JPWO2022230883A5 - - Google Patents

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Publication number
JPWO2022230883A5
JPWO2022230883A5 JP2023517559A JP2023517559A JPWO2022230883A5 JP WO2022230883 A5 JPWO2022230883 A5 JP WO2022230883A5 JP 2023517559 A JP2023517559 A JP 2023517559A JP 2023517559 A JP2023517559 A JP 2023517559A JP WO2022230883 A5 JPWO2022230883 A5 JP WO2022230883A5
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JP
Japan
Prior art keywords
conductor
interlayer
semiconductor package
package according
wiring
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JP2023517559A
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English (en)
Japanese (ja)
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JPWO2022230883A1 (https=
JP7634657B2 (ja
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Priority claimed from PCT/JP2022/018904 external-priority patent/WO2022230883A1/ja
Publication of JPWO2022230883A1 publication Critical patent/JPWO2022230883A1/ja
Publication of JPWO2022230883A5 publication Critical patent/JPWO2022230883A5/ja
Application granted granted Critical
Publication of JP7634657B2 publication Critical patent/JP7634657B2/ja
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JP2023517559A 2021-04-27 2022-04-26 半導体パッケージ及び半導体電子装置 Active JP7634657B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021075421 2021-04-27
JP2021075421 2021-04-27
PCT/JP2022/018904 WO2022230883A1 (ja) 2021-04-27 2022-04-26 半導体パッケージ及び半導体電子装置

Publications (3)

Publication Number Publication Date
JPWO2022230883A1 JPWO2022230883A1 (https=) 2022-11-03
JPWO2022230883A5 true JPWO2022230883A5 (https=) 2024-02-02
JP7634657B2 JP7634657B2 (ja) 2025-02-21

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ID=83848176

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023517559A Active JP7634657B2 (ja) 2021-04-27 2022-04-26 半導体パッケージ及び半導体電子装置

Country Status (4)

Country Link
US (1) US20250079284A1 (https=)
JP (1) JP7634657B2 (https=)
CN (1) CN117203755A (https=)
WO (1) WO2022230883A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025070079A1 (ja) * 2023-09-29 2025-04-03 京セラ株式会社 配線基板および電子モジュール

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4480598B2 (ja) * 2004-02-26 2010-06-16 京セラ株式会社 電子部品収納用パッケージおよび電子装置
JP4874177B2 (ja) * 2007-06-28 2012-02-15 京セラ株式会社 接続端子及びこれを用いたパッケージ並びに電子装置
WO2009057691A1 (ja) 2007-10-30 2009-05-07 Kyocera Corporation 接続端子及びこれを用いたパッケージ並びに電子装置
US9603274B2 (en) 2012-10-30 2017-03-21 Kyocera Corporation Container for housing electronic component and electronic device

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