KR0163366B1 - 펠레트 본딩장치 - Google Patents

펠레트 본딩장치 Download PDF

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Publication number
KR0163366B1
KR0163366B1 KR1019940026743A KR19940026743A KR0163366B1 KR 0163366 B1 KR0163366 B1 KR 0163366B1 KR 1019940026743 A KR1019940026743 A KR 1019940026743A KR 19940026743 A KR19940026743 A KR 19940026743A KR 0163366 B1 KR0163366 B1 KR 0163366B1
Authority
KR
South Korea
Prior art keywords
pellet
degrees
wafer
unit
pellets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019940026743A
Other languages
English (en)
Korean (ko)
Other versions
KR950015676A (ko
Inventor
마코토 아리에
야스시 다케다
가쓰요시 가와베
Original Assignee
오쿠라 고이치
도시바 세이키 가부시키 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4333694A external-priority patent/JP3248647B2/ja
Application filed by 오쿠라 고이치, 도시바 세이키 가부시키 가이샤 filed Critical 오쿠라 고이치
Publication of KR950015676A publication Critical patent/KR950015676A/ko
Application granted granted Critical
Publication of KR0163366B1 publication Critical patent/KR0163366B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1019940026743A 1993-11-26 1994-10-19 펠레트 본딩장치 Expired - Fee Related KR0163366B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP93-319261 1993-11-26
JP31926193 1993-11-26
JP4333694A JP3248647B2 (ja) 1994-02-18 1994-02-18 ウエハシート引伸し装置
JP94-43336 1994-02-18

Publications (2)

Publication Number Publication Date
KR950015676A KR950015676A (ko) 1995-06-17
KR0163366B1 true KR0163366B1 (ko) 1999-02-01

Family

ID=26383094

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940026743A Expired - Fee Related KR0163366B1 (ko) 1993-11-26 1994-10-19 펠레트 본딩장치

Country Status (5)

Country Link
US (1) US5516026A (enExample)
KR (1) KR0163366B1 (enExample)
GB (1) GB2284302B (enExample)
HK (1) HK1005215A1 (enExample)
TW (1) TW253073B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2293095A (en) 1994-04-18 1995-11-10 Micron Technology, Inc. Method and apparatus for automatically positioning electronic die within component packages
KR0175267B1 (ko) * 1995-09-30 1999-04-01 김광호 회전운동을 하는 픽업 툴을 구비하는 다이 본딩 장치
KR100199293B1 (ko) * 1996-11-08 1999-06-15 윤종용 반도체 패키지 제조 장치
US5939777A (en) * 1996-12-06 1999-08-17 Texas Instruments Incorporated High aspect ratio integrated circuit chip and method for producing the same
DE59813989D1 (de) * 1997-12-07 2007-06-14 Oerlikon Assembly Equipment Ag Halbleiter-Montageeinrichtung mit einem hin und her geführten Chipgreifer
JP3838797B2 (ja) * 1998-10-27 2006-10-25 松下電器産業株式会社 部品の貼り着け方法とその装置
US6730998B1 (en) * 2000-02-10 2004-05-04 Micron Technology, Inc. Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same
US6426552B1 (en) * 2000-05-19 2002-07-30 Micron Technology, Inc. Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials
US6432752B1 (en) * 2000-08-17 2002-08-13 Micron Technology, Inc. Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages
SG97164A1 (en) 2000-09-21 2003-07-18 Micron Technology Inc Individual selective rework of defective bga solder balls
US20040159344A1 (en) * 2002-11-11 2004-08-19 Hiatt William M. Cleaning components for use with programmable material consolidation apparatus and systems
US7216009B2 (en) * 2004-06-14 2007-05-08 Micron Technology, Inc. Machine vision systems for use with programmable material consolidation system and associated methods and structures
CN100479123C (zh) * 2004-09-30 2009-04-15 广东工业大学 平面双滑块并联机构二自由度粘片机焊头结构及动作过程
GB2473600B (en) 2009-08-25 2013-09-25 Pillarhouse Int Ltd Quick-loading soldering apparatus
TWI635558B (zh) * 2017-10-02 2018-09-11 王傳璋 Temporary expansion fixture after wafer cutting
JP7465199B2 (ja) * 2019-12-11 2024-04-10 芝浦メカトロニクス株式会社 実装装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51131274A (en) * 1975-05-10 1976-11-15 Fujitsu Ltd Tip bonding method
JPH0468553A (ja) * 1990-07-10 1992-03-04 Toshiba Seiki Kk ウエハエキスパンド装置
JP2635889B2 (ja) * 1992-06-24 1997-07-30 株式会社東芝 ダイボンディング装置

Also Published As

Publication number Publication date
GB2284302A (en) 1995-05-31
KR950015676A (ko) 1995-06-17
US5516026A (en) 1996-05-14
TW253073B (enExample) 1995-08-01
GB9423244D0 (en) 1995-01-04
HK1005215A1 (en) 1998-12-24
GB2284302B (en) 1997-11-26

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