KR100213993B1 - 위치결정장치 및 이것을 가지는 처리시스템 - Google Patents

위치결정장치 및 이것을 가지는 처리시스템 Download PDF

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Publication number
KR100213993B1
KR100213993B1 KR1019960007557A KR19960007557A KR100213993B1 KR 100213993 B1 KR100213993 B1 KR 100213993B1 KR 1019960007557 A KR1019960007557 A KR 1019960007557A KR 19960007557 A KR19960007557 A KR 19960007557A KR 100213993 B1 KR100213993 B1 KR 100213993B1
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South Korea
Prior art keywords
edge shape
shape signal
signal
mounting table
wafer
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Expired - Lifetime
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KR1019960007557A
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English (en)
Korean (ko)
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KR960035953A (ko
Inventor
히로아키 사에끼
Original Assignee
이노우에 아키라
도요교오 에레구토론 가부시끼가이샤
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Publication of KR960035953A publication Critical patent/KR960035953A/ko
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1019960007557A 1995-03-20 1996-03-20 위치결정장치 및 이것을 가지는 처리시스템 Expired - Lifetime KR100213993B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-87483 1995-03-20
JP8748395 1995-03-20

Publications (2)

Publication Number Publication Date
KR960035953A KR960035953A (ko) 1996-10-28
KR100213993B1 true KR100213993B1 (ko) 1999-08-02

Family

ID=13916200

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960007557A Expired - Lifetime KR100213993B1 (ko) 1995-03-20 1996-03-20 위치결정장치 및 이것을 가지는 처리시스템

Country Status (5)

Country Link
US (1) US5740034A (enExample)
EP (1) EP0734054B1 (enExample)
KR (1) KR100213993B1 (enExample)
DE (1) DE69624858T2 (enExample)
TW (1) TW315504B (enExample)

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JPH0936198A (ja) * 1995-07-19 1997-02-07 Hitachi Ltd 真空処理装置およびそれを用いた半導体製造ライン
US6059507A (en) * 1997-04-21 2000-05-09 Brooks Automation, Inc. Substrate processing apparatus with small batch load lock
JP3936030B2 (ja) * 1997-06-23 2007-06-27 東京エレクトロン株式会社 被処理体の回収方法
US6312525B1 (en) * 1997-07-11 2001-11-06 Applied Materials, Inc. Modular architecture for semiconductor wafer fabrication equipment
US5982132A (en) * 1997-10-09 1999-11-09 Electroglas, Inc. Rotary wafer positioning system and method
US6270306B1 (en) * 1998-01-14 2001-08-07 Applied Materials, Inc. Wafer aligner in center of front end frame of vacuum system
JP3592075B2 (ja) * 1998-04-16 2004-11-24 松下電器産業株式会社 円板形状体の位置決め装置
US6466838B1 (en) * 1998-05-14 2002-10-15 Canon Kabushiki Kaisha Semiconductor exposure apparatus and device manufacturing method using the same
JP4674705B2 (ja) * 1998-10-27 2011-04-20 東京エレクトロン株式会社 搬送システムの搬送位置合わせ方法及び搬送システム
TW418429B (en) 1998-11-09 2001-01-11 Tokyo Electron Ltd Processing apparatus
US6162008A (en) * 1999-06-08 2000-12-19 Varian Semiconductor Equipment Associates, Inc. Wafer orientation sensor
US6662225B1 (en) * 1999-11-16 2003-12-09 Ricoh Company, Ltd. Remote system usage monitoring with flexible packaging of data
US6364592B1 (en) * 1999-12-01 2002-04-02 Brooks Automation, Inc. Small footprint carrier front end loader
US6718227B1 (en) * 1999-12-16 2004-04-06 Texas Instruments Incorporated System and method for determining a position error in a wafer handling device
JP2001308003A (ja) * 2000-02-15 2001-11-02 Nikon Corp 露光方法及び装置、並びにデバイス製造方法
US20010048867A1 (en) * 2000-03-29 2001-12-06 Lebar Technology, Inc. Method and apparatus for processing semiconductor wafers
EP1269521A1 (en) 2000-04-07 2003-01-02 Varian Semiconductor Equipment Associates Inc. WAFER ORIENTATION SENSOR FOR GaAs WAFERS
NL1015397C2 (nl) * 2000-06-07 2001-12-10 Asm Int Inrichting voor het behandelen van een wafer.
US6516244B1 (en) * 2000-08-25 2003-02-04 Wafermasters, Inc. Wafer alignment system and method
US6591161B2 (en) 2001-01-31 2003-07-08 Wafermasters, Inc. Method for determining robot alignment
US6519045B2 (en) * 2001-01-31 2003-02-11 Rudolph Technologies, Inc. Method and apparatus for measuring very thin dielectric film thickness and creating a stable measurement environment
US20040026036A1 (en) * 2001-02-23 2004-02-12 Hitachi Kokusai Electric Inc. Substrate processing apparatus and substrate processing method
WO2002088677A1 (en) * 2001-04-26 2002-11-07 Therma-Wave, Inc. Measurement system cluster
US7089075B2 (en) * 2001-05-04 2006-08-08 Tokyo Electron Limited Systems and methods for metrology recipe and model generation
WO2003043077A1 (fr) * 2001-11-14 2003-05-22 Rorze Corporation Procede et appareil de positionnement de plaquette, systeme de traitement et procede de positionnement de l'axe du siege de plaquette d'un appareil de positionnement de plaquette
US7042568B2 (en) * 2002-05-16 2006-05-09 Asyst Technologies, Inc. Pre-aligner
KR100486690B1 (ko) * 2002-11-29 2005-05-03 삼성전자주식회사 기판 이송 모듈의 오염을 제어할 수 있는 기판 처리 장치및 방법
JP2004179581A (ja) * 2002-11-29 2004-06-24 Nidek Co Ltd 半導体ウエハ検査装置
KR100560666B1 (ko) * 2003-07-07 2006-03-16 삼성전자주식회사 반도체 소자 제조용 금속막 증착 시스템 및 그 운용 방법
JP2005262367A (ja) * 2004-03-18 2005-09-29 Tokyo Electron Ltd 搬送ロボットの搬送ズレ確認方法及び処理装置
US7387484B2 (en) * 2005-12-21 2008-06-17 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer positioning systems and methods thereof
JP2007251090A (ja) 2006-03-20 2007-09-27 Tokyo Electron Ltd 真空処理装置の搬送位置合わせ方法、真空処理装置及びコンピュータ記憶媒体
JP4607848B2 (ja) * 2006-10-27 2011-01-05 東京エレクトロン株式会社 基板処理装置、基板受け渡し位置の調整方法及び記憶媒体
US8016592B2 (en) * 2008-01-01 2011-09-13 Dongguan Anwell Digital Machinery Ltd. Method and system for thermal processing of objects in chambers
DE102009013353B3 (de) * 2009-03-16 2010-10-07 Siemens Aktiengesellschaft Verfahren zur Bestimmung von Rüstungen für konstante Tische von Bestückautomaten
JP5384219B2 (ja) * 2009-06-19 2014-01-08 東京エレクトロン株式会社 検査装置におけるプリアライメント方法及びプリアライメント用プログラム
US9997384B2 (en) * 2011-12-01 2018-06-12 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for transporting wafers between wafer holders and chambers
JP2015119066A (ja) * 2013-12-19 2015-06-25 株式会社安川電機 検出システムおよび検出方法
US10041789B2 (en) * 2016-09-30 2018-08-07 Axcelis Technologies, Inc. Integrated emissivity sensor alignment characterization
JP7199432B2 (ja) 2017-10-25 2023-01-05 アクセリス テクノロジーズ， インコーポレイテッド 半導体製造装置のための、浅角、多波長、マルチレシーバ、調整可能な感度のアライナセンサ
CN110459497B (zh) * 2018-05-08 2022-04-22 北京北方华创微电子装备有限公司 晶圆预定位方法
US10802475B2 (en) * 2018-07-16 2020-10-13 Elite Robotics Positioner for a robotic workcell
US10720354B2 (en) * 2018-08-28 2020-07-21 Axcelis Technologies, Inc. System and method for aligning light-transmitting birefringent workpieces
CN113192859B (zh) * 2020-01-14 2022-10-21 长鑫存储技术有限公司 晶圆加工系统及晶圆加工方法
JP7291663B2 (ja) * 2020-04-24 2023-06-15 Ｔｏｗａ株式会社 位置決め装置、位置決め方法、樹脂成形システムおよび樹脂成形品の製造方法
CN113793826B (zh) * 2021-11-16 2022-03-08 西安奕斯伟材料科技有限公司 硅片方位调准装置及硅片缺陷检测设备

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Also Published As

Publication number Publication date
KR960035953A (ko) 1996-10-28
EP0734054B1 (en) 2002-11-20
DE69624858T2 (de) 2003-07-03
EP0734054A1 (en) 1996-09-25
TW315504B (enExample) 1997-09-11
DE69624858D1 (de) 2003-01-02
US5740034A (en) 1998-04-14

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