JPWO2025023220A5 - - Google Patents

Info

Publication number
JPWO2025023220A5
JPWO2025023220A5 JP2025535821A JP2025535821A JPWO2025023220A5 JP WO2025023220 A5 JPWO2025023220 A5 JP WO2025023220A5 JP 2025535821 A JP2025535821 A JP 2025535821A JP 2025535821 A JP2025535821 A JP 2025535821A JP WO2025023220 A5 JPWO2025023220 A5 JP WO2025023220A5
Authority
JP
Japan
Prior art keywords
transfer member
heat transfer
protective film
connection portion
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025535821A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025023220A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/026178 external-priority patent/WO2025023220A1/ja
Publication of JPWO2025023220A1 publication Critical patent/JPWO2025023220A1/ja
Publication of JPWO2025023220A5 publication Critical patent/JPWO2025023220A5/ja
Pending legal-status Critical Current

Links

JP2025535821A 2023-07-25 2024-07-22 Pending JPWO2025023220A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023120383 2023-07-25
PCT/JP2024/026178 WO2025023220A1 (ja) 2023-07-25 2024-07-22 伝熱部材及び電子装置

Publications (2)

Publication Number Publication Date
JPWO2025023220A1 JPWO2025023220A1 (https=) 2025-01-30
JPWO2025023220A5 true JPWO2025023220A5 (https=) 2026-04-21

Family

ID=94375292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025535821A Pending JPWO2025023220A1 (https=) 2023-07-25 2024-07-22

Country Status (3)

Country Link
JP (1) JPWO2025023220A1 (https=)
TW (1) TW202527296A (https=)
WO (1) WO2025023220A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0700917D0 (en) * 2007-01-17 2007-02-28 Queen Mary & Westfield College Structures with improved properties
JP2012141093A (ja) * 2010-12-28 2012-07-26 Orbital Engineering Inc 中熱伝導デバイス
JP5954008B2 (ja) * 2012-07-16 2016-07-20 株式会社日本自動車部品総合研究所 熱拡散装置
WO2016098890A1 (ja) * 2014-12-18 2016-06-23 株式会社カネカ グラファイト積層体、グラファイト積層体の製造方法、熱輸送用構造物およびロッド状の熱輸送体
CN109863117B (zh) * 2016-10-19 2023-04-18 创业发展联盟技术有限公司 石墨/石墨烯复合材料、集热体、传热体、散热体及散热系统

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