JPWO2024219286A5 - - Google Patents
Info
- Publication number
- JPWO2024219286A5 JPWO2024219286A5 JP2025515178A JP2025515178A JPWO2024219286A5 JP WO2024219286 A5 JPWO2024219286 A5 JP WO2024219286A5 JP 2025515178 A JP2025515178 A JP 2025515178A JP 2025515178 A JP2025515178 A JP 2025515178A JP WO2024219286 A5 JPWO2024219286 A5 JP WO2024219286A5
- Authority
- JP
- Japan
- Prior art keywords
- conductor layer
- resin multilayer
- corners
- conductor
- stacking direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023069293 | 2023-04-20 | ||
| JP2023069293 | 2023-04-20 | ||
| PCT/JP2024/014345 WO2024219286A1 (ja) | 2023-04-20 | 2024-04-09 | 樹脂多層基板及び回路モジュール |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024219286A1 JPWO2024219286A1 (https=) | 2024-10-24 |
| JPWO2024219286A5 true JPWO2024219286A5 (https=) | 2025-11-04 |
| JP7798237B2 JP7798237B2 (ja) | 2026-01-14 |
Family
ID=93152370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025515178A Active JP7798237B2 (ja) | 2023-04-20 | 2024-04-09 | 樹脂多層基板及び回路モジュール |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20260032818A1 (https=) |
| JP (1) | JP7798237B2 (https=) |
| CN (1) | CN120982217A (https=) |
| DE (1) | DE112024001581T5 (https=) |
| WO (1) | WO2024219286A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008085098A (ja) | 2006-09-28 | 2008-04-10 | Kyocera Corp | 配線基板および電子装置 |
| JP2015119073A (ja) | 2013-12-19 | 2015-06-25 | 日本シイエムケイ株式会社 | 多層プリント配線板および、その製造方法 |
| WO2018079198A1 (ja) | 2016-10-28 | 2018-05-03 | 株式会社村田製作所 | 樹脂回路基板 |
| KR102483613B1 (ko) | 2017-10-20 | 2023-01-02 | 삼성전기주식회사 | 인쇄회로기판 |
| KR102442387B1 (ko) | 2017-10-20 | 2022-09-14 | 삼성전기주식회사 | 인쇄회로기판 |
| WO2022202322A1 (ja) | 2021-03-26 | 2022-09-29 | 株式会社村田製作所 | 配線基板、積層基板及び配線基板の製造方法 |
| JP2022150717A (ja) | 2021-03-26 | 2022-10-07 | 株式会社村田製作所 | 配線基板、積層基板及び配線基板の製造方法 |
-
2024
- 2024-04-09 DE DE112024001581.6T patent/DE112024001581T5/de active Pending
- 2024-04-09 JP JP2025515178A patent/JP7798237B2/ja active Active
- 2024-04-09 CN CN202480026901.XA patent/CN120982217A/zh active Pending
- 2024-04-09 WO PCT/JP2024/014345 patent/WO2024219286A1/ja not_active Ceased
-
2025
- 2025-09-29 US US19/343,274 patent/US20260032818A1/en active Pending
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