JPWO2024257291A5 - - Google Patents

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Publication number
JPWO2024257291A5
JPWO2024257291A5 JP2024534281A JP2024534281A JPWO2024257291A5 JP WO2024257291 A5 JPWO2024257291 A5 JP WO2024257291A5 JP 2024534281 A JP2024534281 A JP 2024534281A JP 2024534281 A JP2024534281 A JP 2024534281A JP WO2024257291 A5 JPWO2024257291 A5 JP WO2024257291A5
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JP
Japan
Prior art keywords
heat sink
flexible sheet
case
semiconductor module
thickness
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JP2024534281A
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English (en)
Japanese (ja)
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JPWO2024257291A1 (https=
JP7551039B1 (ja
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Priority claimed from PCT/JP2023/022188 external-priority patent/WO2024257291A1/ja
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Publication of JP7551039B1 publication Critical patent/JP7551039B1/ja
Publication of JPWO2024257291A1 publication Critical patent/JPWO2024257291A1/ja
Publication of JPWO2024257291A5 publication Critical patent/JPWO2024257291A5/ja
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JP2024534281A 2023-06-15 2023-06-15 半導体モジュールおよび半導体モジュールの製造方法 Active JP7551039B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/022188 WO2024257291A1 (ja) 2023-06-15 2023-06-15 半導体モジュールおよび半導体モジュールの製造方法

Publications (3)

Publication Number Publication Date
JP7551039B1 JP7551039B1 (ja) 2024-09-13
JPWO2024257291A1 JPWO2024257291A1 (https=) 2024-12-19
JPWO2024257291A5 true JPWO2024257291A5 (https=) 2025-05-27

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ID=92676080

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JP2024534281A Active JP7551039B1 (ja) 2023-06-15 2023-06-15 半導体モジュールおよび半導体モジュールの製造方法

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JP (1) JP7551039B1 (https=)
WO (1) WO2024257291A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2026055602A (ja) * 2024-09-18 2026-03-31 株式会社デンソー 電子装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8519532B2 (en) * 2011-09-12 2013-08-27 Infineon Technologies Ag Semiconductor device including cladded base plate
JP2015115417A (ja) * 2013-12-10 2015-06-22 株式会社豊田自動織機 半導体装置および半導体装置の組付方法
JP6768612B2 (ja) * 2017-09-06 2020-10-14 三菱電機株式会社 半導体装置
JP2021022603A (ja) * 2019-07-25 2021-02-18 三菱電機株式会社 半導体装置および半導体装置の製造方法
JP6841367B1 (ja) * 2020-07-14 2021-03-10 富士電機株式会社 半導体モジュール、電力変換装置及び半導体モジュールの製造方法
KR102658452B1 (ko) * 2021-06-09 2024-04-17 주식회사 비엠씨 가열 접착식 적층 코어 제조 장치

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