KR100328906B1 - 리드프레임의리드온칩내부리드를결합하는방법및장치 - Google Patents

리드프레임의리드온칩내부리드를결합하는방법및장치 Download PDF

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Publication number
KR100328906B1
KR100328906B1 KR1019930020077A KR930020077A KR100328906B1 KR 100328906 B1 KR100328906 B1 KR 100328906B1 KR 1019930020077 A KR1019930020077 A KR 1019930020077A KR 930020077 A KR930020077 A KR 930020077A KR 100328906 B1 KR100328906 B1 KR 100328906B1
Authority
KR
South Korea
Prior art keywords
coupling
lead frame
lead
bus bar
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019930020077A
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English (en)
Korean (ko)
Other versions
KR940008057A (ko
Inventor
분씨.테오
티잔드라카르타
시유더블유.로우
Original Assignee
윌리엄 비. 켐플러
텍사스 인스트루먼츠 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 윌리엄 비. 켐플러, 텍사스 인스트루먼츠 인코포레이티드 filed Critical 윌리엄 비. 켐플러
Publication of KR940008057A publication Critical patent/KR940008057A/ko
Application granted granted Critical
Publication of KR100328906B1 publication Critical patent/KR100328906B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H10W76/10—
    • H10W70/427—
    • H10W70/415—
    • H10W70/442—
    • H10W70/451—
    • H10W72/00—
    • H10W72/932—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1019930020077A 1992-09-30 1993-09-28 리드프레임의리드온칩내부리드를결합하는방법및장치 Expired - Lifetime KR100328906B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/954,183 US5331200A (en) 1992-09-30 1992-09-30 Lead-on-chip inner lead bonding lead frame method and apparatus
US07/954,183 1992-09-30

Publications (2)

Publication Number Publication Date
KR940008057A KR940008057A (ko) 1994-04-28
KR100328906B1 true KR100328906B1 (ko) 2002-07-08

Family

ID=25495054

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930020077A Expired - Lifetime KR100328906B1 (ko) 1992-09-30 1993-09-28 리드프레임의리드온칩내부리드를결합하는방법및장치

Country Status (7)

Country Link
US (1) US5331200A (cg-RX-API-DMAC10.html)
EP (1) EP0590986B1 (cg-RX-API-DMAC10.html)
JP (1) JPH06283567A (cg-RX-API-DMAC10.html)
KR (1) KR100328906B1 (cg-RX-API-DMAC10.html)
DE (1) DE69329000D1 (cg-RX-API-DMAC10.html)
SG (1) SG44609A1 (cg-RX-API-DMAC10.html)
TW (1) TW239901B (cg-RX-API-DMAC10.html)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2732767B2 (ja) * 1992-12-22 1998-03-30 株式会社東芝 樹脂封止型半導体装置
US5729049A (en) * 1996-03-19 1998-03-17 Micron Technology, Inc. Tape under frame for conventional-type IC package assembly
US6078502A (en) * 1996-04-01 2000-06-20 Lsi Logic Corporation System having heat dissipating leadframes
US5717246A (en) 1996-07-29 1998-02-10 Micron Technology, Inc. Hybrid frame with lead-lock tape
US5763945A (en) * 1996-09-13 1998-06-09 Micron Technology, Inc. Integrated circuit package electrical enhancement with improved lead frame design
US5907184A (en) * 1998-03-25 1999-05-25 Micron Technology, Inc. Integrated circuit package electrical enhancement
US5817540A (en) * 1996-09-20 1998-10-06 Micron Technology, Inc. Method of fabricating flip-chip on leads devices and resulting assemblies
US6068174A (en) 1996-12-13 2000-05-30 Micro)N Technology, Inc. Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
US6462404B1 (en) * 1997-02-28 2002-10-08 Micron Technology, Inc. Multilevel leadframe for a packaged integrated circuit
US6271582B1 (en) * 1997-04-07 2001-08-07 Micron Technology, Inc. Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die
US6008996A (en) * 1997-04-07 1999-12-28 Micron Technology, Inc. Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die
US5780923A (en) 1997-06-10 1998-07-14 Micron Technology, Inc. Modified bus bar with Kapton™ tape or insulative material on LOC packaged part
US6580157B2 (en) * 1997-06-10 2003-06-17 Micron Technology, Inc. Assembly and method for modified bus bar with Kapton™ tape or insulative material in LOC packaged part
SG73480A1 (en) * 1997-11-06 2000-06-20 Texas Instr Singapore Pte Ltd High density integrated circuit package
US6144089A (en) 1997-11-26 2000-11-07 Micron Technology, Inc. Inner-digitized bond fingers on bus bars of semiconductor device package
EP0924811A1 (en) * 1997-12-19 1999-06-23 Osram Sylvania Inc. Lead-frame, lead-frame assembly and related methods
SG79963A1 (en) * 1998-03-28 2001-04-17 Texas Instr Singapore Pte Ltd Semiconductor device testing and burn-in methodology
US6124150A (en) * 1998-08-20 2000-09-26 Micron Technology, Inc. Transverse hybrid LOC package
US6052289A (en) * 1998-08-26 2000-04-18 Micron Technology, Inc. Interdigitated leads-over-chip lead frame for supporting an integrated circuit die
KR100408391B1 (ko) * 2000-06-09 2003-12-06 삼성전자주식회사 전원 배선을 개선한 볼그리드 어레이 패키지 반도체 장치
US7154186B2 (en) * 2004-03-18 2006-12-26 Fairchild Semiconductor Corporation Multi-flip chip on lead frame on over molded IC package and method of assembly
TWI447878B (zh) * 2009-08-28 2014-08-01 杰群科技有限公司 增加通路及降低電阻之電晶體連接結構
US9263370B2 (en) * 2013-09-27 2016-02-16 Qualcomm Mems Technologies, Inc. Semiconductor device with via bar
US9570381B2 (en) * 2015-04-02 2017-02-14 Advanced Semiconductor Engineering, Inc. Semiconductor packages and related manufacturing methods

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57114261A (en) * 1981-01-07 1982-07-16 Hitachi Ltd Lead frame structure
US4801999A (en) * 1987-07-15 1989-01-31 Advanced Micro Devices, Inc. Integrated circuit lead frame assembly containing voltage bussing and distribution to an integrated circuit die using tape automated bonding with two metal layers

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4754317A (en) * 1986-04-28 1988-06-28 Monolithic Memories, Inc. Integrated circuit die-to-lead frame interconnection assembly and method
KR0158868B1 (ko) * 1988-09-20 1998-12-01 미다 가쓰시게 반도체장치
US5227661A (en) * 1990-09-24 1993-07-13 Texas Instruments Incorporated Integrated circuit device having an aminopropyltriethoxysilane coating
US5206536A (en) * 1991-01-23 1993-04-27 Texas Instruments, Incorporated Comb insert for semiconductor packaged devices
KR940006164B1 (ko) * 1991-05-11 1994-07-08 금성일렉트론 주식회사 반도체 패키지 및 그 제조방법
JPH05114685A (ja) * 1991-10-23 1993-05-07 Mitsubishi Electric Corp 半導体装置
JPH077121A (ja) * 1992-09-18 1995-01-10 Texas Instr Inc <Ti> 多層リードフレームアセンブリを有する半導体デバイスおよびそのパッケージ方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57114261A (en) * 1981-01-07 1982-07-16 Hitachi Ltd Lead frame structure
US4801999A (en) * 1987-07-15 1989-01-31 Advanced Micro Devices, Inc. Integrated circuit lead frame assembly containing voltage bussing and distribution to an integrated circuit die using tape automated bonding with two metal layers

Also Published As

Publication number Publication date
TW239901B (cg-RX-API-DMAC10.html) 1995-02-01
EP0590986A1 (en) 1994-04-06
JPH06283567A (ja) 1994-10-07
KR940008057A (ko) 1994-04-28
SG44609A1 (en) 1997-12-19
US5331200A (en) 1994-07-19
DE69329000D1 (de) 2000-08-17
EP0590986B1 (en) 2000-07-12

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