CN121729988A - 陶瓷基板和电子部件 - Google Patents

陶瓷基板和电子部件

Info

Publication number
CN121729988A
CN121729988A CN202480052810.3A CN202480052810A CN121729988A CN 121729988 A CN121729988 A CN 121729988A CN 202480052810 A CN202480052810 A CN 202480052810A CN 121729988 A CN121729988 A CN 121729988A
Authority
CN
China
Prior art keywords
electrode
insulating layer
content
green body
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480052810.3A
Other languages
English (en)
Chinese (zh)
Inventor
矢吹裕昌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN121729988A publication Critical patent/CN121729988A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
CN202480052810.3A 2023-08-23 2024-05-13 陶瓷基板和电子部件 Pending CN121729988A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023135597 2023-08-23
JP2023-135597 2023-08-23
PCT/JP2024/017566 WO2025041384A1 (ja) 2023-08-23 2024-05-13 セラミック基板及び電子部品

Publications (1)

Publication Number Publication Date
CN121729988A true CN121729988A (zh) 2026-03-24

Family

ID=94731848

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480052810.3A Pending CN121729988A (zh) 2023-08-23 2024-05-13 陶瓷基板和电子部件

Country Status (4)

Country Link
US (1) US20260089838A1 (https=)
JP (1) JPWO2025041384A1 (https=)
CN (1) CN121729988A (https=)
WO (1) WO2025041384A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08172273A (ja) * 1994-12-16 1996-07-02 Hitachi Ltd セラミック配線基板及びその実装構造体
JP5977180B2 (ja) * 2012-03-05 2016-08-24 京セラ株式会社 配線基板
JP6026898B2 (ja) * 2013-01-25 2016-11-16 京セラ株式会社 セラミック配線基板
JP6753423B2 (ja) * 2018-01-11 2020-09-09 株式会社村田製作所 積層コイル部品
JP7535005B2 (ja) * 2021-03-31 2024-08-15 Tdk株式会社 積層電子部品

Also Published As

Publication number Publication date
US20260089838A1 (en) 2026-03-26
JPWO2025041384A1 (https=) 2025-02-27
WO2025041384A1 (ja) 2025-02-27

Similar Documents

Publication Publication Date Title
US7911295B2 (en) Common mode noise filter
JP5056528B2 (ja) 絶縁体セラミック組成物およびそれを用いた絶縁体セラミック
JP4994052B2 (ja) 基板およびこれを用いた回路基板
JP5104761B2 (ja) セラミック基板およびその製造方法
JP4883224B2 (ja) 低温焼結セラミック材料およびセラミック基板
CN111161938B (zh) 电子部件以及电子部件的制造方法
EP1074524B1 (en) Glass-ceramic composition, circuit substrate using the same and manufacture method thereof
EP2234128A1 (en) Ceramic Electronic Component
JP2010080930A (ja) ガラスセラミック基板およびコイル内蔵ガラスセラミック配線基板ならびにガラスセラミック基板の製造方法
CN102248723B (zh) 陶瓷电子部件和制造陶瓷电子部件的方法
JP2005322743A (ja) 積層コイル部品の製造方法
CN107921744A (zh) 层叠体和电子部件
CN111096090A (zh) 陶瓷基板的制造方法、陶瓷基板以及模块
JP3897472B2 (ja) 受動部品内蔵多層配線基板およびその製造方法
CN121729988A (zh) 陶瓷基板和电子部件
JP2001244140A (ja) セラミック積層体およびその製造方法、ならびに電子部品、電子装置
JP2003277852A (ja) 銅メタライズ組成物およびセラミック配線基板
JP4279869B2 (ja) 多層セラミックス基板
KR20020008786A (ko) 다층 기판 및 그의 제조방법
JPH11284296A (ja) 配線基板
JP4028810B2 (ja) 多層配線基板の製造方法
JP5591055B2 (ja) ガラスセラミック基板およびコイル内蔵ガラスセラミック配線基板
JP2005217170A (ja) 複合積層セラミック電子部品
JP2008186909A (ja) セラミック多層基板
JP4814703B2 (ja) 回路基板

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination