JPWO2025009277A5 - - Google Patents

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Publication number
JPWO2025009277A5
JPWO2025009277A5 JP2025531413A JP2025531413A JPWO2025009277A5 JP WO2025009277 A5 JPWO2025009277 A5 JP WO2025009277A5 JP 2025531413 A JP2025531413 A JP 2025531413A JP 2025531413 A JP2025531413 A JP 2025531413A JP WO2025009277 A5 JPWO2025009277 A5 JP WO2025009277A5
Authority
JP
Japan
Prior art keywords
trench
semiconductor device
contact
sub
portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025531413A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025009277A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/018628 external-priority patent/WO2025009277A1/ja
Publication of JPWO2025009277A1 publication Critical patent/JPWO2025009277A1/ja
Publication of JPWO2025009277A5 publication Critical patent/JPWO2025009277A5/ja
Pending legal-status Critical Current

Links

JP2025531413A 2023-07-06 2024-05-21 Pending JPWO2025009277A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023111372 2023-07-06
PCT/JP2024/018628 WO2025009277A1 (ja) 2023-07-06 2024-05-21 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2025009277A1 JPWO2025009277A1 (https=) 2025-01-09
JPWO2025009277A5 true JPWO2025009277A5 (https=) 2025-11-20

Family

ID=94171805

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025531413A Pending JPWO2025009277A1 (https=) 2023-07-06 2024-05-21

Country Status (4)

Country Link
US (1) US20250318254A1 (https=)
JP (1) JPWO2025009277A1 (https=)
DE (1) DE112024000244T5 (https=)
WO (1) WO2025009277A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5852863B2 (ja) * 2011-11-28 2016-02-03 株式会社日立製作所 ４ｈ−ＳｉＣ半導体素子及び半導体装置
JP6668798B2 (ja) * 2015-07-15 2020-03-18 富士電機株式会社 半導体装置
WO2021010000A1 (ja) * 2019-07-12 2021-01-21 富士電機株式会社 半導体装置
JP7242467B2 (ja) * 2019-08-02 2023-03-20 株式会社東芝 半導体装置、インバータ回路、駆動装置、車両、及び、昇降機
JP7687114B2 (ja) * 2021-07-29 2025-06-03 富士電機株式会社 半導体装置
JP2023082869A (ja) * 2021-12-03 2023-06-15 株式会社デンソー 半導体装置
CN117355946A (zh) * 2021-12-08 2024-01-05 富士电机株式会社 半导体装置以及半导体装置的制造方法

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