TW221518B - - Google Patents

Info

Publication number
TW221518B
TW221518B TW081107830A TW81107830A TW221518B TW 221518 B TW221518 B TW 221518B TW 081107830 A TW081107830 A TW 081107830A TW 81107830 A TW81107830 A TW 81107830A TW 221518 B TW221518 B TW 221518B
Authority
TW
Taiwan
Application number
TW081107830A
Original Assignee
Tokyo Electron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Co Ltd filed Critical Tokyo Electron Co Ltd
Application granted granted Critical
Publication of TW221518B publication Critical patent/TW221518B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/165—Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
TW081107830A 1991-09-05 1992-10-01 TW221518B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3254637A JPH0567652A (ja) 1991-09-05 1991-09-05 プローブ装置

Publications (1)

Publication Number Publication Date
TW221518B true TW221518B (zh) 1994-03-01

Family

ID=17267789

Family Applications (1)

Application Number Title Priority Date Filing Date
TW081107830A TW221518B (zh) 1991-09-05 1992-10-01

Country Status (4)

Country Link
US (1) US5374888A (zh)
JP (1) JPH0567652A (zh)
KR (1) KR100187559B1 (zh)
TW (1) TW221518B (zh)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100291110B1 (ko) * 1993-06-19 2001-06-01 히가시 데쓰로 프로우브장치 및 그것을 사용한 피검사체의 검사방법
US5561386A (en) * 1994-02-23 1996-10-01 Fujitsu Limited Chip tester with improvements in handling efficiency and measurement precision
JP2804178B2 (ja) * 1994-04-18 1998-09-24 マイクロン、テクノロジー、インコーポレーテッド 電子ダイを部品パッケージ内に自動的に位置決めするための方法及び装置
US5498970A (en) * 1995-02-06 1996-03-12 Minnesota Mining And Manufacturing Top load socket for ball grid array devices
US5686843A (en) * 1995-06-30 1997-11-11 International Business Machines Corporation Methods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip module
US5667622A (en) * 1995-08-25 1997-09-16 Siemens Aktiengesellschaft In-situ wafer temperature control apparatus for single wafer tools
TW371347B (en) * 1995-12-27 1999-10-01 Advantest Corp Structure of rotary arm and device chuck part of a device handler
JPH09321102A (ja) * 1996-05-31 1997-12-12 Tokyo Electron Ltd 検査装置
JPH10163280A (ja) * 1996-12-02 1998-06-19 Tokyo Electron Ltd 検査方法及び検査装置
US5982166A (en) * 1997-01-27 1999-11-09 Motorola, Inc. Method for measuring a characteristic of a semiconductor wafer using cylindrical control
US6008636A (en) * 1997-09-30 1999-12-28 Motorola, Inc. Test system with robot arm for delivering a device under test
US5982132A (en) * 1997-10-09 1999-11-09 Electroglas, Inc. Rotary wafer positioning system and method
US6001662A (en) * 1997-12-02 1999-12-14 International Business Machines Corporation Method and system for providing a reusable configurable self-test controller for manufactured integrated circuits
US6236902B1 (en) * 1998-02-24 2001-05-22 Data I/O Corporation Apparatus and method for retaining a device for processing
JPH11274252A (ja) * 1998-03-19 1999-10-08 Mitsubishi Electric Corp 半導体装置の検査装置及びその検査方法
CH694831A9 (de) * 1998-04-24 2005-10-14 Int Rectifier Corp Vorrichtung zur Pruefung vereinzelter Halbleiterchips.
JP2000162275A (ja) * 1998-12-01 2000-06-16 Fujitsu Ltd 半導体試験方法及び半導体試験装置
DE19982805T1 (de) * 1998-12-02 2003-01-30 Delta Design Inc Vorrichtung und Verfahren zum Wenden eines IC-Bauelements
US6137303A (en) * 1998-12-14 2000-10-24 Sony Corporation Integrated testing method and apparatus for semiconductor test operations processing
WO2005121739A1 (ja) * 2004-06-08 2005-12-22 Advantest Corporation イメージセンサ用試験装置
ITUD20070239A1 (it) * 2007-12-18 2009-06-19 Baccini S P A Dispositivo di collaudo per collaudare piastre per circuiti elettronici e relativo procedimento
JP4829262B2 (ja) * 2008-02-20 2011-12-07 アキム株式会社 搬送装置
KR100979721B1 (ko) * 2008-12-04 2010-09-03 (주)에이피텍 반도체 다이의 검사 및 분류 일체화장치
TWI451100B (zh) * 2009-02-20 2014-09-01 King Yuan Electronics Co Ltd 翻轉測試模組及其測試系統
JP5353818B2 (ja) 2010-05-26 2013-11-27 コベルコ建機株式会社 作業機械
US8836354B2 (en) * 2010-10-21 2014-09-16 Acculogic Corporation Apparatus for thermal testing of a printed circuit board
JP5708369B2 (ja) 2011-08-24 2015-04-30 コベルコ建機株式会社 作業機械
FR2987695A1 (fr) * 2012-07-03 2013-09-06 Commissariat Energie Atomique Dispositif et procede de support individuel de composants
FR2993096B1 (fr) 2012-07-03 2015-03-27 Commissariat Energie Atomique Dispositif et procede de support individuel de composants
KR101586391B1 (ko) * 2014-02-25 2016-01-18 한국영상기술(주) 시료 이물 검사 및 재배치 장치
US9846193B2 (en) * 2014-05-14 2017-12-19 Asm Technology Singapore Pte Ltd Semiconductor package testing apparatus
US10620159B2 (en) * 2015-06-24 2020-04-14 Indikel As Field Kelvin probe
JP6596374B2 (ja) * 2016-03-28 2019-10-23 東京エレクトロン株式会社 基板検査装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4295776A (en) * 1978-09-25 1981-10-20 Alan Payne Portable inverter for transferring bulk goods between pallets
US4571542A (en) * 1982-06-30 1986-02-18 Japan Synthetic Rubber Co., Ltd. Method and unit for inspecting printed wiring boards
WO1984000915A1 (en) * 1982-09-07 1984-03-15 Valeron Corp Tool changer mechanism for machining centers

Also Published As

Publication number Publication date
KR100187559B1 (ko) 1999-06-01
KR930006450A (ko) 1993-04-21
US5374888A (en) 1994-12-20
JPH0567652A (ja) 1993-03-19

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