SG80587A1 - Semiconductor device testing and burn-in methodology - Google Patents

Semiconductor device testing and burn-in methodology

Info

Publication number
SG80587A1
SG80587A1 SG9800617A SG1998000617A SG80587A1 SG 80587 A1 SG80587 A1 SG 80587A1 SG 9800617 A SG9800617 A SG 9800617A SG 1998000617 A SG1998000617 A SG 1998000617A SG 80587 A1 SG80587 A1 SG 80587A1
Authority
SG
Singapore
Prior art keywords
methodology
burn
semiconductor device
device testing
testing
Prior art date
Application number
SG9800617A
Inventor
Yean Tay Wuu
Kiang Yew Chee
Choon Seah Yee
K Hii Francis
Sen Yong Sui
Original Assignee
Texas Instr Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instr Singapore Pte Ltd filed Critical Texas Instr Singapore Pte Ltd
Priority to SG9800617A priority Critical patent/SG80587A1/en
Publication of SG80587A1 publication Critical patent/SG80587A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
SG9800617A 1998-03-25 1998-03-25 Semiconductor device testing and burn-in methodology SG80587A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG9800617A SG80587A1 (en) 1998-03-25 1998-03-25 Semiconductor device testing and burn-in methodology

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG9800617A SG80587A1 (en) 1998-03-25 1998-03-25 Semiconductor device testing and burn-in methodology

Publications (1)

Publication Number Publication Date
SG80587A1 true SG80587A1 (en) 2001-05-22

Family

ID=20429961

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9800617A SG80587A1 (en) 1998-03-25 1998-03-25 Semiconductor device testing and burn-in methodology

Country Status (1)

Country Link
SG (1) SG80587A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0439134A2 (en) * 1990-01-23 1991-07-31 Sumitomo Electric Industries, Ltd. Substrate for packaging a semiconductor device, packaging structure and method
US5521427A (en) * 1992-12-18 1996-05-28 Lsi Logic Corporation Printed wiring board mounted semiconductor device having leadframe with alignment feature
US5637919A (en) * 1993-07-28 1997-06-10 Grabbe; Dimitry G. Perimeter independent precision locating member

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0439134A2 (en) * 1990-01-23 1991-07-31 Sumitomo Electric Industries, Ltd. Substrate for packaging a semiconductor device, packaging structure and method
US5521427A (en) * 1992-12-18 1996-05-28 Lsi Logic Corporation Printed wiring board mounted semiconductor device having leadframe with alignment feature
US5637919A (en) * 1993-07-28 1997-06-10 Grabbe; Dimitry G. Perimeter independent precision locating member

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