CN120883732A - 配线基板 - Google Patents

配线基板

Info

Publication number
CN120883732A
CN120883732A CN202480019577.9A CN202480019577A CN120883732A CN 120883732 A CN120883732 A CN 120883732A CN 202480019577 A CN202480019577 A CN 202480019577A CN 120883732 A CN120883732 A CN 120883732A
Authority
CN
China
Prior art keywords
conductor
substrate
wiring
metal body
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480019577.9A
Other languages
English (en)
Chinese (zh)
Inventor
川濑顺平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN120883732A publication Critical patent/CN120883732A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
CN202480019577.9A 2023-03-24 2024-03-21 配线基板 Pending CN120883732A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023-048831 2023-03-24
JP2023048831 2023-03-24
PCT/JP2024/011014 WO2024203720A1 (ja) 2023-03-24 2024-03-21 配線基板

Publications (1)

Publication Number Publication Date
CN120883732A true CN120883732A (zh) 2025-10-31

Family

ID=92906095

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480019577.9A Pending CN120883732A (zh) 2023-03-24 2024-03-21 配线基板

Country Status (3)

Country Link
JP (1) JPWO2024203720A1 (https=)
CN (1) CN120883732A (https=)
WO (1) WO2024203720A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6332190B2 (ja) * 2015-07-31 2018-05-30 株式会社村田製作所 セラミック配線基板、電子回路モジュールおよび電子回路モジュールの製造方法
JP6669248B2 (ja) * 2016-03-31 2020-03-18 株式会社村田製作所 回路モジュール
JP5988004B1 (ja) * 2016-04-12 2016-09-07 Tdk株式会社 電子回路パッケージ
US11887863B2 (en) * 2021-09-07 2024-01-30 STATS ChipPAC Pte. Ltd. Double-sided partial molded SIP module

Also Published As

Publication number Publication date
WO2024203720A1 (ja) 2024-10-03
JPWO2024203720A1 (https=) 2024-10-03

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