KR100187559B1 - 전기적특성의 측정방법 및 그의 측정장치 - Google Patents

전기적특성의 측정방법 및 그의 측정장치 Download PDF

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Publication number
KR100187559B1
KR100187559B1 KR1019920016222A KR920016222A KR100187559B1 KR 100187559 B1 KR100187559 B1 KR 100187559B1 KR 1019920016222 A KR1019920016222 A KR 1019920016222A KR 920016222 A KR920016222 A KR 920016222A KR 100187559 B1 KR100187559 B1 KR 100187559B1
Authority
KR
South Korea
Prior art keywords
semiconductor device
chip
case member
under test
probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019920016222A
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English (en)
Korean (ko)
Other versions
KR930006450A (ko
Inventor
가라사와와타루
Original Assignee
히가시 데쓰로
도오교오에레구토론가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히가시 데쓰로, 도오교오에레구토론가부시끼가이샤 filed Critical 히가시 데쓰로
Publication of KR930006450A publication Critical patent/KR930006450A/ko
Application granted granted Critical
Publication of KR100187559B1 publication Critical patent/KR100187559B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/165—Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1019920016222A 1991-09-05 1992-09-05 전기적특성의 측정방법 및 그의 측정장치 Expired - Fee Related KR100187559B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3254637A JPH0567652A (ja) 1991-09-05 1991-09-05 プローブ装置
JP91-254637 1991-09-05

Publications (2)

Publication Number Publication Date
KR930006450A KR930006450A (ko) 1993-04-21
KR100187559B1 true KR100187559B1 (ko) 1999-06-01

Family

ID=17267789

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920016222A Expired - Fee Related KR100187559B1 (ko) 1991-09-05 1992-09-05 전기적특성의 측정방법 및 그의 측정장치

Country Status (4)

Country Link
US (1) US5374888A (enExample)
JP (1) JPH0567652A (enExample)
KR (1) KR100187559B1 (enExample)
TW (1) TW221518B (enExample)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100291110B1 (ko) * 1993-06-19 2001-06-01 히가시 데쓰로 프로우브장치 및 그것을 사용한 피검사체의 검사방법
US5561386A (en) * 1994-02-23 1996-10-01 Fujitsu Limited Chip tester with improvements in handling efficiency and measurement precision
AU2293095A (en) 1994-04-18 1995-11-10 Micron Technology, Inc. Method and apparatus for automatically positioning electronic die within component packages
US5498970A (en) * 1995-02-06 1996-03-12 Minnesota Mining And Manufacturing Top load socket for ball grid array devices
US5686843A (en) * 1995-06-30 1997-11-11 International Business Machines Corporation Methods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip module
US5667622A (en) * 1995-08-25 1997-09-16 Siemens Aktiengesellschaft In-situ wafer temperature control apparatus for single wafer tools
TW371347B (en) * 1995-12-27 1999-10-01 Advantest Corp Structure of rotary arm and device chuck part of a device handler
JPH09321102A (ja) * 1996-05-31 1997-12-12 Tokyo Electron Ltd 検査装置
JPH10163280A (ja) * 1996-12-02 1998-06-19 Tokyo Electron Ltd 検査方法及び検査装置
US5982166A (en) * 1997-01-27 1999-11-09 Motorola, Inc. Method for measuring a characteristic of a semiconductor wafer using cylindrical control
US6008636A (en) * 1997-09-30 1999-12-28 Motorola, Inc. Test system with robot arm for delivering a device under test
US5982132A (en) * 1997-10-09 1999-11-09 Electroglas, Inc. Rotary wafer positioning system and method
US6001662A (en) * 1997-12-02 1999-12-14 International Business Machines Corporation Method and system for providing a reusable configurable self-test controller for manufactured integrated circuits
US6236902B1 (en) * 1998-02-24 2001-05-22 Data I/O Corporation Apparatus and method for retaining a device for processing
JPH11274252A (ja) * 1998-03-19 1999-10-08 Mitsubishi Electric Corp 半導体装置の検査装置及びその検査方法
CH694831A9 (de) * 1998-04-24 2005-10-14 Int Rectifier Corp Vorrichtung zur Pruefung vereinzelter Halbleiterchips.
JP2000162275A (ja) * 1998-12-01 2000-06-16 Fujitsu Ltd 半導体試験方法及び半導体試験装置
JP2002531845A (ja) * 1998-12-02 2002-09-24 シュランバーガー テクノロジーズ インク． Ｉｃデバイスを反転させる装置および方法
US6137303A (en) * 1998-12-14 2000-10-24 Sony Corporation Integrated testing method and apparatus for semiconductor test operations processing
CN1954202A (zh) * 2004-06-08 2007-04-25 株式会社爱德万测试 图像传感器用试验装置
ITUD20070239A1 (it) * 2007-12-18 2009-06-19 Baccini S P A Dispositivo di collaudo per collaudare piastre per circuiti elettronici e relativo procedimento
JP4829262B2 (ja) * 2008-02-20 2011-12-07 アキム株式会社 搬送装置
KR100979721B1 (ko) * 2008-12-04 2010-09-03 (주)에이피텍 반도체 다이의 검사 및 분류 일체화장치
TWI451100B (zh) * 2009-02-20 2014-09-01 King Yuan Electronics Co Ltd 翻轉測試模組及其測試系統
JP5353818B2 (ja) 2010-05-26 2013-11-27 コベルコ建機株式会社 作業機械
US8836354B2 (en) * 2010-10-21 2014-09-16 Acculogic Corporation Apparatus for thermal testing of a printed circuit board
JP5708369B2 (ja) 2011-08-24 2015-04-30 コベルコ建機株式会社 作業機械
FR2993096B1 (fr) 2012-07-03 2015-03-27 Commissariat Energie Atomique Dispositif et procede de support individuel de composants
FR2987695A1 (fr) * 2012-07-03 2013-09-06 Commissariat Energie Atomique Dispositif et procede de support individuel de composants
KR101586391B1 (ko) * 2014-02-25 2016-01-18 한국영상기술(주) 시료 이물 검사 및 재배치 장치
US9846193B2 (en) * 2014-05-14 2017-12-19 Asm Technology Singapore Pte Ltd Semiconductor package testing apparatus
JP6861704B2 (ja) * 2015-06-24 2021-04-21 インディケル・アクシェセルスカプＩｎｄｉｋｅｌ Ａｓ 回転するプローブ面を備えるケルビンプローブシステム
JP6596374B2 (ja) * 2016-03-28 2019-10-23 東京エレクトロン株式会社 基板検査装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4295776A (en) * 1978-09-25 1981-10-20 Alan Payne Portable inverter for transferring bulk goods between pallets
US4571542A (en) * 1982-06-30 1986-02-18 Japan Synthetic Rubber Co., Ltd. Method and unit for inspecting printed wiring boards
US4654955A (en) * 1982-09-07 1987-04-07 The Valeron Corporation Tool changer mechanism for machining centers

Also Published As

Publication number Publication date
US5374888A (en) 1994-12-20
TW221518B (enExample) 1994-03-01
JPH0567652A (ja) 1993-03-19
KR930006450A (ko) 1993-04-21

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