JPWO2025041384A5 - - Google Patents

Info

Publication number
JPWO2025041384A5
JPWO2025041384A5 JP2025541301A JP2025541301A JPWO2025041384A5 JP WO2025041384 A5 JPWO2025041384 A5 JP WO2025041384A5 JP 2025541301 A JP2025541301 A JP 2025541301A JP 2025541301 A JP2025541301 A JP 2025541301A JP WO2025041384 A5 JPWO2025041384 A5 JP WO2025041384A5
Authority
JP
Japan
Prior art keywords
electrode
element body
weight
ceramic substrate
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025541301A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025041384A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/017566 external-priority patent/WO2025041384A1/ja
Publication of JPWO2025041384A1 publication Critical patent/JPWO2025041384A1/ja
Publication of JPWO2025041384A5 publication Critical patent/JPWO2025041384A5/ja
Pending legal-status Critical Current

Links

JP2025541301A 2023-08-23 2024-05-13 Pending JPWO2025041384A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023135597 2023-08-23
PCT/JP2024/017566 WO2025041384A1 (ja) 2023-08-23 2024-05-13 セラミック基板及び電子部品

Publications (2)

Publication Number Publication Date
JPWO2025041384A1 JPWO2025041384A1 (https=) 2025-02-27
JPWO2025041384A5 true JPWO2025041384A5 (https=) 2026-02-04

Family

ID=94731848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025541301A Pending JPWO2025041384A1 (https=) 2023-08-23 2024-05-13

Country Status (4)

Country Link
US (1) US20260089838A1 (https=)
JP (1) JPWO2025041384A1 (https=)
CN (1) CN121729988A (https=)
WO (1) WO2025041384A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08172273A (ja) * 1994-12-16 1996-07-02 Hitachi Ltd セラミック配線基板及びその実装構造体
JP5977180B2 (ja) * 2012-03-05 2016-08-24 京セラ株式会社 配線基板
JP6026898B2 (ja) * 2013-01-25 2016-11-16 京セラ株式会社 セラミック配線基板
JP6753423B2 (ja) * 2018-01-11 2020-09-09 株式会社村田製作所 積層コイル部品
JP7535005B2 (ja) * 2021-03-31 2024-08-15 Tdk株式会社 積層電子部品

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