JPWO2024248020A5 - - Google Patents

Info

Publication number
JPWO2024248020A5
JPWO2024248020A5 JP2025524122A JP2025524122A JPWO2024248020A5 JP WO2024248020 A5 JPWO2024248020 A5 JP WO2024248020A5 JP 2025524122 A JP2025524122 A JP 2025524122A JP 2025524122 A JP2025524122 A JP 2025524122A JP WO2024248020 A5 JPWO2024248020 A5 JP WO2024248020A5
Authority
JP
Japan
Prior art keywords
electrode
wiring
covers
electronic component
component according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025524122A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024248020A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/019655 external-priority patent/WO2024248020A1/ja
Publication of JPWO2024248020A1 publication Critical patent/JPWO2024248020A1/ja
Publication of JPWO2024248020A5 publication Critical patent/JPWO2024248020A5/ja
Pending legal-status Critical Current

Links

JP2025524122A 2023-06-02 2024-05-29 Pending JPWO2024248020A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023091948 2023-06-02
PCT/JP2024/019655 WO2024248020A1 (ja) 2023-06-02 2024-05-29 電子部品

Publications (2)

Publication Number Publication Date
JPWO2024248020A1 JPWO2024248020A1 (https=) 2024-12-05
JPWO2024248020A5 true JPWO2024248020A5 (https=) 2026-03-04

Family

ID=93658092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025524122A Pending JPWO2024248020A1 (https=) 2023-06-02 2024-05-29

Country Status (5)

Country Link
US (1) US20260090013A1 (https=)
JP (1) JPWO2024248020A1 (https=)
CN (1) CN121241431A (https=)
DE (1) DE112024002407T5 (https=)
WO (1) WO2024248020A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6846687B2 (ja) 2017-09-12 2021-03-24 パナソニックIpマネジメント株式会社 半導体装置およびその製造方法
DE212020000212U1 (de) * 2019-04-19 2020-10-20 Rohm Co. Ltd. SiC-Halbleiterbauteil
WO2021261102A1 (ja) * 2020-06-26 2021-12-30 ローム株式会社 電子部品
JP7661189B2 (ja) * 2021-09-17 2025-04-14 株式会社東芝 半導体装置
JP7280938B1 (ja) 2021-12-21 2023-05-24 楽天グループ株式会社 情報処理装置、コンテンツ提供方法、及びプログラム

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