KR0128679B1 - 비아 충진 조성물 - Google Patents

비아 충진 조성물

Info

Publication number
KR0128679B1
KR0128679B1 KR1019930004145A KR930004145A KR0128679B1 KR 0128679 B1 KR0128679 B1 KR 0128679B1 KR 1019930004145 A KR1019930004145 A KR 1019930004145A KR 930004145 A KR930004145 A KR 930004145A KR 0128679 B1 KR0128679 B1 KR 0128679B1
Authority
KR
South Korea
Prior art keywords
fired
inorganic binder
layer
paste
dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019930004145A
Other languages
English (en)
Korean (ko)
Other versions
KR940010132A (ko
Inventor
호마달리 자콥
하비 몬스 아더
Original Assignee
미리암 디. 메코너헤이
이. 아이. 듀폰 디 네모아 앤드 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미리암 디. 메코너헤이, 이. 아이. 듀폰 디 네모아 앤드 캄파니 filed Critical 미리암 디. 메코너헤이
Publication of KR940010132A publication Critical patent/KR940010132A/ko
Application granted granted Critical
Publication of KR0128679B1 publication Critical patent/KR0128679B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H10W70/666—Organic materials or pastes

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
KR1019930004145A 1992-10-05 1993-03-18 비아 충진 조성물 Expired - Fee Related KR0128679B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US95627392A 1992-10-05 1992-10-05
US7/956,273 1992-10-05
US07/956,273 1992-10-05

Publications (2)

Publication Number Publication Date
KR940010132A KR940010132A (ko) 1994-05-24
KR0128679B1 true KR0128679B1 (ko) 1998-04-06

Family

ID=25498017

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930004145A Expired - Fee Related KR0128679B1 (ko) 1992-10-05 1993-03-18 비아 충진 조성물

Country Status (6)

Country Link
EP (1) EP0591604B1 (https=)
JP (1) JP2724089B2 (https=)
KR (1) KR0128679B1 (https=)
CN (1) CN1085343A (https=)
DE (1) DE69311870T2 (https=)
TW (1) TW238393B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2223166A1 (en) * 1995-06-06 1996-12-12 Paul L. Braun Method of producing micro-electrical conduits
US6146743A (en) 1997-02-21 2000-11-14 Medtronic, Inc. Barrier metallization in ceramic substrate for implantable medical devices
US5855995A (en) * 1997-02-21 1999-01-05 Medtronic, Inc. Ceramic substrate for implantable medical devices
US7261841B2 (en) * 2003-11-19 2007-08-28 E. I. Du Pont De Nemours And Company Thick film conductor case compositions for LTCC tape
US8617688B2 (en) * 2005-05-30 2013-12-31 Sumitomo Electric Industries, Ltd. Conductive paste and multilayer printed wiring board using the same
CN104347533B (zh) * 2013-08-01 2020-05-26 日月光半导体制造股份有限公司 半导体封装件及其制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2280957A1 (fr) * 1974-08-01 1976-02-27 Ibm Composition conductrice pour metallisation, support ceramique revetu de cette composition et procede de formation
JPS6025290A (ja) * 1983-07-21 1985-02-08 松下電器産業株式会社 混成集積回路基板の製造方法
US4514321A (en) * 1983-08-25 1985-04-30 E. I. Du Pont De Nemours And Company Thick film conductor compositions
JPS645095A (en) * 1987-06-26 1989-01-10 Tdk Corp Formation of conductive pattern
US4847003A (en) * 1988-04-04 1989-07-11 Delco Electronics Corporation Electrical conductors
JPH03281783A (ja) * 1990-03-29 1991-12-12 Vacuum Metallurgical Co Ltd 金属薄膜の形成方法

Also Published As

Publication number Publication date
KR940010132A (ko) 1994-05-24
DE69311870D1 (de) 1997-08-07
JPH06115947A (ja) 1994-04-26
JP2724089B2 (ja) 1998-03-09
EP0591604A3 (en) 1995-08-30
CN1085343A (zh) 1994-04-13
TW238393B (https=) 1995-01-11
DE69311870T2 (de) 1997-11-27
EP0591604B1 (en) 1997-07-02
EP0591604A2 (en) 1994-04-13

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