JPWO2024203720A1 - - Google Patents

Info

Publication number
JPWO2024203720A1
JPWO2024203720A1 JP2025510644A JP2025510644A JPWO2024203720A1 JP WO2024203720 A1 JPWO2024203720 A1 JP WO2024203720A1 JP 2025510644 A JP2025510644 A JP 2025510644A JP 2025510644 A JP2025510644 A JP 2025510644A JP WO2024203720 A1 JPWO2024203720 A1 JP WO2024203720A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025510644A
Other languages
Japanese (ja)
Other versions
JPWO2024203720A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024203720A1 publication Critical patent/JPWO2024203720A1/ja
Publication of JPWO2024203720A5 publication Critical patent/JPWO2024203720A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
JP2025510644A 2023-03-24 2024-03-21 Pending JPWO2024203720A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023048831 2023-03-24
PCT/JP2024/011014 WO2024203720A1 (ja) 2023-03-24 2024-03-21 配線基板

Publications (2)

Publication Number Publication Date
JPWO2024203720A1 true JPWO2024203720A1 (https=) 2024-10-03
JPWO2024203720A5 JPWO2024203720A5 (https=) 2025-12-04

Family

ID=92906095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025510644A Pending JPWO2024203720A1 (https=) 2023-03-24 2024-03-21

Country Status (3)

Country Link
JP (1) JPWO2024203720A1 (https=)
CN (1) CN120883732A (https=)
WO (1) WO2024203720A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6332190B2 (ja) * 2015-07-31 2018-05-30 株式会社村田製作所 セラミック配線基板、電子回路モジュールおよび電子回路モジュールの製造方法
JP6669248B2 (ja) * 2016-03-31 2020-03-18 株式会社村田製作所 回路モジュール
JP5988004B1 (ja) * 2016-04-12 2016-09-07 Tdk株式会社 電子回路パッケージ
US11887863B2 (en) * 2021-09-07 2024-01-30 STATS ChipPAC Pte. Ltd. Double-sided partial molded SIP module

Also Published As

Publication number Publication date
WO2024203720A1 (ja) 2024-10-03
CN120883732A (zh) 2025-10-31

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250916

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20250916