TW202527296A - 傳熱構件及電子裝置 - Google Patents

傳熱構件及電子裝置 Download PDF

Info

Publication number
TW202527296A
TW202527296A TW113127585A TW113127585A TW202527296A TW 202527296 A TW202527296 A TW 202527296A TW 113127585 A TW113127585 A TW 113127585A TW 113127585 A TW113127585 A TW 113127585A TW 202527296 A TW202527296 A TW 202527296A
Authority
TW
Taiwan
Prior art keywords
heat transfer
component
heat
protective film
connecting portion
Prior art date
Application number
TW113127585A
Other languages
English (en)
Chinese (zh)
Inventor
北住登
Original Assignee
日商京瓷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商京瓷股份有限公司 filed Critical 日商京瓷股份有限公司
Publication of TW202527296A publication Critical patent/TW202527296A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW113127585A 2023-07-25 2024-07-23 傳熱構件及電子裝置 TW202527296A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023120383 2023-07-25
JP2023-120383 2023-07-25

Publications (1)

Publication Number Publication Date
TW202527296A true TW202527296A (zh) 2025-07-01

Family

ID=94375292

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113127585A TW202527296A (zh) 2023-07-25 2024-07-23 傳熱構件及電子裝置

Country Status (3)

Country Link
JP (1) JPWO2025023220A1 (https=)
TW (1) TW202527296A (https=)
WO (1) WO2025023220A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0700917D0 (en) * 2007-01-17 2007-02-28 Queen Mary & Westfield College Structures with improved properties
JP2012141093A (ja) * 2010-12-28 2012-07-26 Orbital Engineering Inc 中熱伝導デバイス
JP5954008B2 (ja) * 2012-07-16 2016-07-20 株式会社日本自動車部品総合研究所 熱拡散装置
WO2016098890A1 (ja) * 2014-12-18 2016-06-23 株式会社カネカ グラファイト積層体、グラファイト積層体の製造方法、熱輸送用構造物およびロッド状の熱輸送体
CN109863117B (zh) * 2016-10-19 2023-04-18 创业发展联盟技术有限公司 石墨/石墨烯复合材料、集热体、传热体、散热体及散热系统

Also Published As

Publication number Publication date
JPWO2025023220A1 (https=) 2025-01-30
WO2025023220A1 (ja) 2025-01-30

Similar Documents

Publication Publication Date Title
CN103547441B (zh) 高导热性/低热膨胀系数的复合物
JP5612471B2 (ja) 層状熱拡散器およびその製造方法
CN102575914B (zh) 各向异性热传导元件及其制造方法
US20100326645A1 (en) Thermal pyrolytic graphite laminates with vias
JP5384522B2 (ja) ヒートシンク、および楔係止システムを用いたヒートシンク形成方法
US8235094B2 (en) Apparatus for transferring heat in a fin of a heat sink
US7859848B1 (en) Heat spreader and method of making the same
JP2017123379A (ja) 半導体装置
WO2024203810A1 (ja) 伝熱部材及び電子装置
TW200528014A (en) Variable density graphite foam heat sink
JP7231921B2 (ja) 熱伝導構造体、熱拡散装置
JP7248280B2 (ja) 熱伝導構造体、熱拡散装置
TW202527296A (zh) 傳熱構件及電子裝置
JP2018152408A (ja) ヒートスプレッダ
TW202512438A (zh) 散熱構件及電子裝置
JP2025118118A (ja) 伝熱部材および電子装置
JP7442043B2 (ja) 熱伝導シートおよびこれを用いた電子機器
WO2025146813A1 (ja) 伝熱部材および電子装置
JP2025106792A (ja) 伝熱部材および電子装置
WO2026029076A1 (ja) 基板保持装置および基板保持台
JP2005026248A (ja) 電気部品用放熱部材
JPWO2025023225A5 (https=)
TWM332222U (en) Liquid cooling heat-dissipation apparatus and quick disassembly for hard disk