JPWO2024214628A1 - - Google Patents
Info
- Publication number
- JPWO2024214628A1 JPWO2024214628A1 JP2025513925A JP2025513925A JPWO2024214628A1 JP WO2024214628 A1 JPWO2024214628 A1 JP WO2024214628A1 JP 2025513925 A JP2025513925 A JP 2025513925A JP 2025513925 A JP2025513925 A JP 2025513925A JP WO2024214628 A1 JPWO2024214628 A1 JP WO2024214628A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023064211 | 2023-04-11 | ||
| PCT/JP2024/013915 WO2024214628A1 (ja) | 2023-04-11 | 2024-04-04 | 半導体装置及びその製造方法並びに電力変換装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024214628A1 true JPWO2024214628A1 (https=) | 2024-10-17 |
| JPWO2024214628A5 JPWO2024214628A5 (https=) | 2025-06-23 |
Family
ID=93059247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025513925A Pending JPWO2024214628A1 (https=) | 2023-04-11 | 2024-04-04 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024214628A1 (https=) |
| CN (1) | CN120981919A (https=) |
| WO (1) | WO2024214628A1 (https=) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6112246U (ja) * | 1984-06-27 | 1986-01-24 | 株式会社日立製作所 | 冷却構造 |
| JP2000091776A (ja) * | 1998-09-09 | 2000-03-31 | Hitachi Ltd | 電子機器用放熱フィン |
| JP2000223872A (ja) * | 1998-03-18 | 2000-08-11 | Hitachi Ltd | 電子機器装置、その冷却構造及び配置方法 |
| JP2005150132A (ja) * | 2003-11-11 | 2005-06-09 | Toshiba Corp | 半導体冷却装置 |
| JP2011009367A (ja) * | 2009-06-24 | 2011-01-13 | Toyota Motor Corp | 半導体装置 |
| JP2011035267A (ja) * | 2009-08-04 | 2011-02-17 | Mitsubishi Electric Corp | 半導体モジュール |
| JP2016062919A (ja) * | 2014-09-12 | 2016-04-25 | 株式会社ティラド | ヒートシンク |
| WO2022158392A1 (ja) * | 2021-01-22 | 2022-07-28 | 三菱電機株式会社 | パワー半導体装置およびその製造方法ならびに電力変換装置 |
-
2024
- 2024-04-04 CN CN202480023393.XA patent/CN120981919A/zh active Pending
- 2024-04-04 JP JP2025513925A patent/JPWO2024214628A1/ja active Pending
- 2024-04-04 WO PCT/JP2024/013915 patent/WO2024214628A1/ja not_active Ceased
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6112246U (ja) * | 1984-06-27 | 1986-01-24 | 株式会社日立製作所 | 冷却構造 |
| JP2000223872A (ja) * | 1998-03-18 | 2000-08-11 | Hitachi Ltd | 電子機器装置、その冷却構造及び配置方法 |
| JP2000091776A (ja) * | 1998-09-09 | 2000-03-31 | Hitachi Ltd | 電子機器用放熱フィン |
| JP2005150132A (ja) * | 2003-11-11 | 2005-06-09 | Toshiba Corp | 半導体冷却装置 |
| JP2011009367A (ja) * | 2009-06-24 | 2011-01-13 | Toyota Motor Corp | 半導体装置 |
| JP2011035267A (ja) * | 2009-08-04 | 2011-02-17 | Mitsubishi Electric Corp | 半導体モジュール |
| JP2016062919A (ja) * | 2014-09-12 | 2016-04-25 | 株式会社ティラド | ヒートシンク |
| WO2022158392A1 (ja) * | 2021-01-22 | 2022-07-28 | 三菱電機株式会社 | パワー半導体装置およびその製造方法ならびに電力変換装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024214628A1 (ja) | 2024-10-17 |
| CN120981919A (zh) | 2025-11-18 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250408 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250408 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20260331 |