KR100345772B1 - 서킷테이프 부착장치 - Google Patents
서킷테이프 부착장치 Download PDFInfo
- Publication number
- KR100345772B1 KR100345772B1 KR1020000063794A KR20000063794A KR100345772B1 KR 100345772 B1 KR100345772 B1 KR 100345772B1 KR 1020000063794 A KR1020000063794 A KR 1020000063794A KR 20000063794 A KR20000063794 A KR 20000063794A KR 100345772 B1 KR100345772 B1 KR 100345772B1
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- South Korea
- Prior art keywords
- circuit tape
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
Claims (2)
- 캐리어(10)의 상면에 공급된 서킷테이프(1)를 밀착가압하여 캐리어(10)의 상면에 부착하는 서킷테이프 부착장치에 있어서, 이 서킷테이프 부착장치는 프레임(28)과, 이 프레임(28)에 승강가능하게 설치된 승강블록(30)과, 이 프레임(28)에 구비되어 상기 승강블록(30)을 승강시키는 승강기구(32)와, 상기 승강블록(30)의 하측에 설치되며 승강에 따라 상기 서킷테이프(1)의 상면을 가압하여 캐리어(10)에 압착하는 가압패드(34)를 포함하여 구성되며, 상기 가압패드(34)는 신축성재질로 구성되며 그 하측면이 경사지게 형성되어 서킷테이프(1)를 일측부터 순차적으로 가압할 수 있도록 된 것을 특징으로 하는 서킷테이프 부착장치.
- 제 1항에 있어서, 상기 승강블록(30)은 상기 승강기구(32)에 의해 승강되는 홀더블록(38)과, 대략 판상으로 구성되어 상기 홀더블록(38)의 하측면에 탈착가능하게 장착되며 그 저면에 상기 가압패드(34)가 장착된 패드홀더(40)를 포함하여 구성되며, 상기 홀더블록(38)의 하측면 양단에는 그 중앙쪽으로 내향돌출된 걸림턱(42)이 형성되며, 상기 패드홀더(40)의 양단에는 상기 걸림턱(42)에 걸리는 돌출턱(44)이 형성되어, 패드홀더(40)를 홀더블록(38)의 일측에서 삽입하므로써, 패드홀더(40)를 홀더블록(38)에 설치할 수 있도록 구성되는 것을 특징으로 하는 서킷테이프 부착장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020000063794A KR100345772B1 (ko) | 2000-10-28 | 2000-10-28 | 서킷테이프 부착장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020000063794A KR100345772B1 (ko) | 2000-10-28 | 2000-10-28 | 서킷테이프 부착장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010007952A KR20010007952A (ko) | 2001-02-05 |
KR100345772B1 true KR100345772B1 (ko) | 2002-07-24 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020000063794A KR100345772B1 (ko) | 2000-10-28 | 2000-10-28 | 서킷테이프 부착장치 |
Country Status (1)
Country | Link |
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KR (1) | KR100345772B1 (ko) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06342868A (ja) * | 1993-05-31 | 1994-12-13 | Hitachi Cable Ltd | リードフレームへのフィルム貼付け方法,及び装置 |
KR20000015584A (ko) * | 1998-08-31 | 2000-03-15 | 김규현 | 반도체 패키지 제조를 위한 웨이퍼와 써킷테이프가열 가압장치 |
KR20000015582A (ko) * | 1998-08-31 | 2000-03-15 | 김규현 | 반도체 패키지 제조를 위한 웨이퍼와 써킷테이프의 라미네이션장치 및 그 방법 |
KR20000043519A (ko) * | 1998-12-29 | 2000-07-15 | 윤종용 | 반도체 패키지 제조용 접착제필름 부착장치 |
-
2000
- 2000-10-28 KR KR1020000063794A patent/KR100345772B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06342868A (ja) * | 1993-05-31 | 1994-12-13 | Hitachi Cable Ltd | リードフレームへのフィルム貼付け方法,及び装置 |
KR20000015584A (ko) * | 1998-08-31 | 2000-03-15 | 김규현 | 반도체 패키지 제조를 위한 웨이퍼와 써킷테이프가열 가압장치 |
KR20000015582A (ko) * | 1998-08-31 | 2000-03-15 | 김규현 | 반도체 패키지 제조를 위한 웨이퍼와 써킷테이프의 라미네이션장치 및 그 방법 |
KR20000043519A (ko) * | 1998-12-29 | 2000-07-15 | 윤종용 | 반도체 패키지 제조용 접착제필름 부착장치 |
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Publication number | Publication date |
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KR20010007952A (ko) | 2001-02-05 |
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