KR100282622B1 - 폴리스티렌 기제 광내식막 물질 - Google Patents

폴리스티렌 기제 광내식막 물질 Download PDF

Info

Publication number
KR100282622B1
KR100282622B1 KR1019930007270A KR930007270A KR100282622B1 KR 100282622 B1 KR100282622 B1 KR 100282622B1 KR 1019930007270 A KR1019930007270 A KR 1019930007270A KR 930007270 A KR930007270 A KR 930007270A KR 100282622 B1 KR100282622 B1 KR 100282622B1
Authority
KR
South Korea
Prior art keywords
formula
substituted
alkyl
halogen
cyano
Prior art date
Application number
KR1019930007270A
Other languages
English (en)
Korean (ko)
Other versions
KR930021588A (ko
Inventor
슈타인만 알프레드
Original Assignee
스티븐티.워쇼
아치 스페셜티 케미칼즈, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스티븐티.워쇼, 아치 스페셜티 케미칼즈, 인코포레이티드 filed Critical 스티븐티.워쇼
Publication of KR930021588A publication Critical patent/KR930021588A/ko
Application granted granted Critical
Publication of KR100282622B1 publication Critical patent/KR100282622B1/ko

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C43/00Ethers; Compounds having groups, groups or groups
    • C07C43/02Ethers
    • C07C43/20Ethers having an ether-oxygen atom bound to a carbon atom of a six-membered aromatic ring
    • C07C43/215Ethers having an ether-oxygen atom bound to a carbon atom of a six-membered aromatic ring having unsaturation outside the six-membered aromatic rings
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C43/00Ethers; Compounds having groups, groups or groups
    • C07C43/02Ethers
    • C07C43/20Ethers having an ether-oxygen atom bound to a carbon atom of a six-membered aromatic ring
    • C07C43/225Ethers having an ether-oxygen atom bound to a carbon atom of a six-membered aromatic ring containing halogen
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/96Esters of carbonic or haloformic acids
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D307/00Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
    • C07D307/02Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom not condensed with other rings
    • C07D307/04Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom not condensed with other rings having no double bonds between ring members or between ring members and non-ring members
    • C07D307/18Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom not condensed with other rings having no double bonds between ring members or between ring members and non-ring members with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to ring carbon atoms
    • C07D307/20Oxygen atoms
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D309/00Heterocyclic compounds containing six-membered rings having one oxygen atom as the only ring hetero atom, not condensed with other rings
    • C07D309/02Heterocyclic compounds containing six-membered rings having one oxygen atom as the only ring hetero atom, not condensed with other rings having no double bonds between ring members or between ring members and non-ring members
    • C07D309/08Heterocyclic compounds containing six-membered rings having one oxygen atom as the only ring hetero atom, not condensed with other rings having no double bonds between ring members or between ring members and non-ring members with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to ring carbon atoms
    • C07D309/10Oxygen atoms
    • C07D309/12Oxygen atoms only hydrogen atoms and one oxygen atom directly attached to ring carbon atoms, e.g. tetrahydropyranyl ethers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F12/00Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F12/02Monomers containing only one unsaturated aliphatic radical
    • C08F12/04Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F12/14Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing heteroatoms
    • C08F12/22Oxygen
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Emergency Medicine (AREA)
  • Polymers & Plastics (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials For Photolithography (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Pyrane Compounds (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Furan Compounds (AREA)
KR1019930007270A 1992-04-29 1993-04-28 폴리스티렌 기제 광내식막 물질 KR100282622B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH137892 1992-04-29
CH92-9/1378 1992-04-29
JP92/111823 1992-04-30

Publications (2)

Publication Number Publication Date
KR930021588A KR930021588A (ko) 1993-11-22
KR100282622B1 true KR100282622B1 (ko) 2001-02-15

Family

ID=4209027

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930007270A KR100282622B1 (ko) 1992-04-29 1993-04-28 폴리스티렌 기제 광내식막 물질

Country Status (6)

Country Link
US (1) US5324804A (US06265458-20010724-C00018.png)
EP (1) EP0568496B1 (US06265458-20010724-C00018.png)
JP (1) JPH06100488A (US06265458-20010724-C00018.png)
KR (1) KR100282622B1 (US06265458-20010724-C00018.png)
DE (1) DE59309253D1 (US06265458-20010724-C00018.png)
TW (1) TW304235B (US06265458-20010724-C00018.png)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0601974B1 (de) * 1992-12-04 1997-05-28 OCG Microelectronic Materials Inc. Positiv-Photoresist mit verbesserten Prozesseigenschaften
KR100233367B1 (ko) * 1993-04-15 1999-12-01 카나가와 치히로 레지스트 재료
JP2936956B2 (ja) * 1993-04-15 1999-08-23 信越化学工業株式会社 レジスト材料
EP0709410A3 (en) * 1994-10-26 1997-03-26 Ocg Microelectronic Materials Polymers
KR100293130B1 (ko) * 1995-04-12 2001-09-17 카나가와 치히로 고분자화합물및화학증폭포지티브형레지스트재료
DE19538160A1 (de) 1995-10-13 1997-04-17 Hoechst Ag Formgebilde aus einem thermoplastischen Kunststoffschaum, Verfahren zu seiner Herstellung sowie seine Verwendung
KR0185319B1 (ko) * 1996-09-21 1999-05-15 김흥기 포지티브 포토레지스트 제조용 수지 및 이 수지를 함유하는 화학증폭형 포지티브 포토레지스트 조성물
US5962184A (en) * 1996-12-13 1999-10-05 International Business Machines Corporation Photoresist composition comprising a copolymer of a hydroxystyrene and a (meth)acrylate substituted with an alicyclic ester substituent
TW528932B (en) * 1997-01-24 2003-04-21 Shinetsu Chemical Co Polymers and chemically amplified positive resist compositions
TW530192B (en) * 1997-01-27 2003-05-01 Shinetsu Chemical Co Partially hydrogenated polymer compound and chemically sensitized positive resist material
TW574629B (en) * 1997-02-28 2004-02-01 Shinetsu Chemical Co Polystyrene derivative chemically amplified positive resist compositions, and patterning method
US6384169B1 (en) 1997-10-08 2002-05-07 Shin-Etsu Chemical Co., Ltd. Styrene polymer, chemically amplified positive resist composition and patterning process
TW546543B (en) * 1997-10-08 2003-08-11 Shinetsu Chemical Co Resist material and patterning process
US6207353B1 (en) 1997-12-10 2001-03-27 International Business Machines Corporation Resist formulation which minimizes blistering during etching
KR100321080B1 (ko) 1997-12-29 2002-11-22 주식회사 하이닉스반도체 공중합체수지와이의제조방법및이수지를이용한포토레지스트
KR100252061B1 (ko) * 1998-04-20 2000-06-01 윤종용 포토레지스트용 중합체, 이를 포함하는 포토레지스트 조성물 및이의 제조방법
JP3587743B2 (ja) 1998-08-26 2004-11-10 株式会社ハイニックスセミコンダクター フォトレジスト単量体とその製造方法、フォトレジスト共重合体とその製造方法、フォトレジスト組成物、フォトレジストパターン形成方法、および、半導体素子。
US6569971B2 (en) 1998-08-27 2003-05-27 Hyundai Electronics Industries Co., Ltd. Polymers for photoresist and photoresist compositions using the same
TW487828B (en) * 1998-10-29 2002-05-21 Shinetsu Chemical Co Positive resist composition
KR20000056355A (ko) * 1999-02-19 2000-09-15 김영환 고농도의 아민 존재하에서 우수한 특성을 갖는 포토레지스트 조성물
JP3299215B2 (ja) 1999-03-12 2002-07-08 松下電器産業株式会社 パターン形成方法
JP3755571B2 (ja) 1999-11-12 2006-03-15 信越化学工業株式会社 化学増幅ポジ型レジスト材料及びパターン形成方法
KR100616399B1 (ko) 2000-03-09 2006-08-29 신에쓰 가가꾸 고교 가부시끼가이샤 화학 증폭형 레지스트 재료
JP3712047B2 (ja) 2000-08-14 2005-11-02 信越化学工業株式会社 レジスト材料及びパターン形成方法
EP1204001B1 (en) 2000-11-01 2013-09-11 Shin-Etsu Chemical Co., Ltd. Resist composition and patterning process
JP3821217B2 (ja) 2001-10-30 2006-09-13 信越化学工業株式会社 レジスト材料及びパターン形成方法
JP3844069B2 (ja) 2002-07-04 2006-11-08 信越化学工業株式会社 レジスト材料及びパターン形成方法
JP4068006B2 (ja) * 2003-05-07 2008-03-26 信越化学工業株式会社 サーマルフロー工程を用いた微細なコンタクトホール形成方法
JP3981830B2 (ja) * 2003-05-26 2007-09-26 信越化学工業株式会社 レジスト材料及びパターン形成方法
US7586013B2 (en) * 2004-03-26 2009-09-08 E.I. Du Pont De Nemours And Company Method for preparing hydroxystyrenes and acetylated derivatives thereof
JP4081491B2 (ja) * 2004-05-27 2008-04-23 株式会社シンク・ラボラトリー ポジ型感光性組成物
JP4582331B2 (ja) * 2005-11-08 2010-11-17 信越化学工業株式会社 レジスト材料及びパターン形成方法
US7402713B2 (en) * 2006-03-07 2008-07-22 E.I. Du Pont De Nemours And Company Processes for conversion of tyrosine to p-hydroxystyrene and p-acetoxystyrene
US8759465B2 (en) * 2006-04-25 2014-06-24 Purdue Research Foundation Cross-linkable polymeric compositions
JP5183903B2 (ja) 2006-10-13 2013-04-17 信越化学工業株式会社 高分子化合物、レジスト材料及びこれを用いたパターン形成方法
BRPI1015573B1 (pt) * 2009-07-01 2019-11-12 Bridgestone Corp método para fabricação de interpolímero com funcionalidade hidróxi-arila por polimerização iniciada via radical livre
KR101191129B1 (ko) * 2010-11-10 2012-10-15 주식회사 엘지화학 광학 소자
WO2018087816A1 (ja) * 2016-11-08 2018-05-17 日立化成株式会社 感光性導電フィルム、導電パターンの形成方法及び導電パターン基材の製造方法
JP7226408B2 (ja) * 2020-07-30 2023-02-21 セイコーエプソン株式会社 電気光学装置および電子機器

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6030687B2 (ja) * 1980-08-30 1985-07-18 丸善石油株式会社 パラヒドロキシスチレン重合体の製法
JPS6030686B2 (ja) * 1980-08-30 1985-07-18 丸善石油株式会社 パラヒドロキシスチレン重合体の製造方法
US4491628A (en) * 1982-08-23 1985-01-01 International Business Machines Corporation Positive- and negative-working resist compositions with acid generating photoinitiator and polymer with acid labile groups pendant from polymer backbone
JPS61163913A (ja) * 1985-01-12 1986-07-24 デソト,インコ−ポレ−テツド 光ファイバー用被覆材料
JPH0678409B2 (ja) * 1986-02-04 1994-10-05 松下電器産業株式会社 樹脂組成物の混合方法
JP2548009B2 (ja) * 1987-06-16 1996-10-30 日曹丸善ケミカル株式会社 反応性高分子化合物の製造方法
JP2521477B2 (ja) * 1987-06-16 1996-08-07 日曹丸善ケミカル株式会社 反応性高分子化合物を含む組成物及びその製造方法
JPH0832860B2 (ja) * 1987-06-29 1996-03-29 ニチバン株式会社 電離放射線硬化粘着剤組成物
DE3817012A1 (de) * 1988-05-19 1989-11-30 Basf Ag Positiv und negativ arbeitende strahlungsempfindliche gemische sowie verfahren zur herstellung von reliefmustern
DE3828064A1 (de) * 1988-08-18 1990-03-01 Hoechst Ag Polymerisate aus substituierten (2-haloalkoxy-1,1,2-trifluoraethoxy)-styrolen, verfahren zu ihrer herstellung und ihre verwendung
JP3057508B2 (ja) * 1990-06-21 2000-06-26 日本曹達株式会社 p―アルケニルフェノール系重合体の製造方法
DE69119777T2 (de) * 1990-09-18 1996-11-07 Akzo Nobel N.V., Arnheim/Arnhem Copolymerisationsverfahren und damit hergestelltes copolymer für die optik
US5084490A (en) * 1990-12-10 1992-01-28 Loctite (Ireland) Limited Styryloxy compounds and polymers thereof
JP3154529B2 (ja) * 1991-10-14 2001-04-09 鐘淵化学工業株式会社 官能基を有するイソブチレン系重合体及びその製造法

Also Published As

Publication number Publication date
JPH06100488A (ja) 1994-04-12
EP0568496A2 (de) 1993-11-03
DE59309253D1 (de) 1999-02-11
EP0568496A3 (US06265458-20010724-C00018.png) 1994-03-16
KR930021588A (ko) 1993-11-22
TW304235B (US06265458-20010724-C00018.png) 1997-05-01
US5324804A (en) 1994-06-28
EP0568496B1 (de) 1998-12-30

Similar Documents

Publication Publication Date Title
KR100282622B1 (ko) 폴리스티렌 기제 광내식막 물질
US5069997A (en) Positive and negative working radiation sensitive mixtures and production of relief patterns
JPH04230645A (ja) オレフィン的に不飽和のオニウム塩
US5369200A (en) Positive photoresist having improved processing properties
US5238781A (en) Photosensitive compositions based on polyphenols and acetals
US5059698A (en) Unsaturated beta-keto-ester acetals
US5274060A (en) Copolymers crosslinkable by acid catalysis
US5403697A (en) Positive radiation-sensitive mixture and recording material produced therefrom
US5863701A (en) Polymers containing protected styrene and unprotected hydroxbenzyl (meth) acrylamides
US4985332A (en) Resist material with carbazole diazonium salt acid generator and process for use
US5665841A (en) Acetal group-containing alkoxy-styrene polymers, method of preparing the same and chemical amplified photoresist composition mainly comprising the same
KR0161965B1 (ko) 방사선-감수성 혼합물 및 이로부터 제조된 방사선-감수성복사물질
US5212047A (en) Resist material and process for use
JPH04212961A (ja) 照射感応性混合物およびこれから製造する照射感応性記録材料
US5206317A (en) Resist material and process for use
US5217843A (en) Positive radiation-sensitive mixture, and radiation-sensitive recording material produced therefrom for high-energy radiation
US5106932A (en) Benzoates containing a substituent having olefinic unsaturation
US5166405A (en) Benzoates containing a substituent having olefinic unsaturation
US5302488A (en) Radiation-sensitive polymers containing naphthoquinone-2-diazide-4-sulfonyl groups and their use in a positive working recording material
JPH05339474A (ja) 感光性組成物
US5807947A (en) Copolymers 4-hydroxystyrene and alkyl substituted-4-hydroxystyrene
EP0365340B1 (en) Copolymers of 4-hydroxystyrene and alkyl substituted-4-hydroxystyrene
US5476751A (en) Phenylacetates and their use in radiation sensitive compositions
JPH05165219A (ja) レジスト組成物
EP0546997B1 (de) Strahlungsempfindliche Polymere

Legal Events

Date Code Title Description
N231 Notification of change of applicant
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee