |
EP1674922A1 (en) * | 2004-12-27 | 2006-06-28 | Samsung Electronics Co., Ltd. | Liquid crystal display |
-
2002
- 2002-05-14 US US10/146,494 patent/US6726528B2/en not_active Expired - Lifetime
- 2002-08-08 US US10/216,107 patent/US6884150B2/en not_active Expired - Lifetime
-
2003
- 2003-05-12 EP EP03728857.8A patent/EP1513652B1/en not_active Expired - Lifetime
- 2003-05-12 CN CNB038144727A patent/CN100571982C/zh not_active Expired - Fee Related
- 2003-05-12 JP JP2004504680A patent/JP4471832B2/ja not_active Expired - Fee Related
- 2003-05-12 KR KR1020047018378A patent/KR100973126B1/ko not_active IP Right Cessation
- 2003-05-12 AU AU2003234417A patent/AU2003234417A1/en not_active Abandoned
- 2003-05-12 WO PCT/US2003/014950 patent/WO2003097300A1/en active Application Filing
- 2003-05-13 TW TW092113101A patent/TWI228065B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1662344A (zh) | 2005-08-31 |
JP2005525246A (ja) | 2005-08-25 |
EP1513652B1 (en) | 2014-03-26 |
EP1513652A1 (en) | 2005-03-16 |
US20030216108A1 (en) | 2003-11-20 |
KR20040106548A (ko) | 2004-12-17 |
AU2003234417A1 (en) | 2003-12-02 |
TWI228065B (en) | 2005-02-21 |
US20030216107A1 (en) | 2003-11-20 |
KR100973126B1 (ko) | 2010-07-29 |
TW200414969A (en) | 2004-08-16 |
EP1513652A4 (en) | 2008-07-16 |
US6884150B2 (en) | 2005-04-26 |
WO2003097300A1 (en) | 2003-11-27 |
US6726528B2 (en) | 2004-04-27 |
CN100571982C (zh) | 2009-12-23 |
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