JPWO2024257291A1 - - Google Patents
Info
- Publication number
- JPWO2024257291A1 JPWO2024257291A1 JP2024534281A JP2024534281A JPWO2024257291A1 JP WO2024257291 A1 JPWO2024257291 A1 JP WO2024257291A1 JP 2024534281 A JP2024534281 A JP 2024534281A JP 2024534281 A JP2024534281 A JP 2024534281A JP WO2024257291 A1 JPWO2024257291 A1 JP WO2024257291A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/022188 WO2024257291A1 (ja) | 2023-06-15 | 2023-06-15 | 半導体モジュールおよび半導体モジュールの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7551039B1 JP7551039B1 (ja) | 2024-09-13 |
| JPWO2024257291A1 true JPWO2024257291A1 (https=) | 2024-12-19 |
| JPWO2024257291A5 JPWO2024257291A5 (https=) | 2025-05-27 |
Family
ID=92676080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024534281A Active JP7551039B1 (ja) | 2023-06-15 | 2023-06-15 | 半導体モジュールおよび半導体モジュールの製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7551039B1 (https=) |
| WO (1) | WO2024257291A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2026055602A (ja) * | 2024-09-18 | 2026-03-31 | 株式会社デンソー | 電子装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8519532B2 (en) * | 2011-09-12 | 2013-08-27 | Infineon Technologies Ag | Semiconductor device including cladded base plate |
| JP2015115417A (ja) * | 2013-12-10 | 2015-06-22 | 株式会社豊田自動織機 | 半導体装置および半導体装置の組付方法 |
| JP6768612B2 (ja) * | 2017-09-06 | 2020-10-14 | 三菱電機株式会社 | 半導体装置 |
| JP2021022603A (ja) * | 2019-07-25 | 2021-02-18 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
| JP6841367B1 (ja) * | 2020-07-14 | 2021-03-10 | 富士電機株式会社 | 半導体モジュール、電力変換装置及び半導体モジュールの製造方法 |
| KR102658452B1 (ko) * | 2021-06-09 | 2024-04-17 | 주식회사 비엠씨 | 가열 접착식 적층 코어 제조 장치 |
-
2023
- 2023-06-15 JP JP2024534281A patent/JP7551039B1/ja active Active
- 2023-06-15 WO PCT/JP2023/022188 patent/WO2024257291A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024257291A1 (ja) | 2024-12-19 |
| JP7551039B1 (ja) | 2024-09-13 |
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