JPWO2025023220A1 - - Google Patents
Info
- Publication number
- JPWO2025023220A1 JPWO2025023220A1 JP2025535821A JP2025535821A JPWO2025023220A1 JP WO2025023220 A1 JPWO2025023220 A1 JP WO2025023220A1 JP 2025535821 A JP2025535821 A JP 2025535821A JP 2025535821 A JP2025535821 A JP 2025535821A JP WO2025023220 A1 JPWO2025023220 A1 JP WO2025023220A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023120383 | 2023-07-25 | ||
| PCT/JP2024/026178 WO2025023220A1 (ja) | 2023-07-25 | 2024-07-22 | 伝熱部材及び電子装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025023220A1 true JPWO2025023220A1 (https=) | 2025-01-30 |
| JPWO2025023220A5 JPWO2025023220A5 (https=) | 2026-04-21 |
Family
ID=94375292
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025535821A Pending JPWO2025023220A1 (https=) | 2023-07-25 | 2024-07-22 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2025023220A1 (https=) |
| TW (1) | TW202527296A (https=) |
| WO (1) | WO2025023220A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0700917D0 (en) * | 2007-01-17 | 2007-02-28 | Queen Mary & Westfield College | Structures with improved properties |
| JP2012141093A (ja) * | 2010-12-28 | 2012-07-26 | Orbital Engineering Inc | 中熱伝導デバイス |
| JP5954008B2 (ja) * | 2012-07-16 | 2016-07-20 | 株式会社日本自動車部品総合研究所 | 熱拡散装置 |
| WO2016098890A1 (ja) * | 2014-12-18 | 2016-06-23 | 株式会社カネカ | グラファイト積層体、グラファイト積層体の製造方法、熱輸送用構造物およびロッド状の熱輸送体 |
| CN109863117B (zh) * | 2016-10-19 | 2023-04-18 | 创业发展联盟技术有限公司 | 石墨/石墨烯复合材料、集热体、传热体、散热体及散热系统 |
-
2024
- 2024-07-22 WO PCT/JP2024/026178 patent/WO2025023220A1/ja active Pending
- 2024-07-22 JP JP2025535821A patent/JPWO2025023220A1/ja active Pending
- 2024-07-23 TW TW113127585A patent/TW202527296A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202527296A (zh) | 2025-07-01 |
| WO2025023220A1 (ja) | 2025-01-30 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20260121 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260121 |