FR2280957A1 - Composition conductrice pour metallisation, support ceramique revetu de cette composition et procede de formation - Google Patents
Composition conductrice pour metallisation, support ceramique revetu de cette composition et procede de formationInfo
- Publication number
- FR2280957A1 FR2280957A1 FR7517194A FR7517194A FR2280957A1 FR 2280957 A1 FR2280957 A1 FR 2280957A1 FR 7517194 A FR7517194 A FR 7517194A FR 7517194 A FR7517194 A FR 7517194A FR 2280957 A1 FR2280957 A1 FR 2280957A1
- Authority
- FR
- France
- Prior art keywords
- electrically conducting
- ruthenium
- molybdenum
- layer ceramic
- ceramic modules
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/88—Metals
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
- C04B41/5133—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal with a composition mainly composed of one or more of the refractory metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Dispersion Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Inorganic Insulating Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US49394974A | 1974-08-01 | 1974-08-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2280957A1 true FR2280957A1 (fr) | 1976-02-27 |
FR2280957B1 FR2280957B1 (fr) | 1977-07-08 |
Family
ID=23962382
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7517194A Granted FR2280957A1 (fr) | 1974-08-01 | 1975-05-27 | Composition conductrice pour metallisation, support ceramique revetu de cette composition et procede de formation |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS5135063A (fr) |
DE (1) | DE2531199A1 (fr) |
FR (1) | FR2280957A1 (fr) |
IT (1) | IT1039149B (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2468279A1 (fr) * | 1979-10-19 | 1981-04-30 | Dujardin Editions | Procede de fabrication de plaques comportant au moins un circuit imprime |
EP0061010A1 (fr) * | 1981-03-20 | 1982-09-29 | International Business Machines Corporation | Procédé de formation de couches de métaux réfractaires sur des substrats céramiques |
EP0591604A2 (fr) * | 1992-10-05 | 1994-04-13 | E.I. Du Pont De Nemours And Company | Compositions pour le remplissage des trous d'interconnexion |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57184296A (en) * | 1981-05-09 | 1982-11-12 | Hitachi Ltd | Ceramic circuit board |
JPS5944960U (ja) * | 1982-09-14 | 1984-03-24 | 伊藤 知子 | 絨毯の清掃用毛取器 |
JPS60257195A (ja) * | 1984-06-01 | 1985-12-18 | 鳴海製陶株式会社 | ハイブリツド基板及びその製造方法 |
JPH0828577B2 (ja) * | 1989-08-05 | 1996-03-21 | 日本電装株式会社 | セラミック積層基板の製造方法 |
JPH04241165A (ja) * | 1991-01-07 | 1992-08-28 | Rakutou Kasei Kogyo Kk | 染色天然繊維材料にストーン・ウオッシュ様外観を付与する処理方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3386159A (en) * | 1964-05-04 | 1968-06-04 | Philips Corp | Method of forming a refractory metal-to-ceramic seal |
-
1975
- 1975-05-27 FR FR7517194A patent/FR2280957A1/fr active Granted
- 1975-06-20 IT IT2457875A patent/IT1039149B/it active
- 1975-07-12 DE DE19752531199 patent/DE2531199A1/de active Pending
- 1975-07-15 JP JP8592375A patent/JPS5135063A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3386159A (en) * | 1964-05-04 | 1968-06-04 | Philips Corp | Method of forming a refractory metal-to-ceramic seal |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2468279A1 (fr) * | 1979-10-19 | 1981-04-30 | Dujardin Editions | Procede de fabrication de plaques comportant au moins un circuit imprime |
EP0061010A1 (fr) * | 1981-03-20 | 1982-09-29 | International Business Machines Corporation | Procédé de formation de couches de métaux réfractaires sur des substrats céramiques |
EP0591604A2 (fr) * | 1992-10-05 | 1994-04-13 | E.I. Du Pont De Nemours And Company | Compositions pour le remplissage des trous d'interconnexion |
EP0591604A3 (en) * | 1992-10-05 | 1995-08-30 | Du Pont | Via fill compositions |
Also Published As
Publication number | Publication date |
---|---|
IT1039149B (it) | 1979-12-10 |
FR2280957B1 (fr) | 1977-07-08 |
JPS5135063A (ja) | 1976-03-25 |
DE2531199A1 (de) | 1976-02-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |