SG79963A1 - Semiconductor device testing and burn-in methodology - Google Patents
Semiconductor device testing and burn-in methodologyInfo
- Publication number
- SG79963A1 SG79963A1 SG9800654A SG1998000654A SG79963A1 SG 79963 A1 SG79963 A1 SG 79963A1 SG 9800654 A SG9800654 A SG 9800654A SG 1998000654 A SG1998000654 A SG 1998000654A SG 79963 A1 SG79963 A1 SG 79963A1
- Authority
- SG
- Singapore
- Prior art keywords
- methodology
- burn
- semiconductor device
- device testing
- testing
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG9800654A SG79963A1 (en) | 1998-03-28 | 1998-03-28 | Semiconductor device testing and burn-in methodology |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG9800654A SG79963A1 (en) | 1998-03-28 | 1998-03-28 | Semiconductor device testing and burn-in methodology |
Publications (1)
Publication Number | Publication Date |
---|---|
SG79963A1 true SG79963A1 (en) | 2001-04-17 |
Family
ID=20429962
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG9800654A SG79963A1 (en) | 1998-03-28 | 1998-03-28 | Semiconductor device testing and burn-in methodology |
Country Status (1)
Country | Link |
---|---|
SG (1) | SG79963A1 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0590986A1 (en) * | 1992-09-30 | 1994-04-06 | Texas Instruments Incorporated | Lead-on-chip inner lead bonding lead frame, bonding method and apparatus |
US5594273A (en) * | 1993-07-23 | 1997-01-14 | Motorola Inc. | Apparatus for performing wafer-level testing of integrated circuits where test pads lie within integrated circuit die but overly no active circuitry for improved yield |
US5600257A (en) * | 1995-08-09 | 1997-02-04 | International Business Machines Corporation | Semiconductor wafer test and burn-in |
-
1998
- 1998-03-28 SG SG9800654A patent/SG79963A1/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0590986A1 (en) * | 1992-09-30 | 1994-04-06 | Texas Instruments Incorporated | Lead-on-chip inner lead bonding lead frame, bonding method and apparatus |
US5594273A (en) * | 1993-07-23 | 1997-01-14 | Motorola Inc. | Apparatus for performing wafer-level testing of integrated circuits where test pads lie within integrated circuit die but overly no active circuitry for improved yield |
US5600257A (en) * | 1995-08-09 | 1997-02-04 | International Business Machines Corporation | Semiconductor wafer test and burn-in |
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