JPWO2024203720A5 - - Google Patents

Info

Publication number
JPWO2024203720A5
JPWO2024203720A5 JP2025510644A JP2025510644A JPWO2024203720A5 JP WO2024203720 A5 JPWO2024203720 A5 JP WO2024203720A5 JP 2025510644 A JP2025510644 A JP 2025510644A JP 2025510644 A JP2025510644 A JP 2025510644A JP WO2024203720 A5 JPWO2024203720 A5 JP WO2024203720A5
Authority
JP
Japan
Prior art keywords
conductor
wiring board
board according
metal body
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025510644A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024203720A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/011014 external-priority patent/WO2024203720A1/ja
Publication of JPWO2024203720A1 publication Critical patent/JPWO2024203720A1/ja
Publication of JPWO2024203720A5 publication Critical patent/JPWO2024203720A5/ja
Pending legal-status Critical Current

Links

JP2025510644A 2023-03-24 2024-03-21 Pending JPWO2024203720A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023048831 2023-03-24
PCT/JP2024/011014 WO2024203720A1 (ja) 2023-03-24 2024-03-21 配線基板

Publications (2)

Publication Number Publication Date
JPWO2024203720A1 JPWO2024203720A1 (https=) 2024-10-03
JPWO2024203720A5 true JPWO2024203720A5 (https=) 2025-12-04

Family

ID=92906095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025510644A Pending JPWO2024203720A1 (https=) 2023-03-24 2024-03-21

Country Status (3)

Country Link
JP (1) JPWO2024203720A1 (https=)
CN (1) CN120883732A (https=)
WO (1) WO2024203720A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6332190B2 (ja) * 2015-07-31 2018-05-30 株式会社村田製作所 セラミック配線基板、電子回路モジュールおよび電子回路モジュールの製造方法
JP6669248B2 (ja) * 2016-03-31 2020-03-18 株式会社村田製作所 回路モジュール
JP5988004B1 (ja) * 2016-04-12 2016-09-07 Tdk株式会社 電子回路パッケージ
US11887863B2 (en) * 2021-09-07 2024-01-30 STATS ChipPAC Pte. Ltd. Double-sided partial molded SIP module

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