JPWO2024214628A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2024214628A5
JPWO2024214628A5 JP2025513925A JP2025513925A JPWO2024214628A5 JP WO2024214628 A5 JPWO2024214628 A5 JP WO2024214628A5 JP 2025513925 A JP2025513925 A JP 2025513925A JP 2025513925 A JP2025513925 A JP 2025513925A JP WO2024214628 A5 JPWO2024214628 A5 JP WO2024214628A5
Authority
JP
Japan
Prior art keywords
type
semiconductor device
heat sink
dissipation fins
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025513925A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024214628A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/013915 external-priority patent/WO2024214628A1/ja
Publication of JPWO2024214628A1 publication Critical patent/JPWO2024214628A1/ja
Publication of JPWO2024214628A5 publication Critical patent/JPWO2024214628A5/ja
Pending legal-status Critical Current

Links

JP2025513925A 2023-04-11 2024-04-04 Pending JPWO2024214628A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023064211 2023-04-11
PCT/JP2024/013915 WO2024214628A1 (ja) 2023-04-11 2024-04-04 半導体装置及びその製造方法並びに電力変換装置

Publications (2)

Publication Number Publication Date
JPWO2024214628A1 JPWO2024214628A1 (https=) 2024-10-17
JPWO2024214628A5 true JPWO2024214628A5 (https=) 2025-06-23

Family

ID=93059247

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025513925A Pending JPWO2024214628A1 (https=) 2023-04-11 2024-04-04

Country Status (3)

Country Link
JP (1) JPWO2024214628A1 (https=)
CN (1) CN120981919A (https=)
WO (1) WO2024214628A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6112246U (ja) * 1984-06-27 1986-01-24 株式会社日立製作所 冷却構造
JP2000223872A (ja) * 1998-03-18 2000-08-11 Hitachi Ltd 電子機器装置、その冷却構造及び配置方法
JP2000091776A (ja) * 1998-09-09 2000-03-31 Hitachi Ltd 電子機器用放熱フィン
JP2005150132A (ja) * 2003-11-11 2005-06-09 Toshiba Corp 半導体冷却装置
JP5481961B2 (ja) * 2009-06-24 2014-04-23 トヨタ自動車株式会社 半導体装置
JP5089662B2 (ja) * 2009-08-04 2012-12-05 三菱電機株式会社 半導体モジュール
JP6336364B2 (ja) * 2014-09-12 2018-06-06 株式会社ティラド ヒートシンク
CN116762170A (zh) * 2021-01-22 2023-09-15 三菱电机株式会社 功率半导体装置及其制造方法以及电力转换装置

Similar Documents

Publication Publication Date Title
JP5007296B2 (ja) パワーモジュール用ベース
US6219236B1 (en) Cooling system for multichip module
US6883592B2 (en) Heatsink for electronic component
US8081465B2 (en) Cooling apparatus for semiconductor chips
US7695161B2 (en) Heat dissipation device for light emitting diode module
US7040388B1 (en) Heat sink, method of manufacturing the same and cooling apparatus using the same
JP6595531B2 (ja) ヒートシンクアッセンブリ
US6014314A (en) Package structure of a multi-chip module
JP2001244391A (ja) マルチチップモジュールの冷却構造
US20260113911A1 (en) Power semiconductor device
WO2022206568A1 (zh) 热电制冷模组、散热组件、芯片封装结构及电子设备
US20210063090A1 (en) Inverter And Heat Dissipation Device Thereof
JPWO2024214628A5 (https=)
JP7258269B1 (ja) 電力半導体装置および電力半導体装置の製造方法
JP5640616B2 (ja) 電子部品の放熱構造
JP2012256750A (ja) 発熱部品の固定方法、及び発熱部品の固定構造
US20220192048A1 (en) Radiator and electrical device
JP2006140390A (ja) パワー半導体装置
JPH01270298A (ja) 半導体素子の冷却構造
US9449894B2 (en) Base with heat absorber and heat dissipating module having the base
JP2005085998A (ja) 電子部品の冷却装置
JP2008124187A (ja) パワーモジュール用ベース
KR102804243B1 (ko) 방열 성능이 개선된 카드락 리테이너
KR102385112B1 (ko) 전력반도체소자의 fr4 pcb 방열 구조
CN100517660C (zh) 散热装置