JP7551039B1 - 半導体モジュールおよび半導体モジュールの製造方法 - Google Patents

半導体モジュールおよび半導体モジュールの製造方法 Download PDF

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Publication number
JP7551039B1
JP7551039B1 JP2024534281A JP2024534281A JP7551039B1 JP 7551039 B1 JP7551039 B1 JP 7551039B1 JP 2024534281 A JP2024534281 A JP 2024534281A JP 2024534281 A JP2024534281 A JP 2024534281A JP 7551039 B1 JP7551039 B1 JP 7551039B1
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Prior art keywords
heat sink
flexible sheet
case
semiconductor module
heat dissipation
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JP2024534281A
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Japanese (ja)
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JPWO2024257291A5 (https=
JPWO2024257291A1 (https=
Inventor
厚 山竹
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of JPWO2024257291A1 publication Critical patent/JPWO2024257291A1/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2024534281A 2023-06-15 2023-06-15 半導体モジュールおよび半導体モジュールの製造方法 Active JP7551039B1 (ja)

Applications Claiming Priority (1)

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PCT/JP2023/022188 WO2024257291A1 (ja) 2023-06-15 2023-06-15 半導体モジュールおよび半導体モジュールの製造方法

Publications (3)

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JP7551039B1 true JP7551039B1 (ja) 2024-09-13
JPWO2024257291A1 JPWO2024257291A1 (https=) 2024-12-19
JPWO2024257291A5 JPWO2024257291A5 (https=) 2025-05-27

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JP (1) JP7551039B1 (https=)
WO (1) WO2024257291A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026063126A1 (ja) * 2024-09-18 2026-03-26 株式会社デンソー 電子装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013062506A (ja) * 2011-09-12 2013-04-04 Infineon Technologies Ag クラッド型ベースプレートを含む半導体装置
JP2021022603A (ja) * 2019-07-25 2021-02-18 三菱電機株式会社 半導体装置および半導体装置の製造方法
JP2022018033A (ja) * 2020-07-14 2022-01-26 富士電機株式会社 半導体モジュール、電力変換装置及び半導体モジュールの製造方法
WO2022260225A1 (en) * 2021-06-09 2022-12-15 Bmc Co., Ltd. Apparatus for manufacturing laminated core with heating adhesion

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015115417A (ja) * 2013-12-10 2015-06-22 株式会社豊田自動織機 半導体装置および半導体装置の組付方法
JP6768612B2 (ja) * 2017-09-06 2020-10-14 三菱電機株式会社 半導体装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013062506A (ja) * 2011-09-12 2013-04-04 Infineon Technologies Ag クラッド型ベースプレートを含む半導体装置
JP2021022603A (ja) * 2019-07-25 2021-02-18 三菱電機株式会社 半導体装置および半導体装置の製造方法
JP2022018033A (ja) * 2020-07-14 2022-01-26 富士電機株式会社 半導体モジュール、電力変換装置及び半導体モジュールの製造方法
WO2022260225A1 (en) * 2021-06-09 2022-12-15 Bmc Co., Ltd. Apparatus for manufacturing laminated core with heating adhesion
JP2024519226A (ja) * 2021-06-09 2024-05-09 ビーエムシー株式会社 加熱接着式積層コア製造装置及び製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026063126A1 (ja) * 2024-09-18 2026-03-26 株式会社デンソー 電子装置

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WO2024257291A1 (ja) 2024-12-19
JPWO2024257291A1 (https=) 2024-12-19

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