CN120981919A - 半导体装置及其制造方法以及电力转换装置 - Google Patents

半导体装置及其制造方法以及电力转换装置

Info

Publication number
CN120981919A
CN120981919A CN202480023393.XA CN202480023393A CN120981919A CN 120981919 A CN120981919 A CN 120981919A CN 202480023393 A CN202480023393 A CN 202480023393A CN 120981919 A CN120981919 A CN 120981919A
Authority
CN
China
Prior art keywords
type
heat dissipation
dissipation fins
heat sink
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480023393.XA
Other languages
English (en)
Chinese (zh)
Inventor
三田泰之
多田晴菜
滨田刚
寺田隼人
森贞达志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN120981919A publication Critical patent/CN120981919A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN202480023393.XA 2023-04-11 2024-04-04 半导体装置及其制造方法以及电力转换装置 Pending CN120981919A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023064211 2023-04-11
JP2023-064211 2023-04-11
PCT/JP2024/013915 WO2024214628A1 (ja) 2023-04-11 2024-04-04 半導体装置及びその製造方法並びに電力変換装置

Publications (1)

Publication Number Publication Date
CN120981919A true CN120981919A (zh) 2025-11-18

Family

ID=93059247

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480023393.XA Pending CN120981919A (zh) 2023-04-11 2024-04-04 半导体装置及其制造方法以及电力转换装置

Country Status (3)

Country Link
JP (1) JPWO2024214628A1 (https=)
CN (1) CN120981919A (https=)
WO (1) WO2024214628A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6112246U (ja) * 1984-06-27 1986-01-24 株式会社日立製作所 冷却構造
JP2000223872A (ja) * 1998-03-18 2000-08-11 Hitachi Ltd 電子機器装置、その冷却構造及び配置方法
JP2000091776A (ja) * 1998-09-09 2000-03-31 Hitachi Ltd 電子機器用放熱フィン
JP2005150132A (ja) * 2003-11-11 2005-06-09 Toshiba Corp 半導体冷却装置
JP5481961B2 (ja) * 2009-06-24 2014-04-23 トヨタ自動車株式会社 半導体装置
JP5089662B2 (ja) * 2009-08-04 2012-12-05 三菱電機株式会社 半導体モジュール
JP6336364B2 (ja) * 2014-09-12 2018-06-06 株式会社ティラド ヒートシンク
CN116762170A (zh) * 2021-01-22 2023-09-15 三菱电机株式会社 功率半导体装置及其制造方法以及电力转换装置

Also Published As

Publication number Publication date
JPWO2024214628A1 (https=) 2024-10-17
WO2024214628A1 (ja) 2024-10-17

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