TW253073B - - Google Patents
Info
- Publication number
- TW253073B TW253073B TW083110288A TW83110288A TW253073B TW 253073 B TW253073 B TW 253073B TW 083110288 A TW083110288 A TW 083110288A TW 83110288 A TW83110288 A TW 83110288A TW 253073 B TW253073 B TW 253073B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31926193 | 1993-11-26 | ||
JP4333694A JP3248647B2 (ja) | 1994-02-18 | 1994-02-18 | ウエハシート引伸し装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW253073B true TW253073B (zh) | 1995-08-01 |
Family
ID=26383094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW083110288A TW253073B (zh) | 1993-11-26 | 1994-11-07 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5516026A (zh) |
KR (1) | KR0163366B1 (zh) |
GB (1) | GB2284302B (zh) |
HK (1) | HK1005215A1 (zh) |
TW (1) | TW253073B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI635558B (zh) * | 2017-10-02 | 2018-09-11 | 王傳璋 | Temporary expansion fixture after wafer cutting |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69529501T2 (de) * | 1994-04-18 | 2003-12-11 | Micron Technology Inc | Verfahren und vorrichtung zum automatischen positionieren elektronischer würfel in bauteilverpackungen |
KR0175267B1 (ko) * | 1995-09-30 | 1999-04-01 | 김광호 | 회전운동을 하는 픽업 툴을 구비하는 다이 본딩 장치 |
KR100199293B1 (ko) * | 1996-11-08 | 1999-06-15 | 윤종용 | 반도체 패키지 제조 장치 |
KR19980063858A (ko) * | 1996-12-06 | 1998-10-07 | 윌리엄비.켐플러 | 높은 종횡비를 갖는 집적 회로 칩 및 그 제조 방법 |
DE59813989D1 (de) * | 1997-12-07 | 2007-06-14 | Oerlikon Assembly Equipment Ag | Halbleiter-Montageeinrichtung mit einem hin und her geführten Chipgreifer |
JP3838797B2 (ja) * | 1998-10-27 | 2006-10-25 | 松下電器産業株式会社 | 部品の貼り着け方法とその装置 |
US6730998B1 (en) * | 2000-02-10 | 2004-05-04 | Micron Technology, Inc. | Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same |
US6426552B1 (en) | 2000-05-19 | 2002-07-30 | Micron Technology, Inc. | Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials |
US6432752B1 (en) * | 2000-08-17 | 2002-08-13 | Micron Technology, Inc. | Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages |
SG97164A1 (en) | 2000-09-21 | 2003-07-18 | Micron Technology Inc | Individual selective rework of defective bga solder balls |
US7239933B2 (en) * | 2002-11-11 | 2007-07-03 | Micron Technology, Inc. | Substrate supports for use with programmable material consolidation apparatus and systems |
US7216009B2 (en) * | 2004-06-14 | 2007-05-08 | Micron Technology, Inc. | Machine vision systems for use with programmable material consolidation system and associated methods and structures |
CN100479123C (zh) * | 2004-09-30 | 2009-04-15 | 广东工业大学 | 平面双滑块并联机构二自由度粘片机焊头结构及动作过程 |
GB2473600B (en) | 2009-08-25 | 2013-09-25 | Pillarhouse Int Ltd | Quick-loading soldering apparatus |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51131274A (en) * | 1975-05-10 | 1976-11-15 | Fujitsu Ltd | Tip bonding method |
JPH0468553A (ja) * | 1990-07-10 | 1992-03-04 | Toshiba Seiki Kk | ウエハエキスパンド装置 |
JP2635889B2 (ja) * | 1992-06-24 | 1997-07-30 | 株式会社東芝 | ダイボンディング装置 |
-
1994
- 1994-10-19 KR KR1019940026743A patent/KR0163366B1/ko not_active IP Right Cessation
- 1994-10-20 US US08/326,492 patent/US5516026A/en not_active Expired - Lifetime
- 1994-11-07 TW TW083110288A patent/TW253073B/zh not_active IP Right Cessation
- 1994-11-17 GB GB9423244A patent/GB2284302B/en not_active Expired - Fee Related
-
1998
- 1998-05-15 HK HK98104236A patent/HK1005215A1/xx not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI635558B (zh) * | 2017-10-02 | 2018-09-11 | 王傳璋 | Temporary expansion fixture after wafer cutting |
Also Published As
Publication number | Publication date |
---|---|
GB2284302B (en) | 1997-11-26 |
GB2284302A (en) | 1995-05-31 |
GB9423244D0 (en) | 1995-01-04 |
US5516026A (en) | 1996-05-14 |
KR0163366B1 (ko) | 1999-02-01 |
KR950015676A (ko) | 1995-06-17 |
HK1005215A1 (en) | 1998-12-24 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |