JPWO2025041384A1 - - Google Patents

Info

Publication number
JPWO2025041384A1
JPWO2025041384A1 JP2025541301A JP2025541301A JPWO2025041384A1 JP WO2025041384 A1 JPWO2025041384 A1 JP WO2025041384A1 JP 2025541301 A JP2025541301 A JP 2025541301A JP 2025541301 A JP2025541301 A JP 2025541301A JP WO2025041384 A1 JPWO2025041384 A1 JP WO2025041384A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025541301A
Other languages
Japanese (ja)
Other versions
JPWO2025041384A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2025041384A1 publication Critical patent/JPWO2025041384A1/ja
Publication of JPWO2025041384A5 publication Critical patent/JPWO2025041384A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2025541301A 2023-08-23 2024-05-13 Pending JPWO2025041384A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023135597 2023-08-23
PCT/JP2024/017566 WO2025041384A1 (ja) 2023-08-23 2024-05-13 セラミック基板及び電子部品

Publications (2)

Publication Number Publication Date
JPWO2025041384A1 true JPWO2025041384A1 (https=) 2025-02-27
JPWO2025041384A5 JPWO2025041384A5 (https=) 2026-02-04

Family

ID=94731848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025541301A Pending JPWO2025041384A1 (https=) 2023-08-23 2024-05-13

Country Status (4)

Country Link
US (1) US20260089838A1 (https=)
JP (1) JPWO2025041384A1 (https=)
CN (1) CN121729988A (https=)
WO (1) WO2025041384A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08172273A (ja) * 1994-12-16 1996-07-02 Hitachi Ltd セラミック配線基板及びその実装構造体
JP5977180B2 (ja) * 2012-03-05 2016-08-24 京セラ株式会社 配線基板
JP6026898B2 (ja) * 2013-01-25 2016-11-16 京セラ株式会社 セラミック配線基板
JP6753423B2 (ja) * 2018-01-11 2020-09-09 株式会社村田製作所 積層コイル部品
JP7535005B2 (ja) * 2021-03-31 2024-08-15 Tdk株式会社 積層電子部品

Also Published As

Publication number Publication date
US20260089838A1 (en) 2026-03-26
CN121729988A (zh) 2026-03-24
WO2025041384A1 (ja) 2025-02-27

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20251104

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20251104